Patents by Inventor Garrett E. Clark
Garrett E. Clark has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11970010Abstract: An example printhead includes a circulation channel having an inlet for receiving a fluid and an outlet for expelling the fluid, a first nozzle fluidically coupled to the circulation channel, the first nozzle being operable at a first absolute pressure, and a second nozzle fluidically coupled to the circulation channel, the second nozzle being operable at a second absolute pressure, the absolute second pressure being lower than the first absolute pressure. The absolute pressure in the circulation channel decreases as the fluid flows from the inlet to the outlet, and the first nozzle is positioned closer to the inlet of the circulation channel than the second nozzle.Type: GrantFiled: November 13, 2019Date of Patent: April 30, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Jacob Lum, James A. Feinn, Mengqian Lu, Garrett E. Clark
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Patent number: 11958293Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: June 3, 2021Date of Patent: April 16, 2024Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Publication number: 20230382109Abstract: In some examples, a fluidic die includes an arrangement of fluidic elements to dispense a fluid, where each fluidic element of the fluidic elements includes a fluidic actuator and a fluid chamber. The fluidic die includes an array of fluid feed holes in a plurality of dimensions to communicate the fluid with the fluidic elements, where each of multiple fluid feed holes along a first dimension of the plurality of dimensions is distinct from multiple fluid feed holes along a second dimension of the plurality of dimensions. The fluidic die includes circuit elements interspersed in regions between the fluidic elements along different axes of the fluidic die, where each circuit element of the circuit elements includes an active device. The fluidic elements and the circuit elements are formed on a common substrate.Type: ApplicationFiled: October 23, 2020Publication date: November 30, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Eric T. Martin, James R. Przybyla, Garrett E. Clark
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Patent number: 11807005Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: GrantFiled: March 28, 2023Date of Patent: November 7, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Lam J. Choy
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Publication number: 20230347646Abstract: An example fluid ejection device comprises a plurality of distinct fluid channels. Each fluid channel comprises a distinct fluid inlet to the ejection device. A subset of the plurality of distinct fluid channels comprises fluid recirculating fluid channels, and the remaining fluid channels comprising non-recirculating fluid channels.Type: ApplicationFiled: May 22, 2020Publication date: November 2, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Daryl Eugene Anderson, James R. Przybyla, Eric T. Martin, Garrett E. Clark
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Publication number: 20230286262Abstract: A fluidic die includes fluid-transfer elements, and a temperature sensor to monitor a temperature on the fluidic die. The fluidic die includes a trickle-warming circuit to warm fluid transferrable by the fluid-transfer elements, and a pulse-warming circuit to warm the fluid. A warming control circuit selectively activates the trickle-warming and pulse-warming circuits.Type: ApplicationFiled: July 31, 2020Publication date: September 14, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Eric Thomas Martin, Garrett E. Clark, Jeremy Spencer, Vincent C. Korthuis, Rogelio Cicili
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Patent number: 11712896Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: GrantFiled: April 4, 2022Date of Patent: August 1, 2023Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
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Publication number: 20230234355Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.Type: ApplicationFiled: March 28, 2023Publication date: July 27, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-lam J. Choy
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Publication number: 20230103786Abstract: A fluid ejection die may include a fluid actuator, a substrate supporting the fluid actuator, a chamber layer supported by the substrate and a bypass passage in the substrate. The substrate may include a closed inlet channel having an inlet opening for connection to an outlet of a fluid source and an outlet channel having an outlet opening of a first size for connection to an inlet of the fluid source. The chamber layer includes a recirculation passage to supply fluid for ejection by the fluid actuator through an ejection orifice and to circulate fluid across the fluid actuator from the closed inlet channel to the outlet channel. The bypass passage is of a second size less than the first size and connects the inlet channel to the inlet of the fluid source while bypassing any fluid actuator provided for ejecting fluid through an ejection orifice.Type: ApplicationFiled: March 11, 2020Publication date: April 6, 2023Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jacob M. Lum, Si-lam J. Choy, Jeffrey R. Pollard, Tsuyoshi Yamashita, Jeremy Sells, Garrett E. Clark
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Publication number: 20220379627Abstract: An example printhead includes a circulation channel having an inlet for receiving a fluid and an outlet for expelling the fluid, a first nozzle fluidically coupled to the circulation channel, the first nozzle being operable at a first absolute pressure, and a second nozzle fluidically coupled to the circulation channel, the second nozzle being operable at a second absolute pressure, the absolute second pressure being lower than the first absolute pressure. The absolute pressure in the circulation channel decreases as the fluid flows from the inlet to the outlet, and the first nozzle is positioned closer to the inlet of the circulation channel than the second nozzle.Type: ApplicationFiled: November 13, 2019Publication date: December 1, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jacob Lum, James A. Feinn, Mengqian Lu, Garrett E. Clark
