Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body.

Abstract: An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.

Abstract: An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body.