Patents by Inventor Gang An

Gang An has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240183727
    Abstract: Disclosed is a tactile sensing device, including a light source, a plurality of optical waveguides, photoelectric sensing components, and a contact point. The light source is disposed at an input end of each optical waveguide, and the photoelectric sensing component is disposed at an output end of each optical waveguide. The plurality of optical waveguides surround the contact point, and the contact point is in contact with each optical waveguide. When there is a contact force at the contact point, the plurality of optical waveguides are deformed, and deformations of the optical waveguides cause losses of optical signals transmitted in the optical waveguides. The photoelectric sensing component obtains an optical signal transmitted by each optical waveguide, and may detect a value and a direction of the contact force based on a variation of the optical signal transmitted by each optical waveguide.
    Type: Application
    Filed: February 9, 2024
    Publication date: June 6, 2024
    Inventors: Stephen WANG, Hongbin LIU, Jian HU, Danqian CAO, Gang NI, Tao HUANG
  • Publication number: 20240181460
    Abstract: The present disclosure provides a highly sealed PCR single tube, which relates to the technical field of the PCR single tube. The PCR single tube comprises a sealing tube, wherein the sealing tube is movably placed inside a storage box, four limited posts are fixedly connected on an upper surface of the storage box, a box cover is movably connected at upper ends of the limited posts, and an auxiliary component is fixedly installed inside the box cover. The sealing tube comprises a stud that is movably connected with a screw tube, four movable blocks are movably installed inside a lower side of the screw tube, and a second hose is fixedly connected outside the screw tube. The sealing tube comprises the stud that is movably connected with the screw tube, so that the stud could move up and down through rotation.
    Type: Application
    Filed: November 9, 2021
    Publication date: June 6, 2024
    Inventors: GANG LIU, ZIXIAN LIU, ZIDE LIU, YIYONG YUAN, HUA ZHAO, BO TANG
  • Publication number: 20240186250
    Abstract: A microelectronic assembly includes a substrate comprising: a panel including glass and defining an opening therein; an interconnect bridge (IB) in the opening and including interconnect pathways and IB through vias (IBTVs); and electrically conductive structures at a lower surface of the substrate to electrically couple the substrate to another component, at least some of the electrically conductive structures coupled to the IBTVs to form respective vertical electrical connections between the lower surface of the substrate and an upper surface of the substrate; and an electronic component (EC) layer on the upper surface of the substrate, the EC layer including a first active EC (AEC) and a second AEC electrically coupled to one another through the interconnect pathways, at least one of the first AEC or the second AECs further electrically coupled to one or more of the at least some of the electrically conductive structures.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Jeremy D. Ecton, Brandon Christian Marin, Srinivas V. Pietambaram, Tarek A. Ibrahim, Suddhasattwa Nad, Gang Duan, Haobo Chen, Hiroki Tanaka
  • Publication number: 20240182464
    Abstract: The present disclosure provides PROTAC compounds represented by Formula (A): D-L-DSM (A), or an enantiomer, a diastereoisomer, and/or a pharmaceutically acceptable salt of any one of the foregoing, wherein: DSM is a degradation signaling compound {e.g., an E3 ubiquitin ligase recruitment ligand, such as a CRBN ligand or a VHL ligand) covalently attached to a linker L; L is a linker that covalently attaches DSM to D; and D is a Bcl-xL inhibitor compound of Formula (I) or Formula (II) covalently attached to the linker L: (I); (II) wherein the definitions for the variables are described herein. Also provided are pharmaceutical compositions comprising the PROTAC compounds of the present disclosure and methods of use and methods of making thereof.
    Type: Application
    Filed: February 1, 2022
    Publication date: June 6, 2024
    Inventors: András Herner, Piroska Markacz, Gang Liu, Katsumasa Nakajima, Tibor Novak, Georges-Alain Franzetti, Jérôme-Benoît Starck, Frédéric Colland, Patrice Desos, Attila Paczal, Bianka Szokol, Mátyás Pál Timari, Vilibald Kun, Matthew T. Burger, Joseph Anthony D'Alessio, Katherine Elizabeth Seiss, Rany Mathew Thomas, Liang Zhao
  • Publication number: 20240181462
    Abstract: The present disclosure provides a PCR plate sealing film with good sealing effect, and relates to the technical field of experimental supplies, wherein the PCR plate sealing film comprises a supporting main plate and soft sealing films; L-shaped expansion rods are fixedly mounted on one end surface of the supporting main plate respectively; lateral-position limiting bars are fixedly mounted at lower ends of the two L-shaped expansion rods; a plurality of sealing bulges are integrally arranged on lower surfaces of the soft sealing films respectively; and the soft sealing films are located below the supporting main plate. The PCR plate sealing film provided by the present disclosure is fixed by a fixing component, to prevent the soft sealing films from moving up and down after being mounted.
