Abstract: Exemplary dual-channel showerheads may include an upper plate that defines a first plurality of apertures. The showerheads may include a base having a lower plate. The lower plate may define a second plurality of apertures and a third plurality of apertures. Each of the first plurality of apertures may be fluidly coupled with a respective one of the second plurality of apertures to define a fluid path extending from a top surface of the showerhead through a bottom surface of the showerhead. The base may define a gas inlet that is fluidly coupled with the third plurality of apertures. The base may be detachably coupled with the upper plate using one or more fastening mechanisms. The showerheads may include a compressible gasket positioned between the upper plate and the lower plate.

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber has a base component body. The base component body has an exterior surface configured to face a processing environment of the processing chamber. A textured skin is conformable to the exterior surface. The textured skin has a first side configured to be disposed against the exterior surface and a second side facing away from the first side. The second side has a plurality of engineered features configured to enhance adhesion of material deposited on the textured skin during use of the processing chamber.

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.

Abstract: A process kit ring for use in a plasma processing system is disclosed herein. The process kit ring includes an annular body and one or more hollow inner cavities. The annular body is formed from a plasma resistant material. The annular body has an outer diameter greater than 200 mm. The annular body includes a top surface and a bottom surface. The top surface is configured to face a plasma processing region of a process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.

Abstract: A process kit ring for use in a plasma processing system is disclosed herein. The process kit ring includes an annular body and one or more hollow inner cavities. The annular body is formed from a plasma resistant material. The annular body has an outer diameter greater than 200 mm. The annular body includes a top surface and a bottom surface. The top surface is configured to face a plasma processing region of a process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.

Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (?in).

Abstract: A substrate heater for a substrate processing chamber which includes a substrate support for a substrate processing chamber which includes a body having a top plate with a substrate receiving surface, and a movable heater disposed in the body, the heater being movable relative to the top plate.

Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

Abstract: Methods and apparatuses for determining in-situ a temperature of a substrate with a thermal sensor in a vacuum chamber are described herein. In one embodiment a thermal sensor has a transmitter configured to transmit electromagnetic waves, a receiver configured to receive electromagnetic waves, and a controller configured to control the transmitter and receiver, wherein the controller determines a temperature from a difference between the transmitted electromagnetic wave and the received electromagnetic wave.

Abstract: A chamber component for a processing chamber is disclosed herein. In one embodiment, a chamber component for a processing chamber has a base component body. The base component body has an exterior surface configured to face a processing environment of the processing chamber. A textured skin is conformable to the exterior surface. The textured skin has a first side configured to be disposed against the exterior surface and a second side facing away from the first side. The second side has a plurality of engineered features configured to enhance adhesion of material deposited on the textured skin during use of the processing chamber.

Abstract: Embodiments of the present disclosure generally relate to chemical mechanical polishing (CMP) of substrates. In one embodiment, a carrier head for a CMP apparatus is disclosed herein. The carrier head includes a body, a retaining ring, and a sensor assembly. The retaining ring is coupled to the body. The sensor assembly is positioned at least partially in the body. The sensor assembly includes a transmitter, an antenna, and a vibrational sensor. The transmitter has a first end and a second end. The antenna is coupled to the first end of the transmitter. The vibrational sensor is coupled to the second end. The vibrational sensor is configured to detect vibration during chemical mechanical processes with respect to radial, azimuthal, and angular axes of the carrier head.

Abstract: A process kit ring for use in a plasma processing system is disclosed herein. The process kit ring includes an annular body and one or more hollow inner cavities. The annular body is formed from a plasma resistant material. The annular body has an outer diameter greater than 200 mm. The annular body includes a top surface and a bottom surface. The top surface is configured to face a plasma processing region of a process chamber. The bottom surface is opposite the top surface. The bottom surface is substantially perpendicular to a centerline of the body. The bottom surface is supported at least partially by a pedestal assembly. The one or more hollow inner cavities are formed in the annular body about the centerline. The one or more hollow inner cavities are arranged in a circle within the annular body.

Abstract: Apparatus for supporting a substrate are provided herein. In some embodiments, a substrate support includes a susceptor plate having a top surface; a recess formed within the top surface, wherein the recess is defined by an edge; and a plurality of angled support elements disposed within the recess and along the edge of the recess, wherein each angled support element comprises a first surface downwardly sloped toward a center of the recess.

Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.

Abstract: Methods for fabricating and refurbishing an assembly are disclosed herein. The method begins by applying an adhesive layer onto a first substrate. A second substrate is placed onto the adhesive layer, thereby securing the two substrates together, the adhesive layer bounding at least one side of a channel that extends laterally between the substrates to an exterior of the assembly. And, the substrates and the adhesive layer are subjected to a bonding procedure and allowing outgassing of volatiles from the adhesive layer to escape from between the substrates through the channel, wherein the substrates bonded by the adhesive layer form a component for a semiconductor vacuum processing chamber.

Abstract: Implementations described herein protect a retaining ring for a polishing system from corrosive polishing chemistries. In one embodiment, a retaining ring has a ring-shaped body having a top surface, an inside diameter sidewall, an outer diameter sidewall and a bottom surface. The inside diameter side wall is configured to circumscribe a substrate. The ring shaped body has a rigid ring-shaped portion, a polymeric ring-shaped portion stacked on the rigid ring-shaped portion and covering at least three sides of the rigid ring-shaped portion, a plurality of grooves formed in the bottom surface, and a plurality of wash ports formed through the polymeric ring-shaped portion, wherein the wash ports are isolated from the rigid ring-shaped portion.

Abstract: Methods for bonding substrates, forming assemblies using the same, along with improved methods for refurbishing said assemblies are disclosed that take advantage of at least one channel formed in an adhesive utilized to join two substrates to improve fabrication, performance and refurbishment of the assemblies. In one embodiment an assembly includes a first substrate secured to a second substrate by an adhesive layer. The assembly includes a channel having at least one side bounded by the adhesive layer and having an outlet exposed to an exterior of the assembly.

Abstract: A retaining ring and a chemical mechanical planarization system (CMP) are disclosed. In one embodiment, a retaining ring for a polishing system includes a ring-shaped body having a polished inner diameter. The body has a bottom surface having grooves formed therein, an outer diameter wall, and an inner diameter wall, wherein the inner diameter wall is polished to a roughness average (Ra) of less than about 30 microinches (?in).

Abstract: Methods and apparatuses for determining in-situ a temperature of a substrate with a thermal sensor in a vacuum chamber are described herein. In one embodiment a thermal sensor has a transmitter configured to transmit electromagnetic waves, a receiver configured to receive electromagnetic waves, and a controller configured to control the transmitter and receiver, wherein the controller determines a temperature from a difference between the transmitted electromagnetic wave and the received electromagnetic wave.

Abstract: Embodiments described herein relate to an apparatus and method for a substrate heater for a substrate processing chamber. In one embodiment, a substrate support for a substrate processing chamber includes a body having a top plate with a substrate receiving surface, and a movable heater disposed in the body, the heater being movable relative to the top plate.