Patents by Inventor Galen P. Cook
Galen P. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11685115Abstract: In one example in accordance with the present disclosure, an additive manufacturing module is described. The additive manufacturing module includes an agent distributor to selectively distribute a fabrication agent onto layers of build material. The agent distributor includes at least one fluidic ejection die. Each fluidic ejection die includes a plurality of nozzles arranged along a die length and a die width, the plurality of nozzles arranged such that, for each set of neighboring nozzles, a respective subset of each set of neighboring nozzles are positioned at different die width positions along the width of the fluidic ejection die. The fluidic ejection die also includes, for each respective nozzle of the plurality of nozzles, a respective ejection chamber fluidically coupled to the respective nozzle and for each respective ejection chamber, at least one respective fluid feed hole fluidically coupled to the respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: June 27, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: James R Przybyla, Jason Hower, Michael G Monroe, Galen P Cook
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Patent number: 11345162Abstract: A fluid recirculation channel for dispensing a plurality of fluid drop weights includes a number of sub-channels. The sub-channels include at least one pump channel, and a plurality of drop generator channels fluidically coupled to the at least one pump channel. The fluid recirculation channel further includes a number of pump generators incorporated into the at least one pump channel, a number of drop generators incorporated into drop generator channels, and a plurality of nozzles defined within the drop generator channels, the nozzles being at least as numerous as the number of drop generators.Type: GrantFiled: July 14, 2015Date of Patent: May 31, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Alexander Govyadinov, Ron Burns, Erik D. Torniainen, Galen P. Cook, David P. Markel, Garrard Hume, Chris Bakker
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Publication number: 20210323228Abstract: In one example in accordance with the present disclosure, an additive manufacturing module is described. The additive manufacturing module includes an agent distributor to selectively distribute a fabrication agent onto layers of build material. The agent distributor includes at least one fluidic ejection die. Each fluidic ejection die includes a plurality of nozzles arranged a long a die length and a die width, the plurality of nozzles arranged such that, for each set of neighboring nozzles, a respective subset of each set of neighboring nozzles are positioned at different die width positions along the width of the fluidic ejection die. The fluidic ejection die also includes, for each respective nozzle of the plurality of nozzles, a respective ejection chamber fluidically coupled to the respective nozzle and for each respective ejection chamber, at least one respective fluid feed hole fluidically coupled to the respective ejection chamber.Type: ApplicationFiled: March 12, 2018Publication date: October 21, 2021Inventors: James R Przybyla, Jason Hower, Michael G Monroe, Galen P Cook
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Publication number: 20180290458Abstract: A fluid recirculation channel for dispensing a plurality of fluid drop weights includes a number of sub-channels. The sub-channels include at least one pump channel, and a plurality of drop generator channels fluidically coupled to the at least one pump channel. The fluid recirculation channel further includes a number of pump generators incorporated into the at least one pump channel, a number of drop generators incorporated into drop generator channels, and a plurality of nozzles defined within the drop generator channels, the nozzles being at least as numerous as the number of drop generators.Type: ApplicationFiled: July 14, 2015Publication date: October 11, 2018Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Alexander Govyadinov, Ron Burns, Erik D. Torniainen, Galen P. Cook, David P. Markel, Garrard Hume, Chris Bakker
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Patent number: 9815282Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.Type: GrantFiled: June 30, 2014Date of Patent: November 14, 2017Assignee: Hewlett-Packard Development Company, L.P.Inventors: Bradley D. Chung, Galen P. Cook, Michael H. Hayes, Adam L. Ghozeil, Chantelle Elizabeth Domingue, Valerie J. Marty, Anthony M. Fuller, Sterling Chaffins
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Publication number: 20170106651Abstract: A fluid ejection structure can include thermal resistors, a substrate, layers on the substrate, wherein said layers can include a region proximate to the resistor that has reduced field oxide.Type: ApplicationFiled: June 30, 2014Publication date: April 20, 2017Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Bradley D. Chung, Galen P. Cook, Michael H. Hayes, Adam L. Ghozeil, Chantelle Elizabeth Domingue, Valerie J. Marty, Anthony M. Fuller, Sterling Chaffins
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Patent number: 9511587Abstract: A method and apparatus provide a resistor electrically connected to an electrically conductive trace.Type: GrantFiled: October 14, 2011Date of Patent: December 6, 2016Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen P. Cook, Bradley D. Chung
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Patent number: 9289987Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.Type: GrantFiled: October 31, 2012Date of Patent: March 22, 2016Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen P. Cook, Bradley D. Chung, Anthony M. Fuller
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Publication number: 20150266293Abstract: An exemplary embodiment of the present invention provides for a fluid ejection device. The fluid ejection device includes a substrate, a conductive layer, a resistive layer, and at least one upper layer. The conductive layer is disposed on the substrate and an outer perimeter and an inner region thinner than the outer perimeter. The outer perimeter includes conductive elements spaced apart from one another. The resistive layer includes an outer resistive portion overlying the conductive elements and a central resistive portion lying on top of a raised bridge of the substrate, wherein the width of the raised bridge is substantially greater than the width of the central resistive portion. The at least one upper layer defines a boundary of a fluid chamber, and the boundary is aligned vertically above a border of the central resistive portion.Type: ApplicationFiled: October 31, 2012Publication date: September 24, 2015Inventors: Galen P. Cook, Bradley D. Chung, Anthony M. Fuller
