Abstract: Systems and methods for pushed prefetching include: multiple core complexes, each core complex having multiple cores and multiple caches, the multiple caches configured in a memory hierarchy with multiple levels; an interconnect device coupling the core complexes to each other and coupling the core complexes to shared memory, the shared memory at a lower level of the memory hierarchy than the multiple caches; and a push-based prefetcher having logic to: monitor memory traffic between caches of a first level of the memory hierarchy and the shared memory; and based on the monitoring, initiate a prefetch of data to a cache of the first level of the memory hierarchy.

Abstract: A processing unit includes a plurality of adders and a plurality of carry bit generation circuits. The plurality of adders add first and second X bit binary portion values of a first Y bit binary value and a second Y bit binary value. Y is a multiple of X. The plurality of adders further generate first carry bits. The plurality of carry bit generation circuits is coupled to the plurality of adders, respectively, and receive the first carry bits. The plurality of carry bit generation circuits generate second carry bits based on the first carry bits. The plurality of adders use the second carry bits to add the first and second X bit binary portions of the first and second Y bit binary values, respectively.

Abstract: A disclosed computing device includes at least one prefetcher and a processing device communicatively coupled to the prefetcher. The processing device is configured to detect a throttling instruction that indicates a start of a throttling region. The computing device is further configured to prevent the prefetcher from being trained on one or more memory instructions included in the throttling region in response to the throttling instruction. Various other apparatuses, systems, and methods are also disclosed.

Abstract: A method for performing prefetching operations is disclosed. The method includes storing a recorded access pattern indicating a set of accesses for a region; in response to an access within the region, fetching the recorded access pattern; and performing prefetching based on the access pattern.

Abstract: A semiconductor package assembly includes a package interface. An interposer die has a first surface and a second surface opposite to the first surface, where the first surface of the interposer is die positioned on the package interface. The interposer die includes a plurality of conductive connections between the first surface and second surface. A chiplet includes a connectivity region having conductive pathways, with a first portion of the connectivity region coupled to a conductive connection of the interposer die and a second portion of the connectivity region cantilevered from the interposer die.

Abstract: The disclosed computer-implemented method for interpolating register-based lookup tables can include identifying, within a set of registers, a lookup table that has been encoded for storage within the set of registers. The method can also include receiving a request to look up a value in the lookup table and responding to the request by interpolating, from the encoded lookup table stored in the set of registers, a representation of the requested value. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A data processing node includes a processor element and a data fabric circuit. The data fabric circuit is coupled to the processor element and to a local memory element and includes a crossbar switch. The data fabric circuit is operable to bypass the crossbar switch for memory access requests between the processor element and the local memory element.

Abstract: An electronic device includes a processor having processor circuitry and a leader memory controller, a controller coupled to the processor and having a follower memory controller, and a memory. The processor circuitry is operable to access the memory by issuing memory access requests to the leader memory controller. The leader memory controller is operable to complete the memory access requests using the follower memory controller to issue memory commands to the at least one memory die.

Abstract: Systems and methods are disclosed that map quantum circuits to physical qubits of a quantum computer. Techniques are disclosed to generate a graph that characterizes the physical qubits of the quantum computer and to compute the resource requirements of each circuit of the quantum circuits. For each circuit, the graph is searched for a subgraph that matches the resource requirements of the circuit, based on a density matrix. Physical qubits, defined by the matching subgraph, are then allocated to the logical qubits of the circuit.

Abstract: An accelerator device includes a first processing unit to access a structure of a graph dataset, and a second processing unit coupled with the first processing unit to perform computations based on data values in the graph dataset.

Abstract: A semiconductor package assembly includes a die having a front surface and a back surface opposite to and parallel to the front surface. A first portion of a front surface of an interconnect die is coupled to a portion of the back surface of the die. The interconnect die includes a connectivity region that is coupled to one or more through-die vias in the die through the back surface of the die. A spacer component is coupled to a second portion of the front surface of the interconnect die. The spacer component includes conductive connections, with one or more of the conductive connections are coupled to the conductive pathways of the connectivity region of the interconnect die.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: In response to eviction of a first clean data block from an intermediate level of cache in a multi-cache hierarchy of a processing system, a cache controller accesses an address of the first clean data block. The controller initiates a fetch of the first clean data block from a system memory into a last-level cache using the accessed address.

Abstract: An approach is provided for implementing register based single instruction, multiple data (SIMD) lookup table operations. According to the approach, an instruction set architecture (ISA) can support one or more SIMD instructions that enable vectors or multiple values in source data registers to be processed in parallel using a lookup table or truth table stored in one or more function registers. The SIMD instructions can be flexibly configured to support functions with inputs and outputs of various sizes and data formats. Various approaches are also described for supporting very large lookup tables that span multiple registers.

Abstract: A semiconductor package includes a first die, a second die, and an interconnect die coupled to a first plurality of through-die vias in the first die and a second plurality of through-die vias in the second die. The interconnect die provides communications pathways the first die and the second die.

Abstract: Systems, apparatuses, and methods for managing buffers in a neural network implementation with heterogeneous memory are disclosed. A system includes a neural network coupled to a first memory and a second memory. The first memory is a relatively low-capacity, high-bandwidth memory while the second memory is a relatively high-capacity, low-bandwidth memory. During a forward propagation pass of the neural network, a run-time manager monitors the usage of the buffers for the various layers of the neural network. During a backward propagation pass of the neural network, the run-time manager determines how to move the buffers between the first and second memories based on the monitored buffer usage during the forward propagation pass. As a result, the run-time manager is able to reduce memory access latency for the layers of the neural network during the backward propagation pass.

Abstract: A semiconductor device includes one or more active devices disposed between a processor die and a package substrate. The semiconductor device includes a first layer with a processor die, a second layer with one or more active devices, and a third layer with a package substrate, where the second layer is disposed between the first and third layers. The one or more active devices are semiconductor-based devices, such as voltage regulators, that participate in supplying power to the processor die and are electrically connected to the processor die using various connection configurations. The implementations use short path lengths for improved performance with a compact structure that avoids the use of edge wiring or interposers without occupying processor die space. Implementations include the use of through-silicon vias (TSVs) to provide short path lengths while reducing the number of connection resources used by the one or more power components.

Abstract: A semiconductor package includes a package substrate having a first surface and an opposing second surface, and further includes an integrated circuit (IC) die disposed at the second surface and having a third surface facing the second surface and an opposing fourth surface. The IC die has a first region comprising one or more metal layers and circuit components for one or more functions of the IC die and a second region offset from the first region in a direction parallel with the third and fourth surfaces. The semiconductor package further includes a voltage regulator disposed at the fourth surface in the second region and having an input configured to receive a supply voltage and an output configured to provide a regulated voltage, and also includes a conductive path coupling the output of the voltage regulator to a voltage input of circuitry of the IC die.

Abstract: In response to eviction of a first clean data block from an intermediate level of cache in a multi-cache hierarchy of a processing system, a cache controller accesses an address of the first clean data block. The controller initiates a fetch of the first clean data block from a system memory into a last-level cache using the accessed address.

Abstract: An electronic device includes a memory having a plurality of memory rows and a memory refresh functional block that performs a victim row refresh operation. For the victim row refresh operation, the memory refresh functional block selects one or more victim memory rows that may be victims of data corruption caused by repeated memory accesses in a specified group of memory rows near each of the one or more victim memory rows. The memory refresh functional block then individually refreshes each of the one or more victim memory rows.