Abstract: A measuring method and measuring apparatus for vector-measuring a scattering coefficient of a device under test substantially using a scalar measuring instrument while enabling a reduction in the size of the measuring instrument and the cost. The measurement system includes a signal source that applies a signal to a device under test, a scalar measuring instrument that measures a reflected wave reflected from the device under test or a transmitted wave transmitted through the device under test as a scalar value, and a superimposing signal system that superimposes three different vector signals whose relation values are specified in advance on the reflected wave or the transmitted wave of the device under test. The three vector signals are superimposed on the reflected wave or the transmitted wave of the device under test, and the superimposed signals are each measured as a scalar value by the electric-power measuring instrument.

Abstract: Two ends of a transmission line whose electrical characteristics per unit length are known are connected to associated measurement ports of a network analyzer. A short standard is shunt-connected to at least three points in the longitudinal direction of the transmission line, and electrical characteristics are measured in a short-circuited state, thereby calculating error factors of a measurement system. Then an electronic device to be measured is shunt-connected to the transmission line, and electrical characteristics of the electronic device are measured. Then the error factors of the measurement system are removed from the measured values of the electronic device to be measured, thereby obtaining true values of the electrical characteristics of the electronic device to be measured. Accordingly, a highly accurate high-frequency electrical characteristic measuring method that is not affected by connection variations can be implemented.

Abstract: A plurality of signal conductors and ground conductors are connected to associated measurement ports of a network analyzer. A short standard is connected between each of the signal conductors and the ground conductor at least three points in the longitudinal direction of each of the signal conductors, and an electrical characteristic is measured. A through chip is connected in series between the signal conductors, and electrical characteristics are measured. Error factors of a measurement system including a transmission line are calculated. An electronic device to be measured is connected between the signal conductors or among the signal conductors and the ground conductors, and electrical characteristics are measured. The error factors of the measurement system are removed from the measured values, thereby obtaining true values of the electrical characteristics of the electronic device to be measured.

Abstract: A measurement error correcting method and electronic component characteristic measuring device capable of accurately coping with an electronic component which includes nonsignal line ports and whose electrical characteristics are changed by a jig.

Abstract: A coil antenna structure includes a first magnetic component extending in the thickness direction of a tabular primary casing. A second magnetic component and a third magnetic component, which are magnetically connected to the first magnetic component, are disposed on the first principal surface side and the second principal surface side of the primary casing, respectively. The first magnetic component is provided with a coil component surrounding it. In this manner, a U-shaped magnetic path is provided at an end portion of the primary casing so as to detour around a substrate defining an internal conductor. Likewise, a U-shaped magnetic path including fourth to sixth magnetic components is provided in a secondary casing defining a clamshell type casing together with the primary casing so as to detour around a substrate defining as an internal conductor.

Abstract: Two ends of a transmission line whose electrical characteristics per unit length are known are connected to associated measurement ports of a network analyzer 2. A short standard is shunt-connected to at least three points in the longitudinal direction of the transmission line, and electrical characteristics are measured in a short-circuited state, thereby calculating error factors of a measurement system. Then an electronic device to be measured is shunt-connected to the transmission line, and electrical characteristics of the electronic device are measured. Then the error factors of the measurement system are removed from the measured values of the electronic device to be measured, thereby obtaining true values of the electrical characteristics of the electronic device to be measured. Accordingly, a highly accurate high-frequency electrical characteristic measuring method that is not affected by connection variations can be implemented.

Abstract: A plurality of signal conductors and ground conductors are connected to associated measurement ports of a network analyzer. A short standard is connected between each of the signal conductors and the ground conductor at at least three points in the longitudinal direction of each of the signal conductors, and an electrical characteristic is measured. A through chip is connected in series between the signal conductors, and electrical characteristics are measured. Error factors of a measurement system including a transmission line are calculated. An electronic device to be measured is connected between the signal conductors or among the signal conductors and the ground conductors, and electrical characteristics are measured. The error factors of the measurement system are removed from the measured values, thereby obtaining true values of the electrical characteristics of the electronic device to be measured.

