Abstract: A device that allows the treatment of a substrate in a machine provided for the treatment of bigger substrates and a mounting system for a substrate in this device. The device comprises a ring (24) having an external diameter equal to the diameter of these substrates, this ring being capable of setting the substrate (22) of smaller diameter. The system includes means (34) of manipulating this substrate and means (36) of heating the ring or of cooling this substrate. Application in micro-electronics.

Abstract: A microconnector with a high density of contacts which make it possible to connect N parallel electrodes to N electrical conductors. The microconnector comprises a support able to receive the electrodes, N electrically conductive, flexible, elastic wires, respectively connected to the N conductors and fixed to an insulating part movable relative to said support in such a way that the wires are parallel and each of them can come into contact with a single electrode as a result of a displacement of the insulating part when the electrodes are fitted in the support. A cam is provided for moving the part in such a way as to bring about simultaneous contacts between the respective electrodes and wires. The microconnector can be used in connection with flat screen display means.

Abstract: Method and apparatus for producing an electrical interconnection circuit for electronic components in which an insulating base support incorporating conductive zones is used, the different conductive zones to be interconnected are joined by an insulating wire by adhering it to the base support, the bared wire is welded to the conductive zones and is cut after welding, wherein a thermally weldable insulating wire is used and liquid flux is deposited on the parts of the wire to be welded resting on the conductive zones before making the weld.