    Type: Application
    Filed: November 9, 2021
    Publication date: June 6, 2024
    Inventors: BO TANG, ZIXIAN LIU, GANG LIU, ZIDE LIU, YIYONG YUAN, HUA ZHAO
  • Publication number: 20240186228
    Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a dielectric material and a plurality of metal vias within the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus. The metal vias electrically couple a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a plurality of build-up layers on the core layer, the build-up layers comprising metal vias electrically connected to the metal vias of the core layer.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Haobo Chen, Bohan Shan, Kyle J. Arrington, Yiqun Bai, Kristof Darmawikarta, Gang Duan, Jeremy D. Ecton, Hongxia Feng, Xiaoying Guo, Ziyin Lin, Brandon Christian Marin, Bai Nie, Srinivas V. Pietambaram, Dingying Xu
  • Publication number: 20240183638
    Abstract: Provided is a telescope range finder based on thermal image-wind speed-noise, which includes a range finder body, a wind speed measuring device, a noise measuring device, and a thermal image display device. The range finder body includes a processor. The wind speed measuring device includes a wind wheel, the wind wheel is connected to a tachometer, and the tachometer is connected to the processor. The noise measuring device includes a microphone, and the microphone is connected to an amplification-filtering-rectification circuit. The amplification-filtering-rectification circuit is connected to the processor. The microphone is configured to convert a noise into an electrical signal for entering the processor through the amplification,-filtering-rectification circuit. The thermal image display device includes a thermal image sensor. The thermal image sensor is disposed in the range finder body. The thermal image sensor is connected to a display through the processor.
    Type: Application
    Filed: September 12, 2023
    Publication date: June 6, 2024
    Inventors: Wu LIANG, Gang HE
  • Publication number: 20240185794
    Abstract: A pixel circuit and a driving method thereof, a display substrate, and a display device are provided. In the pixel circuit, a data writing circuit is configured to control a connection between a data line and a second terminal of a driving circuit under control of a first scanning signal provided by a first scanning line; a reset circuit is configured to control a connection between a reset voltage line and the second terminal of the driving circuit under control of a third scanning signal provided by a third scanning line; or the reset circuit is coupled to the third scanning line, the reset voltage line and a first terminal of the driving circuit, and is configured to control a connection between the reset voltage line and the first terminal of the driving circuit under control of the third scanning signal.
    Type: Application
    Filed: July 13, 2022
    Publication date: June 6, 2024
    Applicants: CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Gang WANG, Kai ZHANG, Xinyu WEI, Xingrui CAI, Qiang FU
  • Publication number: 20240186270
    Abstract: A microelectronic structure, a semiconductor package, an IC device assembly, and a method. The structure includes a core layer including an electrically non-conductive material; electrically conductive through core vias (TCVs) through the core layer; a dielectric layer on the core layer with electrically conductive structures extending therethrough and electrically coupled to the TCVs; and a magnetic inductor (MI) within at least one of the core layer or the build-up layer and including an antiferromagnetic (AF) structure. The AF structure includes a first ferromagnetic (FM) layer; an exchange coupling (EC) layer on the first FM layer and including a non-magnetic metal material; a second FM layer on the EC layer, the EC layer between the first FM layer and the second FM layer; and a pinning (P) layer including manganese and at least one of platinum or iridium, the second FM layer between the EC layer and the P layer.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Srinivas V. Pietambaram, Claudio A. Alvarez Barros, Beomseok Choi, Gang Duan, Jeremy D. Ecton, Brandon Christian Marin, Suddhasattwa Nad, Hiroki Tanaka
  • Publication number: 20240186227
    Abstract: In one embodiment, an integrated circuit package substrate includes a core layer comprising a plurality of metal vias electrically coupling a first side of the core layer and a second side of the core layer opposite the first side. The package substrate further includes a build-up layer on the first side of the core layer, the build-up layer comprising metal vias within a dielectric material and electrically connected to the metal vias of the core layer. The dielectric material includes Silicon, Oxygen, and at least one of Boron or Phosphorus.
