Abstract: Various embodiments of the present invention provide systems and methods for governing power dissipation in a semiconductor device. For example, various embodiments of the present invention provide semiconductor devices that include a first function circuit, a second function circuit, and a power state change control circuit. The power state change control circuit is operable to determine a combination of power states of the first function circuit and the second function circuit that provides an overall power dissipation within a power dissipation level.

Abstract: Various embodiments of the present invention provide systems and methods for improved semiconductor design. For example, various embodiments of the present invention provide methods for semiconductor design that include receiving a semiconductor design with at least a first function circuit and a second function circuit; simulating the semiconductor design using a first instruction and a second instruction; determining a power state transition between the first instruction and the second instruction; and augmenting the semiconductor design to implement the determined power state transition. Simulating the semiconductor design using a first instruction and a second instruction identifies an indication of a first subset of the first function circuit and the second function circuit used in executing the first instruction and a second subset of the first function circuit and the second function circuit used in executing the second instruction.

Abstract: Various embodiments of the present invention provide systems and methods for ramping current usage in a semiconductor device. For example, various embodiments of the present invention provide semiconductor devices that include at least a first function circuit and a second function circuit, and a power state change control circuit. The power state change control circuit is operable to transition the power state of the first function circuit from a reduced power state to an operative power state, and to transition the second function circuit from a reduced power state to an operative power state. Transition of the power state of at least one of the first function circuit and the second function circuit is done in at least a first stage at a first time and a second stage at a second time, with the second time being after the first time.

Abstract: Various embodiments of the present invention provide systems and methods for governing power dissipation in a semiconductor device. For example, various embodiments of the present invention provide semiconductor devices that include a first function circuit, a second function circuit, and a power state change control circuit. The power state change control circuit is operable to determine a combination of power states of the first function circuit and the second function circuit that provides an overall power dissipation within a power dissipation level.

Abstract: Methods and structure for standardized, high-speed serial communication to reduce memory capacity requirements within receiving elements of a high-speed serial communication channel. In an exemplary SPI compliant embodiment of the invention, the semantic meaning of the STARVING, HUNGRY and SATISFIED flow control states is modified to allow the transmitting and receiving elements to manage buffer storage in a more efficient manner to thereby reduce memory capacity requirements while maintaining the integrity of flow control contracts and commitments. The methods and structure further provide for generation of storage metric information to dynamically update the flow control status information asynchronously with respect to data packet transmissions.

Abstract: A method for generalizing design attributes in a design capture environment comprising the steps of (A) defining a procedure for adding one or more auxiliary configurators to a tool or suite of tools, (B) linking the auxiliary configurators to predetermined object points in an abstracted design and (C) defining a procedure for the tool or suite of tools to reference the one or more auxiliary configurators, wherein the auxiliary configurators are neither referenced by a core nor built into the tool or suite of tools.

Abstract: An apparatus includes a first semiconductor die and at least one further semiconductor die. A substrate is attached to the first die and the further die and has an electrical interconnect pattern that interconnects contacts on the first die with respective contacts on the further die. Features of the interconnect pattern have positions on the substrate with smaller tolerances relative to positions of the contacts on the first die than to positions of the contacts on the further die.

Abstract: An SIP for performing a plurality of hard and soft functions comprises standard IC die and custom platforms mounted to a substrate. Die are identified for each standard hard function, such as memory, processing, I/O and other standard functions and one or more user-configurable base platforms are selected that, when configured, execute the custom soft functions. Optionally, the substrate is laminated to the die and the platforms are attached to the substrate. Testing is performed by defining the configured base platforms coupled to logic representing the die and their connections and performing placement and timing closure on the combination.

Abstract: A process is disclosed for configuring a base platform having ASIC and FPGA modules to perform a plurality of functions. A verified RTL hardware description of a circuit is mapped and annotated to identify memory programmable functions. The memory programmable functions are grouped for assignment to FPGA modules. The non-memory programmable functions are synthesized to ASIC modules, and the memory programmable functions are synthesized to FPGA modules. Placement, signal routing and boundary timing closure are completed and the platform is configured by adding metallization layer(s) to configure the ASIC modules and creating a firmware memory to configure the FPGA modules. An over-provisioning feature in the FPGA modules permits post-fabrication alteration of logic functions.

Abstract: A set of tools is provided herein that produces useful, proven, and correct integrated semiconductor chips. Having as input either a customer's requirements for a chip, or a design specification for a partially manufactured semiconductor chip, the tools generate the RTL for control plane interconnect; memory composition, test, and manufacture; embedded logic analysis, trace interconnection, and utilization of spare resources on the chip; I/O qualification, JTAG, boundary scan, and SSO analysis; testable clock generation, control, and distribution; interconnection of all of the shared logic in a testable manner from a transistor fabric and/or configurable blocks in the slice. The input customer requirements are first conditioned by RTL analysis tools to quickly implement its logic. The slice definition and the RTL shell provides the correct logic for a set of logic interfaces for the design specification to connect. The tools share a common database so that logical interactions do not require multiple entries.

Abstract: A method for designing an Application Specific Integrated Circuit (ASIC) structure on a semiconductor substrate, includes (a) defining a class of circuit designs, the class having a common design part shared within the class and a custom design part variable for individual designs in the class, (b) allocating a set of bottom layers and a set of top metal layers to implement the common design part, the allocated sets of bottom layers and top metal layers having a fixed pattern for the class, and (c) implementing the custom design part using metal layers above the allocated set of bottom layers and below the allocated set of top metal layers. The method may further includes characterizing the ASIC for the common design and using the fixed patterns of the allocated set of bottom layers and the allocated set of top metal layers.