Abstract: A microphone unit includes: a case having an interior space; a unidirectional microphone held in the interior space of the case; a first opening provided in the case; and a second opening provided in the case, wherein the first opening and the second opening are arranged opposite to each other across the microphone and are arranged in a straight line parallel to an axis of sensitivity of the microphone.

Abstract: A microphone unit includes: a case having an interior space; a unidirectional microphone held in the interior space of the case; a first opening provided in the case; and a second opening provided in the case, wherein the first opening and the second opening are arranged opposite to each other across the microphone and are arranged in a straight line parallel to an axis of sensitivity of the microphone.

Abstract: A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an n-type are alternately arranged, so that the thermoelectric elements are connected in series or in parallel together with the electrodes. Herein, one substrate is a heat absorption side, and other substrate is a heat radiation side. In addition, a current density in a current transmission area of the heat-absorption-side electrode is set to 50 A/mm2 or less, and a height of the thermoelectric element is set to 0.7 mm or less. Furthermore, a temperature-controlled semiconductor module can be realized by combining a thermoelectric module with a semiconductor component such as a semiconductor laser.

Abstract: A thermoelectric module is constituted by a pair of substrates having electrodes, which are arranged opposite to each other with a prescribed space therebetween, in which a prescribed number of thermoelectric elements are arranged in such a way that a p-type and an n-type are alternately arranged, so that the thermoelectric elements are connected in series or in parallel together with the electrodes. Herein, one substrate is a heat absorption side, and other substrate is a heat radiation side. In addition, a current density in a current transmission area of the heat-absorption-side electrode is set to 50 A/mm2 or less, and a height of the thermoelectric element is set to 0.7 mm or less. Furthermore, a temperature-controlled semiconductor module can be realized by combining a thermoelectric module with a semiconductor component such as a semiconductor laser.