Patents by Inventor Fumiyuki Yamatsuka

Fumiyuki Yamatsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of mounting electronic part, circuit substrate, and image forming apparatus
    Patent number: 10492304
    Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.
    Type: Grant
    Filed: February 3, 2017
    Date of Patent: November 26, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masayuki Sakai, Takahiro Yoneyama, Fumiyuki Yamatsuka
  • METHOD OF MOUNTING ELECTRONIC PART, CIRCUIT SUBSTRATE, AND IMAGE FORMING APPARATUS
    Publication number: 20170150614
    Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.
    Type: Application
    Filed: February 3, 2017
    Publication date: May 25, 2017
    Inventors: Masayuki Sakai, Takahiro Yoneyama, Fumiyuki Yamatsuka
  • Method of mounting electronic part, circuit substrate, and image forming apparatus
    Patent number: 9599944
    Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.
    Type: Grant
    Filed: April 23, 2014
    Date of Patent: March 21, 2017
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Masayuki Sakai, Takahiro Yoneyama, Fumiyuki Yamatsuka
  • Circuit board and image forming apparatus
    Patent number: 9307634
    Abstract: The circuit board includes a contact for supplying power, in which the contact includes plural copper foil patterns each having a predetermined width, the plural copper foil patterns being formed radially from a center of the contact and connected to each other at the center of the contact. Accordingly, it is possible to enhance contact reliability of the contact while suppressing cost for connecting a high-voltage board to an image forming unit.
    Type: Grant
    Filed: May 15, 2013
    Date of Patent: April 5, 2016
    Assignee: CANON KABUSHIKI KAISHA
    Inventors: Norikazu Sugiyama, Takahiro Yoneyama, Fumiyuki Yamatsuka, Osamu Mukataka, Kumiko Omori
  • METHOD OF MOUNTING ELECTRONIC PART, CIRCUIT SUBSTRATE, AND IMAGE FORMING APPARATUS
    Publication number: 20140319200
    Abstract: The circuit substrate includes at least two lands formed on a substrate, wherein one electrode is to be mounted on the at least two lands, an electronic part having electrodes, one of the electrodes is soldered on the at least two lands with solders whose amounts are adjusted by a metal mask having at least two opening parts, positions of the at least two opening parts corresponding to the at least two lands when the solders are applied and melted, areas of the at least two opening parts being different with each other, wherein a height of one of the solders is different from a height of the other of the solders according to the difference of the areas of the at least two opening parts of the metal mask, whereby the electronic part is mounted on the circuit substrate in an inclined state.
    Type: Application
    Filed: April 23, 2014
    Publication date: October 30, 2014
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Masayuki Sakai, Takahiro Yoneyama, Fumiyuki Yamatsuka
  • CIRCUIT BOARD AND IMAGE FORMING APPARATUS
    Publication number: 20130322913
    Abstract: The circuit board includes a contact for supplying power, in which the contact includes plural copper foil patterns each having a predetermined width, the plural copper foil patterns being formed radially from a center of the contact and connected to each other at the center of the contact. Accordingly, it is possible to enhance contact reliability of the contact while suppressing cost for connecting a high-voltage board to an image forming unit.
    Type: Application
    Filed: May 15, 2013
    Publication date: December 5, 2013
    Applicant: CANON KABUSHIKI KAISHA
    Inventors: Norikazu Sugiyama, Takahiro Yoneyama, Fumiyuki Yamatsuka, Osamu Mukataka, Kumiko Omori