Patents by Inventor Gabriel Pittelli

Gabriel Pittelli has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9517611
    Abstract: A multi-layer low temperature heat shrink film comprising an abuse layer comprising styrene-butadiene block copolymer; a first tie layer comprising ethylene vinyl acetate; a gas barrier layer comprising polyvinylidene chloride; a second tie layer comprising ethylene vinyl acetate; and a sealant layer comprising a metallocene-catalyzed sealant, is disclosed.
    Type: Grant
    Filed: February 28, 2011
    Date of Patent: December 13, 2016
    Assignee: COVERIS FLEXIBLES US LLC
    Inventor: Gabriel Pittelli
  • Publication number: 20120052270
    Abstract: A multi-layer low temperature heat shrink film comprising an abuse layer comprising styrene-butadiene block copolymer; a first tie layer comprising ethylene vinyl acetate; a gas barrier layer comprising polyvinylidene chloride; a second tie layer comprising ethylene vinyl acetate; and a sealant layer comprising a metallocene-catalyzed sealant, is disclosed.
    Type: Application
    Filed: February 28, 2011
    Publication date: March 1, 2012
    Applicant: EXOPACK-TECHNOLOGY, LLC
    Inventor: Gabriel Pittelli