Patents by Inventor Gad Neumann
Gad Neumann has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7961763Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: GrantFiled: June 28, 2006Date of Patent: June 14, 2011Assignee: Applied Materials South East Asia Pte. Ltd.Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Patent number: 7843559Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: GrantFiled: June 28, 2006Date of Patent: November 30, 2010Assignee: Applied Materials South East Asia Pte. Ltd.Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Patent number: 7796807Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.Type: GrantFiled: January 15, 2009Date of Patent: September 14, 2010Assignee: Applied Materials, Israel Ltd.Inventors: David Alumot, Gad Neumann, Rivka Sherman, Ehud Tirosh
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Patent number: 7633041Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: GrantFiled: September 21, 2006Date of Patent: December 15, 2009Assignee: Applied Materials South East Asia Pte, Ltd.Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Publication number: 20090148033Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.Type: ApplicationFiled: January 15, 2009Publication date: June 11, 2009Inventors: David Alumot, Gad Neumann, Rivka Sherman, Ehud Tirosh
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Patent number: 7525659Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: GrantFiled: January 15, 2003Date of Patent: April 28, 2009Assignee: Negevtech Ltd.Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Patent number: 7499583Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.Type: GrantFiled: May 24, 2004Date of Patent: March 3, 2009Assignee: Applied Materials, Israel, Ltd.Inventors: David Alumot, Gad Neumann, Rivka Sherman, Ehud Tirosh
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Patent number: 7477383Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: GrantFiled: June 28, 2006Date of Patent: January 13, 2009Assignee: Negevtech Ltd.Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Patent number: 7260298Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.Type: GrantFiled: April 1, 2005Date of Patent: August 21, 2007Assignee: Negevtech Ltd.Inventors: Dov Furman, Gad Neumann, Noam Dotan
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Patent number: 7180586Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: GrantFiled: December 23, 2004Date of Patent: February 20, 2007Assignee: Negevtech Ltd.Inventors: Gad Neumann, Noam Dotan
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Publication number: 20070019856Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: ApplicationFiled: June 28, 2006Publication date: January 25, 2007Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Publication number: 20070013903Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: ApplicationFiled: September 21, 2006Publication date: January 18, 2007Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Publication number: 20060244958Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: ApplicationFiled: June 28, 2006Publication date: November 2, 2006Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Publication number: 20060244957Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: ApplicationFiled: June 28, 2006Publication date: November 2, 2006Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Publication number: 20060244956Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: ApplicationFiled: June 28, 2006Publication date: November 2, 2006Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Patent number: 6952491Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.Type: GrantFiled: January 19, 2001Date of Patent: October 4, 2005Assignee: Applied Materials, Inc.Inventors: David Alumot, Gad Neumann, Rivka Sherman, Ehud Tirosh
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Publication number: 20050180707Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.Type: ApplicationFiled: April 1, 2005Publication date: August 18, 2005Inventors: Dov Furman, Gad Neumann, Noam Dotan
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Publication number: 20050110987Abstract: Fast on-line electro-optical detection of wafer defects by illuminating with a short light pulse from a repetitively pulsed laser, a section of the wafer while it is moved across the field of view of an imaging system, and imaging the moving wafer onto a focal plane assembly, optically forming a continuous surface of photo-detectors at the focal plane of the optical imaging system. The continuously moving wafer is illuminated by a laser pulse of duration significantly shorter than the pixel dwell time, such that there is effectively no image smear during the wafer motion. The laser pulse has sufficient energy and brightness to impart the necessary illumination to each sequentially inspected field of view required for creating an image of the inspected wafer die. A novel fiber optical illumination delivery system, which is effective in reducing the effects of source coherence is described.Type: ApplicationFiled: December 23, 2004Publication date: May 26, 2005Inventors: Dov Furman, Gad Neumann, Mark Wagner, Noam Dotan, Ram Segal, Shai Silberstein
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Patent number: 6892013Abstract: A fiber optical illumination delivery system, which is effective in reducing the effects of source coherence. The system preferably utilizes either a single bundle of optical fibers, or serial bundles of optical fibers. In the single bundle embodiment, the differences in optical lengths between different fibers of the bundle is preferably made to be equal to even less than the coherence length of the source illumination. In the serial bundle embodiment, the fibers in the other bundle are arranged as groups of fibers of the same length, and it is the difference in lengths of these groups which is made equal to, or even more preferably, less than the overall difference in length between the shortest and the longest fibers in the other bundle. Both of these fiber systems enable construction of illumination systems delivering a higher level of illumination, but without greatly affecting the coherence breaking abilities of the system, thus enabling a generally more applicable system to be constructed.Type: GrantFiled: January 15, 2003Date of Patent: May 10, 2005Assignee: Negevtech Ltd.Inventors: Dov Furman, Gad Neumann, Noam Dotan
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Publication number: 20040263834Abstract: A method and apparatus for inspecting the surface of articles, such as chips and wafers, for defects, includes a first phase of optically examining the complete surface of the article inspected at a relatively high speed and with a relatively low spatial resolution, and a second phase of optically examining with a relatively high spatial resolution only the suspected locations for the presence or absence of a defect therein.Type: ApplicationFiled: May 24, 2004Publication date: December 30, 2004Applicant: APPLIED MATERIALS, INC.Inventors: David Alumot, Gad Neumann, Rivka Sherman, Ehud Tirosh