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Patent number: 9033470Abstract: In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.Type: GrantFiled: January 31, 2011Date of Patent: May 19, 2015Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sadiq Bengali, Galen P Cook, Michael W Cumbie, Robert K Messenger
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Patent number: 8877646Abstract: A method of manufacturing a plurality of spacers in a film stack includes forming at least one electrically-conductive element having sidewalls on a substrate, depositing a plurality of passivation layers proximate to the substrate, and performing etching on one of the plurality of passivation layers to form a plurality of spacers substantially across from the sidewalls of the at least one electrically-conductive element.Type: GrantFiled: April 19, 2010Date of Patent: November 4, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Valerie J Marty, Galen P. Cook
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Publication number: 20140224786Abstract: A method and apparatus provide a resistor electrically connected to an electrically conductive trace.Type: ApplicationFiled: October 14, 2011Publication date: August 14, 2014Inventors: Galen P. Cook, Bradley D. Chung
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Patent number: 8708461Abstract: A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.Type: GrantFiled: July 23, 2010Date of Patent: April 29, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Bradley D. Chung, Galen P. Cook, Daniel Fradl
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Patent number: 8690295Abstract: A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.Type: GrantFiled: September 15, 2010Date of Patent: April 8, 2014Assignee: Hewlett-Packard Development Company, L.P.Inventors: Sadiq Bengali, Chien-Hua Chen, Galen P. Cook, Michael W. Cumbie, Robert K. Messenger
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Publication number: 20130286105Abstract: In one embodiment, a fluid ejection device includes a substrate with a fluid slot and a membrane adhered to the substrate that spans the fluid slot. A resistor is disposed on top of the membrane over the fluid slot, and a fluid feed hole next to the resistor extends through the membrane to the slot. A shelf extends from the edge of the resistor to the edge of the feed hole, and a passivation layer covers the resistor and part the shelf. An etch-resistant layer is formed partly on the shelf and in between the fluid feed hole and the resistor.Type: ApplicationFiled: January 31, 2011Publication date: October 31, 2013Inventors: Sadiq Bengali, Galen P. Cook, Michael W. Cumbie, Robert K. Messenger
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Publication number: 20130162717Abstract: A method for fabricating a fluid nozzle array includes forming a circuitry layer onto a substrate, the substrate comprising a stopping layer disposed between a membrane layer and a handle layer, forming a fluid feedhole extending from a surface of the membrane layer to the stopping layer, and forming a fluid supply trench extending from a surface of the handle layer to the stopping layer. A fluid nozzle array includes a substrate including a membrane layer, a stopping layer adjacent to the membrane layer, a handle layer adjacent to the stopping layer, and a set of fluid chambers disposed on a surface of the membrane layer above and along a width of a fluid supply trench extending from a surface of the handle layer to the stopping layer.Type: ApplicationFiled: September 15, 2010Publication date: June 27, 2013Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.Inventors: Sadiq Bengali, Chien-Hua Chen, Galen P. Cook, Michael W. Cumbie, Robert K. Messenger
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Publication number: 20130083131Abstract: A thermal resistor fluid ejection assembly includes an insulating substrate and first and second electrodes formed on the substrate. A plurality of individual resistor elements of varying widths are arranged in parallel on the substrate and electrically coupled at a first end to the first electrode and at a second end to the second electrode.Type: ApplicationFiled: July 23, 2010Publication date: April 4, 2013Inventors: Bradley D. Chung, Galen P. Cook, Daniel Fradl
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Publication number: 20130034703Abstract: A method of manufacturing a plurality of spacers in a film stack includes forming at least one electrically-conductive element having sidewalls on a substrate, depositing a plurality of passivation layers proximate to the substrate, and performing etching on one of the plurality of passivation layers to form a plurality of spacers substantially across from the sidewalls of the at least one electrically-conductive element.Type: ApplicationFiled: April 19, 2010Publication date: February 7, 2013Inventors: Valerie J Marty, Galen P. Cook
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Publication number: 20100231655Abstract: A printhead die (200) for an inkjet-printing device includes a substrate (302), a heating resistor, and an edge protection layer (209) The heating resistor is formed on the substrate, and has one or more edges The heating resistor is operative to cause an ink droplet to be ejected from the inkjet-printing device upon sufficient current flowing through the heating resistor resulting in a bubble nucleating within ink at the heating resistor and thereafter collapsing at the heating resistor The edge protection layer covers just the edges of the heating resistor in order to at least substantially protect the heating resistor from becoming damaged due to collapsing of the bubble at the heating resistorType: ApplicationFiled: November 24, 2007Publication date: September 16, 2010Applicant: Hewlett-Packard Developement Company, L.P.Inventors: Bradley D. Chung, Arun K. Agarwal, Galen P. Cook, Sadiq Bengali, Christopher A. Leonard