Abstract: A method of mounting print head transducers to a diaphragm includes providing a print head transducer slab with a diaphragm, heating the transducer slab and the diaphragm to a cure temperature, pressing the diaphragm to the slab to form an assembly at the cure temperature, and dicing the slab to separate the slab into an array of print head transducers after pressing the diaphragm to the slab, wherein the array of print head transducers align with an array of body cavities, thereby mounting the array of print head transducers to the diaphragm.

Abstract: An electrostatic actuator for a printhead. The electrostatic actuator may include a substrate. A dielectric layer may be disposed on the substrate. An electrode layer may be disposed on the dielectric layer. A first standoff layer may be disposed at least partially on the electrode layer. A second standoff layer may be disposed at least partially on the electrode layer and at least partially on the first standoff layer. A portion of the second standoff layer disposed on the electrode layer may be removed to form one or more landing pads. A membrane may be disposed at least partially on the second standoff layer.

Abstract: The printhead can include a nonwebbed diaphragm layer, an aperture plate layer, and a first webbed layer and a second webbed layer interposed between the diaphragm layer and the aperture plate layer. The nonwebbed diaphragm layer can be configured to deflect and eject ink from the print head during printing. The aperture plate layer can include a plurality of nozzles from which ink is ejected during printing. Each of the first and second webbed layers can include a first surface having a first surface area and comprising a plurality of first openings, a second surface opposing the first surface and comprising a plurality of second openings, and a web comprising a portion of the first surface, a portion of the second surface and a plurality of holes extending between the plurality of first and second openings. The printhead can be formed, in part, of alternating webbed and adjacent nonwebbed layers.

Abstract: An electrostatic actuator array including a plurality of recesses within an actuator membrane and a method for forming same. In an embodiment, a width of each recess is wider than a width of each bonding feature of a plurality of bonding features, and each bonding feature extends into one of the recesses. In another embodiment, a width of each recess is narrower than a width of each bonding feature. In each embodiment, adhesive within the recesses bonds the membrane to the bonding feature. The recesses provide a flow path for the adhesive to reduce or prevent adhesive encroachment into an air chamber within which an actuator electrode is located.

Abstract: An ink jet printhead includes a nozzle plate including a nozzle, a recess in the nozzle plate, and a compliant layer that covers the recess and forms a sealed pocket that may be filled with air or another gas during use of the printhead. During actuation of a piezoelectric element during the ejection of ink from the nozzle, the sealed pocket attenuates an acoustic energy generated by the piezoelectric element, thereby reducing crosstalk to adjacent nozzles by the acoustic energy.

Abstract: A method for forming a printhead including one or more channels. The method can include depositing and selectively sintering a first layer of powder into a sintered layer that forms a first discrete cross-sectional region of a printhead structure for the printhead. A plurality of layers of powder can be sequentially deposited and selectively sintered into a plurality of sintered layers that form discrete cross-sectional regions of the printhead structure and form at least a portion of at least one or more channels. Each of the plurality of layers of powder is deposited directly onto at least one sintered layer. Each of the plurality of sintered layers is integrally bonded to at least one other sintered layer.

Abstract: Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads. A piezoelectric element array for an ink jet print head can include a plurality of piezoelectric elements spaced from adjacent piezoelectric elements by an interstitial space. Each piezoelectric element can include a central void space formed in a first intermediate layer between the piezoelectric element array and a second intermediate layer that is operable to function as a free space for portions of the piezoelectric elements to actuate into when subjected to the voltage.

Abstract: A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process.

Abstract: A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.

Abstract: A structure and method for a post plate of a die set that can be used to emboss a plurality of contact pads of a flexible printed circuit during the formation of a printer printhead. In one embodiment, a plurality of post plate posts can be formed, where each post plate post has a flat upper surface, generally straight sides, and a sharp corner where the flat upper surface and the generally straight sides intersect. Each post can be polished using, for example, a pad and an abrasive polishing compound or an electrochemical polishing process, to round the sharp corners to form a post having a rounded contour. In another embodiment, a plurality of post plate posts each having a rounded contour can be formed using a molding process.

Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto with an adhesive; (b) placing an encapsulant thin film on the piezoelectric transducers; and (c) applying heat, pressure, or a combination thereof to the encapsulant thin film to a degree sufficient to cause the encapsulant to encapsulate the adhesive.

Abstract: Implementations relate to methods, devices produced by the method, and systems using the devices, for forming three-dimensional interconnect structures for ink piezoelectric printheads.

Abstract: An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.

Abstract: An ink jet print head including a plurality of standoff layer supports in an interstitial region between adjacent piezoelectric elements, and method of formation. The plurality of standoff layer supports can be formed from the same layer(s) as the piezoelectric elements, or from a dielectric layer such as a polymer. The standoff layer supports increase an area to which a standoff layer can be attached, thereby forming a more secure attachment of a circuit layer such as a flex circuit or a printed circuit board to a jet stack subassembly.

Abstract: Disclosed is a process for preparing an ink jet printhead which comprises: (a) providing a diaphragm plate having a plurality of piezoelectric transducers bonded thereto; (b) aligning an electrical circuit board having a fill joint with the piezoelectric transducers and temporarily attaching the electrical circuit board to the piezoelectric transducers, thereby creating a layered structure having interstitial spaces between the diaphragm plate, the piezoelectric transducers, and the electrical circuit board; (c) applying a thermoset polymer through the fill joint and allowing it to fill the interstitial spaces via capillary action; and (d) curing the thermoset polymer to form an interstitial polymer layer.

Abstract: A printhead and methods for forming the printhead are provided. The printhead includes an additively manufactured printhead structure having multiple sintered material layers that correspond to discrete cross-sectional regions of the printhead structure, where each of the sintered material layers is integrally bonded to at least one other sintered material layer. The printhead further includes a polymer layer attached to a surface of the printhead structure, and the printhead structure includes one or more channels for flowing ink through the printhead structure, the one or more channels forming openings on at least one surface of the printhead structure.

Abstract: A method for forming an ink jet print head can include attaching a plurality of piezoelectric elements to a diaphragm of a jet stack subassembly, electrically attaching a flex circuit to the plurality of piezoelectric elements, then dispensing an dielectric underfill between the flex circuit and the jet stack subassembly. The use of an underfill after attachment of the flex circuit eliminates the need for the patterned removal of an interstitial material from the tops of the piezoelectric elements, and removes the requirement for a patterned standoff layer. In an embodiment, electrical contact between the flex circuit and the piezoelectric elements is established through physical contact between bump electrodes of the flex circuit and the piezoelectric elements, without the use of a separate conductor, thereby eliminating the possibility of electrical shorts caused by misapplication of a conductor.

Abstract: A method and structure for forming an ink jet print head having a dielectric interstitial layer. A flexible top plate attached to a press can be used to apply pressure to an uncured dielectric interstitial layer. The uncured dielectric interstitial layer is cured while contacting the uncured dielectric interstitial layer with the flexible top plate and applying pressure using the press. Using a flexible top plate rather than a rigid top plate has been found to form a cured interstitial layer over an array of piezoelectric elements which has a more uniform or planar upper surface. An interstitial layer so formed can result in decreased processing time, reduced problems with ink communication in the ink jet print head during use, and decreased manufacturing costs.

Abstract: A method of mounting transducers to a diaphragm includes merging a transducer slab with a diaphragm, pressing the diaphragm to the slab to form an assembly, and dicing the slab to separate the slab into an array of transducers after pressing the diaphragm to the array, wherein the array of transducers align with an array of body cavities.

Abstract: A method and structure for an ink jet printhead, and a printer including the ink jet printhead. The printhead can include a polymer as a film spacer which separates an electrical interconnect such as a printed circuit board or a flexible circuit from a printhead diaphragm, such that the film spacer is interposed between the electrical interconnect and the diaphragm. In an embodiment, a piezoelectric actuator is free from contact with the film spacer. Embodiments of a process for forming the printhead may have reduced processing stages requiring fewer manufacturing tools than some other processes. Embodiments of the resulting printhead and printer may have fewer structural components than some other printheads and printers.