Abstract: According to one embodiment of the present invention, a SOI device includes a first composite structure including a substrate layer, a substrate isolation layer being disposed on or above the substrate layer, a buried layer being disposed on or above the substrate isolation layer, and a semiconductor layer being disposed on or above the buried layer; a trench structure being formed within the first composite structure; and a second composite structure provided on the side walls of the trench structure, wherein the second composite structure includes a first isolation layer covering the part of the side walls formed by the semiconductor layer and formed by an upper part of the buried layer; and a contact layer covering the isolation layer and the part of the side walls formed by a lower part of the buried layer.

Abstract: The present invention is a waveguide photodetector. In one embodiment, the waveguide photodetector includes a waveguide layer where light is guided or is confined and a detection layer formed on the waveguide layer where guided light is detected. Each of the waveguide layer and the detection layer allows for the guiding of no more than a single mode of light for a given polarization. In another embodiment, the waveguide photodetector includes a waveguide layer where light is guided or is confined, a detection layer formed on the waveguide layer where guided light is detected, a first electrical contact coupled to the detection layer, and a second electrical contact coupled to the detection layer. The first electrical contact and the second electrical contact are disposed in a spaced-apart, substantially parallel manner relative to each other.

Abstract: According to one embodiment of the present invention, a SOI device includes a first composite structure including a substrate layer, a substrate isolation layer being disposed on or above the substrate layer, a buried layer being disposed on or above the substrate isolation layer, and a semiconductor layer being disposed on or above the buried layer; a trench structure being formed within the first composite structure; and a second composite structure provided on the side walls of the trench structure, wherein the second composite structure includes a first isolation layer covering the part of the side walls formed by the semiconductor layer and formed by an upper part of the buried layer; and a contact layer covering the isolation layer and the part of the side walls formed by a lower part of the buried layer.

Abstract: The present invention is a waveguide photodetector. In one embodiment, the waveguide photodetector includes a waveguide layer where light is guided or is confined and a detection layer formed on the waveguide layer where guided light is detected. Each of the waveguide layer and the detection layer allows for the guiding of no more than a single mode of light for a given polarization. In another embodiment, the waveguide photodetector includes a waveguide layer where light is guided or is confined, a detection layer formed on the waveguide layer where guided light is detected, a first electrical contact coupled to the detection layer, and a second electrical contact coupled to the detection layer. The first electrical contact and the second electrical contact are disposed in a spaced-apart, substantially parallel manner relative to each other.

Abstract: The invention relates to a lateral semiconductor diode, in which contact metal fillings (6, 7), which run in trenches (3, 4) in particular in a silicon carbide body (1, 2), are interdigitated at a distance from one another, and a rectifying Schottky or pn junction (18) is provided.

Abstract: The invention addresses the problem of creating a high-speed, high-efficiency photodetector that is compatible with Si CMOS technology. The structure consists of a Ge absorbing layer on a thin SOI substrate, and utilizes isolation regions, alternating n- and p-type contacts, and low-resistance surface electrodes. The device achieves high bandwidth by utilizing a buried insulating layer to isolate carriers generated in the underlying substrate, high quantum efficiency over a broad spectrum by utilizing a Ge absorbing layer, low voltage operation by utilizing thin a absorbing layer and narrow electrode spacings, and compatibility with CMOS devices by virtue of its planar structure and use of a group IV absorbing material. The method for fabricating the photodetector uses direct growth of Ge on thin SOI or an epitaxial oxide, and subsequent thermal annealing to achieve a high-quality absorbing layer.