Abstract: A plurality of plate-like circuit component carrier packages having the same size and shape are stacked adjacent one to another with the flat faces thereof in contact to form a carrier package assembly in the form of a prismatic or cylindrically solid. Each carrier package houses one or more electrical circuit components and is provided at portions of the flat faces thereof with electrical contacts which cooperate with similarly located contacts on the flat faces of adjacent carrier packages to electrically interconnect the circuit components. The electrical contacts may take the form of a cooperating system of pins and apertures, serving also to align adjacent carrier packages. The carrier package assembly is useable in cooperation with a flexible, printed circuit board having on one side thereof an array of contact sites selectively interconnected by printed routing traces.