    Type: Application
    Filed: December 2, 2022
    Publication date: June 6, 2024
    Applicant: Intel Corporation
    Inventors: Haobo Chen, Bohan Shan, Kyle J. Arrington, Kristof Darmawikarta, Gang Duan, Jeremy D. Ecton, Hongxia Feng, Xiaoying Guo, Ziyin Lin, Brandon Christian Marin, Srinivas V. Pietambaram, Dingying Xu
  • Publication number: 20240186279
    Abstract: The present disclosure relates to a system. The system may include a stage configured to support a substrate. The system may also include a bondhead configured to press a device against the substrate. The system may further include a light source configured to emit UV light towards the stage.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Minglu LIU, Yosuke KANAOKA, Jung Kyu HAN, Gang DUAN, Ziyin LIN
  • Publication number: 20240186281
    Abstract: The present disclosure is directed to a thermocompression bonding tool having a bond head with a surface for compression and heating and a sensor, a stage for compression and heating, and a controller, and a method for its use for chip gap height and alignment control. For chip gap height and alignment control, the controller is provided with a recipe displacement and temperature profile and measured offsets.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Minglu LIU, Andrey GUNAWAN, Gang DUAN
  • Publication number: 20240186280
    Abstract: The present disclosure is directed to an apparatus having a bond head configured to heat and compress a semiconductor package assembly, and a bonding stage configured to hold the semiconductor package assembly, wherein the bonding stage comprises a ceramic material including silicon and either magnesium or indium.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Minglu LIU, Andrey GUNAWAN, Gang DUAN, Edvin CETEGEN, Yuting WANG, Mine KAYA, Kartik SRINIVASAN, Mihir OKA, Anurag TRIPATHI
  • Publication number: 20240183250
    Abstract: A system for exploiting natural gas hydrate with downhole gas-liquid synergic depressurization includes a casing configured to form an exploitation well. An upper end of the exploitation well is connected to a produced gas collection pipeline, and the produced gas collection pipeline is configured to be connected to a produced gas recovery system. A perforated channel is distributed in a section of the casing located in a natural gas hydrate reservoir. A tubular string component assembly is mounted in the exploitation well, and includes an outer string, a production tubular string and an auxiliary riser. A first check valve is mounted at the bottom of the outer string, a gas supply pipeline is connected into an upper portion of the outer string, and a flow controller is mounted in the gas supply pipeline. The production tubular string is mounted in the outer string.
    Type: Application
    Filed: October 24, 2022
    Publication date: June 6, 2024
    Applicant: GUANGZHOU INSTITUTE OF ENERGY CONVERSION, CHINESE ACADEMY OF SCIENCES
    Inventors: Xiaosen Li, Xuke Ruan, Zhaoyang Chen, Gang Li, Yu Zhang, Yi Wang, Kefeng Yan, Jiayuan Zhou
  • Publication number: 20240187469
    Abstract: Various embodiments herein provide techniques for Session Description Protocol (SDP)-based signaling of camera calibration parameters for multiple video streams. In embodiments, a device may receive an SDP attribute to indicate that a bitstream included in a real-time transport protocol (RTP)-based media stream includes camera calibration parameters. The device may obtain the camera calibration parameters based on the SDP attribute, and process the RTP-based media stream based on the camera calibration parameters. In embodiments, the camera calibration parameters may be used to stitch together (e.g., align and/or synchronize) the multiple video streams. In embodiments, the stitched video streams may form an immersive video content (e.g., 360-degree video content). Other embodiments may be described and claimed.