Abstract: A signal conductor whose first end is an open end, and a ground conductor are connected to associated measurement ports of a network analyzer. A short standard is connected between the signal conductor and the ground conductor at least three points in the longitudinal direction of the signal conductor, and electrical characteristics are measured, thereby calculating error factors of a measurement system including a transmission line. An electronic device to be measured is connected between the signal conductor and the ground conductor, and an electrical characteristic is measured. The error factors of the measurement system are removed from the measured value of the electronic device to be measured, thereby obtaining a true value of the electrical characteristic of the electronic device. Accordingly, a highly accurate high-frequency electrical characteristic measuring method, using a reflection method, that is not affected by connection variations can be implemented.

Abstract: A high-precision, multi-port compatible, relative correction method and apparatus for correcting measurement errors covering an increase in the number of ports of a non-coaxial electronic component, in which a relative correction adapter 31 is provided that is formed of a two-port network connected to each port of a production test fixture 5B adjacent to a measurement apparatus. The relative correction adapter has a characteristic that modifies the electrical characteristics generated by the production test fixture 5B having an electronic component under test mounted thereon into electrical characteristics generated by a standard test fixture 5A having the electronic component under test mounted thereon. An error factor of the relative correction adapter 31 is identified from a standard test fixture measurement value and a production test fixture measurement value of a correction data acquisition specimen 11B.

Abstract: A testing method for an electronic component in which a predetermined load is set, which is determined by a burn-in temperature, a burn-in voltage, and a burn-in period of time, and burn-in of an electronic component is carried out in such a manner that a load equal to the predetermined load is applied to the electronic component, with the method including a first step of placing an electronic component having a negative resistance-temperature characteristic in a heating atmosphere so that the temperature of the electronic component reaches a predetermined temperature which is lower than the burn-in temperature, a second step of supplying constant current to flow through the electronic component so that the predetermined temperature of the electronic component is increased to the burn-in temperature, and a third step of comparing the voltage actually applied to the electronic component to the burn-in voltage, correcting the burn-in time-period based on the comparison to determine a corrected burn-in time-peri

Abstract: An electronic component production method for subjecting an electronic component to burn-in, in which a load equivalent to a predetermined load defined by a burn-in temperature, a burn-in voltage, and a burn-in time is applied to the electronic component, includes a first step of setting the temperature of the electronic component to a predetermined temperature which is lower than the burn-in temperature; a second step of applying constant power to the electronic component to increase the temperature of the electronic component from the predetermined temperature to the burn-in temperature; and a third step of comparing an actual voltage which is applied to the electronic component at the burn-in temperature with the burn-in voltage and correcting the burn-in time based on the difference therebetween to determine a corrected burn-in time, and applying the constant power to the electronic component for the corrected burn-in time.

Abstract: The impedance of a correction-data obtaining sample is measured by a standard measuring device and an actual measuring device so as to obtain an interrelated expression of the measurement results generated by the standard and actual measuring devices. The impedance of an electronic component measured by the actual measuring device is substituted into the interrelated expression and the expression is calculated. Accordingly, the impedance of the electronic component is corrected to the impedance which would be obtained from the standard measuring device.

Abstract: A high-precision, multi-port compatible, relative correction method and apparatus for correcting measurement errors covering an increase in the number of ports of a non-coaxial electronic component, in which a relative correction adapter 31 is provided that is formed of a two-port network connected to each port of a production test fixture 5B adjacent to a measurement apparatus. The relative correction adapter has a characteristic that modifies the electrical characteristics generated by the production test fixture 5B having an electronic component under test mounted thereon into electrical characteristics generated by a standard test fixture 5A having the electronic component under test mounted thereon. An error factor of the relative correction adapter 31 is identified from a standard test fixture measurement value and a production test fixture measurement value of a correction data acquisition specimen 11B.