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Publication number: 20220379607Abstract: An example printhead includes a set of circulation channels for flowing a fluid therethrough, the set of nozzles including higher-pressure channels and lower-pressure channels; a first nozzle array having a first nozzle; a second nozzle array having a second nozzle, the first nozzle and the second nozzle forming a row region; a first inter-channel passage fluidically coupling the first nozzle to a first pair of adjacent circulation channels, the first pair including a higher-pressure channel on a first side of a lower-pressure channel; and a second inter-channel passage fluidically coupling the second nozzle to a second pair of adjacent circulation channels, the second pair including a higher-pressure channel on a second side of a lower-pressure channel, the second side being opposite the first side.Type: ApplicationFiled: December 10, 2019Publication date: December 1, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Jacob Lum, James A. Feinn, Mengqian Lu, Garrett E. Clark
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Patent number: 11440008Abstract: Examples include microfluidic devices. Example microfluidic devices comprise a microfluidic channel, a capillary chamber, and a fluidic actuator. The microfluidic channel is fluidly connected to the capillary chamber. The capillary chamber is to restrict flow of fluid therethrough. The fluidic actuator is positioned proximate the capillary chamber. The fluidic actuator is to actuate to thereby initiate flow of fluid through the capillary chamber.Type: GrantFiled: April 14, 2016Date of Patent: September 13, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Devin Alexander Mourey, Michael W Cumbie, Garrett E Clark
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Publication number: 20220227131Abstract: Examples include a fluid ejection device. The fluid ejection device includes a fluid ejection die with a die length and a die width, the fluid ejection die being coupled with a support structure having a fluid supply channel therethrough. The fluid ejection die includes a plurality of nozzles arranged in columns at die length positions along the die length and die width positions along the die width such that only one nozzle is positioned at each die length position. A fluid ejection chamber is coupled with each respective nozzle of the plurality of nozzles, and fluid feed hole fluidically coupled with the fluid supply channel and each respective ejection chamber.Type: ApplicationFiled: April 4, 2022Publication date: July 21, 2022Inventors: Galen Cook, Garrett E. Clark, Michael W. Cumbie, James R. Przybyla, Richard Seaver, Frank D. Derryberry, Si-Iam J. Choy
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Patent number: 11325379Abstract: A fluid ejection die may include a number of fluid ejection chambers laid to correlate with a number of dividers formed in a fluid channel layer such that adjacent fluid ejection chambers are alternatively arranged on a relatively higher-temperature side of the fluid ejection die and a relatively lower-temperature side of the fluid ejection die.Type: GrantFiled: March 12, 2018Date of Patent: May 10, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventor: Garrett E. Clark
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Patent number: 11305537Abstract: Examples include a fluid ejection device. The fluid ejection device includes at least one fluid ejection die coupled to a support structure and having a die length and a die width. The at least one fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The at least one fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The at least one fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes at least one fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: April 19, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-Iam J Choy
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Publication number: 20220111645Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.Type: ApplicationFiled: December 23, 2021Publication date: April 14, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen
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Publication number: 20220105726Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.Type: ApplicationFiled: December 15, 2021Publication date: April 7, 2022Applicant: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Michael W. Cumbie, Mark H. MacKenzie
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Patent number: 11285731Abstract: A fluid ejection device may include fluid actuators, ejection chambers adjacent the fluid actuators, nozzles extending from the ejection chambers, and fluid feed holes to supply fluid from a fluid supply passage to the ejection chambers. The fluid feed holes have ports connected to the ejection chambers. The ports are sized to pass bubbles formed by the fluid actuators out of the ejection chambers.Type: GrantFiled: January 9, 2019Date of Patent: March 29, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Michael W. Cumbie
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Patent number: 11247470Abstract: Examples include a fluid ejection die having a die length and a die width. The fluid ejection die may include a plurality of nozzles arranged along the die length and a die width. The plurality of nozzles is arranged such that at least one pair of neighboring nozzles are positioned at different die width positions along the width of the fluid ejection die. The example fluid ejection die further includes a plurality of ejection chambers including a respective ejection chamber fluidically coupled to each respective nozzle. The fluid ejection die further includes an array of fluid feed holes. The array of fluid feed holes includes a first respective fluid feed hole fluidically coupled to each respective ejection chamber, and the array of fluid feed holes includes a second respective fluid feed hole fluidically coupled to each respective ejection chamber.Type: GrantFiled: March 12, 2018Date of Patent: February 15, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
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Patent number: 11235574Abstract: A fluid propelling apparatus, including a plastic compound, a MEMS at least partially surrounded by the compound, and a heat sink next to the MEMS, to transfer heat away from the MEMS, wherein the heat sink is at least partly surrounded by the compound.Type: GrantFiled: February 29, 2016Date of Patent: February 1, 2022Assignee: Hewlett-Packard Development Company, L.P.Inventors: Garrett E. Clark, Michael W. Cumbie, Chien-Hua Chen