    Type: Application
    Filed: October 24, 2023
    Publication date: June 6, 2024
    Inventors: Ozgur Oyman, Gang Shen, Wenqing Fu, Wei Zong, Juan Zhao
  • Publication number: 20240184943
    Abstract: A cable modeling method and system, and an electronic device are provided. The method includes: acquiring preset cable attributes of a cable and a preset laying scenario of the cable; determining a start point, an end point and a path point of the cable according to the preset laying scenario; inputting the preset attributes of the cable, the start point, the end point, and the path point into an Autodesk Revit software to model the cable, thereby to obtain a cable simulation model; and laying the cable according to the cable simulation model. The method first determines a start point, an end point, and the path point of the cable through the preset laying scenario, and then inputs the preset attributes, the start point, the end point, and the path point into the Autodesk Revit software to model the cable, so as to obtain a cable simulation model.
    Type: Application
    Filed: August 23, 2023
    Publication date: June 6, 2024
    Inventors: Guangliang Zheng, Bo Li, Dezhi Han, Fucai Hua, Liangyin Yang, Gang Wang, Shunxing Wang, Hongyun Zou, Lanmu Zeng, Du Yang, Jianjun Zhang, Wei Liu, Xin Shao, Yuan Kong, Xiao Wang
  • Publication number: 20240182549
    Abstract: Described herein are peptides and peptide-antibody fusions that bind to the SARS-CoV-2 S protein and the receptor binding domain (RED), and methods for using the compositions containing these antibodies in the treatment of COVID-19, Specifically, we developed novel CoV-2 S protein binding peptides making use of a naïve phage-displayed 16mer peptide library—wherein the CoV-2 S protein binding peptides bind epitopes in both the RBD and S protein outside of the RBD. In addition, we show that fusion of these peptides to the N-terminus of nAbs improves their apparent affinity, potency and breadth of neutralization, without compromising their developability profile, Thus, these peptides represent a novel class of SARS-CoV-2 S protein binders, which can be formatted in various ways to improve functional properties of nAbs to be used in the treatment of many different diseases.
    Type: Application
    Filed: March 31, 2022
    Publication date: June 6, 2024
    Inventors: Sachdev SIDHU, Shane MIERSCH, Gang CHEN, Jonathan LABRIOLA
  • Publication number: 20240186263
    Abstract: The present disclosure is directed to a semiconductor carrier platform having a support panel with a top surface and a bottom surface, with the top surface providing a working surface for assembling IC packages using panel-level packaging technology. In an aspect, a backside molding layer may be positioned on the bottom surface of the support panel to prevent or correct any panel warpage. In another aspect, a removable film may be positioned between the bottom surface of the support panel and the backside molding layer to allow the support panel to be readily cleaned and reused.
    Type: Application
    Filed: December 1, 2022
    Publication date: June 6, 2024
    Inventors: Hong Seung YEON, Liang HE, Whitney BRYKS, Jung Kyu HAN, Gang DUAN
  • Publication number: 20240184925
    Abstract: Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for securely executing customized computing workflows for selecting digital components are described. In one aspect, a method includes receiving a request for a digital component for presentation by a client device. In response to receiving the request, a pool of candidate digital components is retrieved from a repository of digital components, and each stage of a multi-stage workflow for selecting a digital component from the pool of digital components is executed in a sequence defined by the multi-stage workflow, including a filtering stage, a selection stage, and a rendering stage. After the rendering stage has been executed, a selected and packaged digital component is transmitted for receipt by the client device.
    Type: Application
    Filed: November 9, 2023
    Publication date: June 6, 2024
    Inventors: Gang Wang, Jacob Mark Hallberg, Rishav Anand, Raghava Hassan Nanjunda Swamy, Mengjie Xia
  • Publication number: 20240183266
    Abstract: Geothermal production monitoring systems and related methods are disclosed herein. An example system includes a production well, an injection well, a downhole pump or a downhole compressor to control a production of a multiphase fluid including steam from the production well, a first fluid conduit to transport the multiphase fluid away from the production well, a surface pump disposed downstream of the first fluid conduit, and a second fluid conduit. The surface pump is to inject water into the injection well via the second fluid conduit. A flowmeter is fluidly coupled to the first fluid conduit. The example system includes a processor to control at least one of (a) the downhole pump or the downhole compressor or (b) the surface pump in response to fluid property data generated by the first flowmeter.
    Type: Application
    Filed: February 12, 2024
    Publication date: June 6, 2024
    Inventors: Charles Toussaint, You Cheng Jee, Guillaume Jolivet, Cheng-Gang Xie