Abstract: The present invention provides an OLED display motherboard, a packaging method thereof and a packaging system, belongs to the field of organic light-emitting display technology, and can solve the problem of poor sealing performance in the existing OLED display motherboard. The OLED display motherboard of the present invention comprises a package cover plate and an OLED substrate, which are assembled with each other in an aligned manner, a sealant is provided between the package cover plate and the OLED substrate, and the sealant is disposed in a peripheral region of the OLED display motherboard, and includes a hot melt adhesive.

Abstract: An embodiment of the present disclosure discloses an evaporation method, including: providing a flexible substrate having an original size; stretching the flexible substrate to have an evaporation size, wherein, the evaporation size is greater than the original size; arranging a mask on a side of the flexible substrate having the evaporation size; evaporating a material onto the flexible substrate having the evaporation size by using the mask, to form a patterned film layer.