Abstract: A system and method for enhancing image quality. The system and method acquire a machine learning model trained for correlating one or more training images and one or more training design images. The system and method receive one or more sample specimen images corresponding to one or more features of a sample specimen. The system and method enhance the one or more sample specimen images by generating one or more enhanced images with the machine learning model based on at least the one or more sample specimen images.

Abstract: Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.

Abstract: Methods and systems for creating a sample of defects for a specimen are provided. One method includes detecting defects on a specimen based on output generated by a detector of an output acquisition subsystem. For the defects detected in an array region on the specimen, where the array region includes multiple array cell types, the method includes stacking information for the defects based on the multiple array cell types. The stacking includes overlaying design information for only a first of the multiple array cell types with the information for only the defects detected in the first of the multiple array cell types. In addition, the method includes selecting a portion of the detected defects based on results of the stacking thereby creating a sample of the detected defects.

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).

Abstract: Methods and systems for determining a position of output generated by an inspection subsystem in design data space are provided. In general, some embodiments described herein are configured for substantially accurately aligning inspection subsystem output generated for a specimen to a design for the specimen despite deformation of the design in the inspection subsystem output. In addition, some embodiments are configured for generating and/or using alignment targets that can be shared across multiple specimens of the same layer and design rule for alignment of inspection subsystem output generated for a specimen to a design for the specimen.

Abstract: Systems and methods for detecting defects on a wafer are provided. One method includes generating test image(s) for at least a portion of an array region in die(s) on a wafer from frame image(s) generated by scanning the wafer with an inspection system. The method also includes generating a reference image for cell(s) in the array region from frame images generated by the scanning of the wafer. In addition, the method includes determining difference image(s) for at least one cell in the at least the portion of the array region in the die(s) by subtracting the reference image from portion(s) of the test image(s) corresponding to the at least one cell. The method further includes detecting defects on the wafer in the at least one cell based on the difference image(s).