Abstract: An apparatus including a storage area to store instructions and a controller to control power in a first device based on the instructions. In operation, the controller generates one or more signals to combine power from a first power source and a second power source for a hybrid power operation. The controller is to generate the one or more signals based on a connection state of the first device, multiple connection states of the first device, a charge level of a battery of the first device, or a combination thereof.

Abstract: An apparatus including a storage area to store instructions and a controller to control power in a first device based on the instructions. In operation, the controller generates one or more signals to combine power from a first power source and a second power source for a hybrid power operation. The controller is to generate the one or more signals based on a connection state of the first device, multiple connection states of the first device, a charge level of a battery of the first device, or a combination thereof.

Abstract: A housing device is described that protects hardware and software useful in connecting a personal computer (PC) to a network. The housing device is versatile so as to allow for a plurality of configuration and installation combinations. This versatility allows an installer to mount the housing device either horizontally or vertically. When mounted horizontally, the installer has yet another option to prop the housing device upright via use of an easel on the back or allow it to lie flat with the easel folded under a main body component. Serrated edges are provided on the easel so as to allow for tension to be placed on the wires or cables coupled to the housing device so that the wires or cables do not become disconnected from the housing device.

Abstract: A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

Abstract: An integrated heat dissipation apparatus includes an attachment area, a heat exchange area thermally connected to the attachment area, and an air flow generation area that is integrally formed with the attachment area and the heat exchange area. A thermally conductive member extends between the attachment area and the heat exchange area to facilitate the removal of heat from the attachment area to the heat exchange area. A generated air flow passes through the heat exchange area.

Abstract: A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.

Abstract: A heat sink may be spring strapped onto a socketed processor using clips that engage the spring strap and that are pre-positioned on the circuit board. The clips may be C-shaped and may include an upper spring arm portion, a vertical portion, and a base which may be surface mounted to the circuit board. The upper spring arm of the C-shaped clip then releasably engages the spring strap to clamp the heat sink firmly onto the socketed processor.