Abstract: This housing comprises rackable electronic equipment modules (2) housed in a bay. A module (2) has both internal (12, 13) and external (45) thermal radiators cooled by natural and forced ventilation. The internal thermal radiators (12, 13) are placed in thermal contact with the hot spots of the electronic equipment placed in the module (2) via hear collectors (40, 41) connected by heat pipe (42, 43) to the external thermal radiators (45) arranged outside on the edge (44) of the module (2). The internal thermal radiators (12, 13) are sized to be sufficient to cool the electric equipment when the forced ventilation is functioning normally. The external thermal radiators (45) are sized to complement the cooling provided by the internal radiators (12, 13) should the forced ventilation be lost.

Abstract: The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ?P of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.

Abstract: The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).

Abstract: The present invention relates to an electronic equipment rack arrangement principle. In order to allow for the maximum use of COTS (component off the shelf) modules, or, at least, maximum use of “standardized” modules, primarily in relation to the electronic functions of said rack, the electronic equipment rack according to the invention offers a configuration in which the function modules (3) and the interface modules (8) are juxtaposed, preferably vertically, and the electronic functions handled by the function modules (3) are decoupled from the interface functions handled by the interface modules (8). Such a rack also allows for all the maintenance operations to be done through the front panel (F) of said rack, all of its component modules being made accessible from this side.

Abstract: The present invention belongs to the field of reduced-dimension computers of the ARINC 600 computer type of small and medium dimensions. The advantage of the invention is that it allows optimization of use of the volume of the computers. The surface area for accommodating electronic components on one board is greatly increased and the heat control is made easier and better.

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components.

Abstract: The present invention proposes an onboard computer equipped with a stand-alone aeraulic cooling device. Its main benefit is that it improves the effectiveness of the aeraulic cooling of onboard computers, thanks to the provision of ducts (N1, N2, N3) routing a cool air stream (FA) to the hot spots of the electronic modules (E1, E2, E3, E4).

Abstract: This rack (1) houses rackable electronic gear modules (2, 3) and has cooling by natural convection thanks to ventilation orifices (20, 21) provided in its bottom (10) and top (11) walls and forced air cooling thanks to internal air distribution ramps (30) fed with air under pressure through the intermediary of a distribution box (31) connected to a forced air circulation duct (37). The use of internal distribution ramps for the forced air makes it possible to produce a pulsed air circulation providing only a slight obstacle to the air circulation obtained by natural convection. Compared to usual configurations, this makes it possible to lower the operating temperature reached by the equipment in the event of loss of the forced ventilation.

Abstract: This housing comprises rackable electronic equipment modules (2) housed in a bay. A module (2) has both internal (12, 13) and external (45) thermal radiators cooled by natural and forced ventilation. The internal thermal radiators (12, 13) are placed in thermal contact with the hot spots of the electronic equipment placed in the module (2) via hear collectors (40, 41) connected by heat pipe (42, 43) to the external thermal radiators (45) arranged outside on the edge (44) of the module (2). The internal thermal radiators (12, 13) are sized to be sufficient to cool the electric equipment when the forced ventilation is functioning normally. The external thermal radiators (45) are sized to complement the cooling provided by the internal radiators (12, 13) should the forced ventilation be lost.

Abstract: The present invention relates to an electronic device module into which at least one printed circuit card is plugged. The electronic device module (1) comprises a first connector (4) mounted on one face (3) of the module (1), the first connector (4) being provided with electrical contacts each having an end (6) internal to the module and an end (5) external to the module, the external ends (5) being designed to be plugged into a rack, the internal ends (6) being designed to be soldered, wire-wrapped or crimped, the module (1) furthermore including at least one plugged-in printed circuit card (7, 9; 18, 19), the printed circuit card (7, 9; 18, 19) being electrically connected to the internal ends (6). According to the invention, the electronic device module (1) includes a second connector (8, 10; 20, 21) that is rigidly fastened to the printed circuit card (7, 9; 18, 19) and is plugged into the internal ends (6).

Abstract: The present invention belongs to the field of reduced-dimension computers of the ARINC 600 computer type of small and medium dimensions. The advantage of the invention is that it allows optimization of use of the volume of the computers. The surface area for accommodating electronic components on one board is greatly increased and the heat control is made easier and better.

Abstract: The invention relates to an electronic device operating in difficult environments. The electronic device comprises at least one printed circuit board supporting heat-dissipating electronic components, a heat sink, a first side of which is in contact with electronic components on a first side of the printed circuit board, and a second side of which is designed to evacuate heat by convection, characterized in that it also comprises a cover delimiting a channel in which a coolant circulates to ensure convection, the cover being joined to the heat sink and the printed circuit board, and in that the channel prevents the coolant from coming into contact with the electronic components.

Abstract: The present invention relates to an electronic equipment rack arrangement principle. In order to allow for the maximum use of COTS (component off the shelf) modules, or, at least, maximum use of “standardized” modules, primarily in relation to the electronic functions of said rack, the electronic equipment rack according to the invention offers a configuration in which the function modules (3) and the interface modules (8) are juxtaposed, preferably vertically, and the electronic functions handled by the function modules (3) are decoupled from the interface functions handled by the interface modules (8). Such a rack also allows for all the maintenance operations to be done through the front panel (F) of said rack, all of its component modules being made accessible from this side.

Abstract: The operational reliability of a heat pipe 200 provided for carrying heat dissipated by an electronic component 101 to a heat exchanger 300 is tested by using the heat pipe in the reverse direction, by providing energy in the form of heat at the exchanger 300, and by measuring the propagation time ?P of the heat from the exchanger to the electronic component. Application to heat pipe tests in onboard computers.

Abstract: This interconnection module for the base of an electronic device casing carries out the transfer, at the faces of the printed circuit boards (4, 5) supporting the components of the device housed in the casing, of a field of connection points with the external environment of the casing embodied by the rear ends of the pins of a semi-connector fixed to the back of the casing while still retaining the compactness of the casing despite a very large number of connection points with the external environment of the casing (several hundreds of them). This module takes the form of a three-panel structure with a central panel 7 fixed to the rear ends of the pins of the semi-connector (3) mounted on the back of the casing and two side panels (8, 9) folded and placed flat against each other, joined to the longitudinal edges of the central panel (7) by flexible printed circuit elements (10, 11) and supporting the field of connection points transferred to the level of the faces of the boards (4,5) of the electronic device.

Abstract: This interconnection module for the base of an electronic device casing carries out the transfer, at the faces of the printed circuit boards (4, 5) supporting the components of the device housed in the casing, of a field of connection points with the external environment of the casing embodied by the rear ends of the pins of a semi-connector 3 fixed to the back of the casing while still retaining the compactness of the casing despite a very large number of connection points with the external environment of the casing (several hundreds of them).

Abstract: The modular structure embodying the invention comprises at least one frame, preferably manufactured in molded material, on which a printed circuit board is attached and whose rear vertical member has at least one indentation in which a group of connection elements is engaged, the frame comprising two lateral flanks equipped with attachment means to each of which can be attached either a covering plate or a second frame identical to the first one. The invention notably enables the connections between the printed circuit boards and the output connector of the structure to be reduced to a single level.