Abstract: The present disclosure relates to systems and methods to coordinate protective elements in an electric power system (EPS). In one embodiment, a system may include a Time vs Normalized Impedance Length subsystem to determine a first plurality of times of operation of a first protective element for a plurality of fault locations in the EPS and to determine a second plurality of times of operation of a second protective element for the plurality of fault locations in the EPS. A protective action subsystem may coordinate a response of the first protective element and the second protective element. The protective action subsystem may establish a pickup and a protective action for the second protective element. Upon detection of a fault in the EPS, one of the first protective action and the second protective action may be implemented based on one of the first pickup and the second pickup.

Abstract: The present disclosure relates to systems and methods to coordinate protective elements in an electric power system (EPS). In one embodiment, a system may include a Time vs Normalized Impedance Length subsystem to determine a first plurality of times of operation of a first protective element for a plurality of fault locations in the EPS and to determine a second plurality of times of operation of a second protective element for the plurality of fault locations in the EPS. A protective action subsystem may coordinate a response of the first protective element and the second protective element. The protective action subsystem may establish a pickup and a protective action for the second protective element. Upon detection of a fault in the EPS, one of the first protective action and the second protective action may be implemented based on one of the first pickup and the second pickup.

Abstract: The present invention features additions of nanostructures to interconnect conductor particles to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nanostructures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Abstract: The present invention features additions of nano-structures to interconnect conductor fine particles (spheres) to: (1) reduce thermal interface resistance by using thermal interposers that have high thermal conductivity nano-structures at their surfaces; (2) improve the anisotropic conductive adhesive interconnection conductivity with microcircuit contact pads; and (3) allow lower compression forces to be applied during the microcircuit fabrication processes which then results in reduced deflection or circuit damage. When pressure is applied during fabrication to spread and compress anisotropic conductive adhesive and the matrix of interconnect particles and circuit conductors, the nano-structures mesh and compress into a more uniform connection than current technology provides, thereby eliminating voids, moisture and other contaminants, increasing the contact surfaces for better electrical and thermal conduction.

Abstract: A method of punching a via or through hole in a polymer-metal laminate workpiece in a punch press. The punch press has a punch tool, a driver coil for driving the punch tool through the polymer-metal laminate workpiece, and a stopper for stopping the punch travel of the punch tool and mechanically returning the punch tool to its starting position. The method includes the steps of applying an electrical current pulse through the driver coil to electromagnetically drive the punch downward to and through the workpiece, and then elastically colliding the punch tool with the stopper to stop and return the punch tool on an upward return stroke. Subsequently a second, braking pulse is applied through the driver coil to electromagnetically brake the punch. The second electrical current is applied after the start of the punching pulse, for a time and magnitude sufficient to brake the punch press.

Abstract: A color management method/apparatus generates image color matching and International Color Consortium (ICC) color printer profiles using a reduced number of color patch measurements. Color printer characterization, and the generation of ICC profiles usually require a large number of measured data points or color patches and complex interpolation techniques. This invention provides an optimization method/apparatus for performing LAB to CMYK color space conversion, gamut mapping, and gray component replacement. A gamut trained network architecture performs LAB to CMYK color space conversion to generate a color profile lookup table for a color printer, or alternatively, to directly control the color printer in accordance with the a plurality of color patches that accurately. represent the gamut of the color printer.