Abstract: An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first layer deposited upon a substrate, a second layer deposited on a top surface of the first layer, and the via spanning multiple layers. The via can include a first bottom that is formed on a top surface of the first layer and a first sidewall that upstands from the first bottom and extending at least through the second layer.

Abstract: An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas.

Abstract: An electronic module assembly including a via spanning multiple layers in a wafer based module is described. The electronic module assembly can include a first layer deposited upon a substrate, a second layer deposited on a top surface of the first layer, and the via spanning multiple layers. The via can include a first bottom that is formed on a top surface of the first layer and a first sidewall that upstands from the first bottom and extending at least through the second layer.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: An electronic module subassembly including a substrate. The substrate includes a bottom laminate, a middle laminate coupled to the bottom laminate, and a top laminate coupled to the middle laminate. The middle laminate has a plurality of web areas, each web area defining at least one hole. The defines a planar top surface and a plurality of open areas corresponding to and aligned with the plurality of web areas. First components have a first thickness. At least one first component is in each of the open areas. Second components have a second thickness relatively larger than the first thickness. At least one second component is in each of the open areas. The second components extend into the respective at least one hole of the web areas. Encapsulant fills in the open areas and the web areas.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: In accordance with a method for forming an interposer, a fill hole is formed in a first side of a substrate and a cavity is formed in a second side. The cavity is in fluidic communication with the fill hole. A plurality of posts is formed in the cavity, and an encapsulant is injected through the fill hole into the cavity to encapsulate the plurality of posts. In accordance with a method of thermal management, an electronic component and a heat sink are disposed on opposing sides of an interposer that includes a plurality of encapsulated posts.

Abstract: In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.

Abstract: Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.

Abstract: Electronic modules are formed by encapsulating microelectronic dies within cavities in a substrate.

Abstract: Electronic modules and interposers are formed by encapsulating microelectronic dies and/or posts within cavities in a substrate.

Abstract: Microelectronic dies are thinned according to a variety of approaches, which may include bonding the dies to a substrate under vacuum, disposing a film over the dies and the substrate, and/or changing a center of pressure during thinning.

Abstract: Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die approximately simultaneously.

Abstract: A robotic wafer handler has first and second arms pivotally connected at a swing point to operate in a plane. Each arm is independently drivable through greater than 360.degree. of rotation in the plane. The wafer handler may also include mechanisms for adjusting the plane of rotation, i.e., for providing lift and tilt.

Abstract: A process chamber configurable for the execution of discrete subprocesses in a substrate coating process such as photolithography. Two vertically staggered rings disposed within the process chamber channel a flow of gas through the chamber and retain fluent chemical within the process environment. A replaceable liner further enables reconfiguration of the chamber. The chamber is used for low-velocity dispensing of fluent process chemical onto the substrate surface with a laminar exhaust gas flow through ventilation passages formed about the rings. The chamber is also used during high-velocity spinning of the substrate for even process chemical distribution in a solvent saturated atmosphere. The ventilation passages enable high exhaust flow through the chamber while minimizing the direct impingement of exhaust air on the substrate.

Abstract: In the coating apparatus disclosed herein, a semiconductor wafer is held on a vacuum chuck mounted on the spindle of a bidirectional servo motor. The servo motor is energized by a servo amplifier in response to the amplitude of the control signal provided to the amplifier. Dispensing means are provided for placing coating material on wafer held in the chuck. An oscillator is provided generating a periodic output signal of controllable amplitude and period. A programmable sequencer is operative in a first time period for appying the oscillatory output signal as a control signal to the servo amplifier thereby to angularly oscillate a wafer held in the chuck and for operating the dispensing means to place a predetermined amount of coating material on the wafer. The sequencing means is operative in a later time period for applying a fixed higher amplitude control signal to the servo amplifier thereby to spin the wafer and spread the coating material.