Abstract: A high-precision, multi-port compatible, relative correction method and apparatus for correcting measurement errors covering an increase in the number of ports of a non-coaxial electronic component, in which a relative correction adapter 31 is provided that is formed of a two-port network connected to each port of a production test fixture 5B adjacent to a measurement apparatus. The relative correction adapter has a characteristic that modifies the electrical characteristics generated by the production test fixture 5B having an electronic component under test mounted thereon into electrical characteristics generated by a standard test fixture 5A having the electronic component under test mounted thereon. An error factor of the relative correction adapter 31 is identified from a standard test fixture measurement value and a production test fixture measurement value of a correction data acquisition specimen 11B.

Abstract: A high-precision, multi-port compatible, relative correction method and apparatus for correcting measurement errors covering an increase in the number of ports of a non-coaxial electronic component, in which a relative correction adapter 31 is provided that is formed of a two-port network connected to each port of a production test fixture 5B adjacent to a measurement apparatus. The relative correction adapter has a characteristic that modifies the electrical characteristics generated by the production test fixture 5B having an electronic component under test mounted thereon into electrical characteristics generated by a standard test fixture 5A having the electronic component under test mounted thereon. An error factor of the relative correction adapter 31 is identified from a standard test fixture measurement value and a production test fixture measurement value of a correction data acquisition specimen 11B.

Abstract: A testing method for an electronic component in which a predetermined load is set, which is determined by a burn-in temperature, a burn-in voltage, and a burn-in period of time, and burn-in of an electronic component is carried out in such a manner that a load equal to the predetermined load is applied to the electronic component, with the method including a first step of placing an electronic component having a negative resistance-temperature characteristic in a heating atmosphere so that the temperature of the electronic component reaches a predetermined temperature which is lower than the burn-in temperature, a second step of supplying constant current to flow through the electronic component so that the predetermined temperature of the electronic component is increased to the burn-in temperature, and a third step of comparing the voltage actually applied to the electronic component to the burn-in voltage, correcting the burn-in time-period based on the comparison to determine a corrected burn-in time-peri

Abstract: The impedance of a correction-data obtaining sample is measured by a standard measuring device and an actual measuring device so as to obtain an interrelated expression of the measurement results generated by the standard and actual measuring devices. The impedance of an electronic component measured by the actual measuring device is substituted into the interrelated expression and the expression is calculated. Accordingly, the impedance of the electronic component is corrected to the impedance which would be obtained from the standard measuring device.

Abstract: An electronic component production method for subjecting an electronic component to burn-in, in which a load equivalent to a predetermined load defined by a burn-in temperature, a burn-in voltage, and a burn-in time is applied to the electronic component, includes a first step of setting the temperature of the electronic component to a predetermined temperature which is lower than the burn-in temperature; a second step of applying constant power to the electronic component to increase the temperature of the electronic component from the predetermined temperature to the burn-in temperature; and a third step of comparing an actual voltage which is applied to the electronic component at the burn-in temperature with the burn-in voltage and correcting the burn-in time based on the difference therebetween to determine a corrected burn-in time, and applying the constant power to the electronic component for the corrected burn-in time.

Abstract: Actual measured results, which do not agree with a reference measuring system accurately, are corrected to the same level as results measured by the reference measuring system. An interrelating formula between results measured by an actual measuring system and results measured by a reference measuring system is obtained after measuring electrical characteristics of a correction-data acquisition sample by the reference measuring system and the actual measuring system, respectively. Then, by substituting electrical characteristics of a target electronic component measured by the actual measuring system in the interrelating formula for computation, the electric characteristics of the target electronic component is corrected to electric characteristics assumed to be obtained by the reference measuring system.

Abstract: An impedance measuring apparatus for an electronic component measures the impedance of the electronic component using a four-terminal method. The impedance measuring apparatus for the electronic component includes a first current-carrying line and a first voltage detection line connected to one electrode of the electronic component. A first resistor establishes a connection between the first current-carrying line and the first voltage detection line. A second current-carrying line and a second voltage detection line are connected to the other electrode of the electronic component. A second resistor establishes a connection between the second current-carrying line and the second voltage detection line. In the impedance measuring apparatus, the first resistor and the second resistor have sufficiently high resistances compared to contact resistances occurring among the electrodes of the electronic component, the current-carrying lines, and the voltage detection lines.