Abstract: An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The assembly includes a first heat exchanger configured to guide exhaust gas of an internal combustion engine past an opening defined by the first heat exchanger, and a heat sink configured to couple thermally the TEG to the exhaust gas and fluidicly seal the opening. The assembly is configured so the heat sink is directly exposed to the exhaust gas so that heat is efficiently transferred from the exhaust gas to the TEG.

Abstract: An assembly for coupling thermally a thermoelectric generator (TEG) to an exhaust manifold of an internal combustion engine. The exhaust manifold forms a first heat exchanger configured to couple thermally heat from exhaust gas to an outer surface of the first heat exchanger. The outer surface is preferably formed of stainless steel. A first dielectric layer is formed by firing a thick-film dielectric material onto the stainless steel of the first heat exchanger. A first conductor layer is formed by firing a conductive thick-film onto the first dielectric layer. A first paste layer of silver (Ag) based sintering paste is interposed between the first conductor layer and a first contact of the TEG. The first contact is sintered to the first conductor layer when the assembly is suitably arranged and suitably heated.

Abstract: An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the substrates. The substrates, lead frames, and electronic devices are sintered together using silver-based sintering paste between each layer. The material and thicknesses of the substrates and lead frames are selected so stress experienced by the electronic devices caused by changes in temperature of the assembly are balanced from the center of the assembly, thereby eliminating the need for balancing stresses at a substrate level by applying substantially matching metal layers to both sides of the substrates.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract: A liquid cooled power electronics assembly configured to use electrically conductive coolant to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly, and then forms another metallic seal between the device assembly and a housing. The configuration allows for more direct contact between the electronic device and the coolant, while protecting the electronic device from contact with potentially electrically conductive coolant. Material used to form the dielectric plates and the housing are selected to have similar coefficients of thermal expansion (CTE) so that the reliability of the seals is maximized.

Abstract: A vapor conduit having a first cross sectional area is connected to an evaporator for refrigerant exiting the evaporator. The evaporator is connected to a reservoir by a filling conduit having a second cross sectional area. A first liquid plug is disposed in the vapor conduit and a second liquid plug is disposed in the filling conduit. A first sum of forces acting on the first liquid plug is less than a second sum of forces acting on the second liquid plug (56) causing the refrigerant to expand into the vapor conduit to a greater extent than into the filling conduit causing continuous circulation of the refrigerant in the same direction. The first cross sectional area of the vapor conduit is greater than the second cross sectional area of the filling conduit for causing the first sum of forces to be greater than the second sum of forces.

Abstract: A thermal stack laminate and a process for producing the same are disclosed. The thermal stack laminate includes a baseplate formed from a heat sink material that has on a first surface a very thin thermally sprayed alumina layer to serve as a dielectric and attached to the alumina is a kinetic spray applied solderable layer. An electrical component is attached to the thermal stack laminate by solder. The thermal stack laminate optionally includes a kinetic spray applied first and/or second metal matrix composite layer between the baseplate and the alumina layer and between the alumina layer and the solderable material. In addition, one other optional layer comprises a first layer of the solderable material applied via a thermal spray process followed by the remainder of the solderable material applied by a kinetic spray process.

Abstract: A glass substrate having an electrically conductive, abrasion-resistant, wire pattern embedded in the surface thereof made by grooving the surface of the glass, electrolytically codepositing metal and glass particles in the groove, and firing the composite to fuse the glass particles to themselves and to the glass substrate for retaining the electrodeposited metal in the groove and providing abrasion resistance thereto.

Abstract: Tungsten halogen lamps require a fill pressure of several atmospheres. To verify the fill pressure at the time of manufacture the pressure is indirectly measured by first measuring the speed of sound within the lamp. A shock wave is produced within the lamp by rapidly heating a lamp filament or producing an arc between two adjacent filaments and measuring the time required for the shock wave to sequentially disturb two spaced light beams passing through the lamp. The speed of sound is determined from the measured time and the pressure is calculated from the speed of sound.

Abstract: Both junctions of a thin film thermocouple are formed on one side of a glass substrate. That side of the substrate is exposed to the diesel engine oil the soot content of which is to be measured. A light source on the other side of the substrate has its radiation directed through the substrate to a location at one of the junctions so that the light is absorbed by the oil adjacent that junction to a degree determined by its soot content. The temperature of the oil and the adjacent junction are increased by an amount dependent on the soot concentration and the thermocouple output is therefore a measure of the soot concentration in the engine oil.

Abstract: A method and apparatus for heterodyne detection of coherent Raman signals from a Raman active sample exhibiting a Raman-induced Kerr effect. More specifically, a method and apparatus is disclosed for generating a local oscillator output and heterodyning this output with a portion of a probe laser output having its polarization shifted by 90 degrees due to a Raman-induced Kerr effect in a Raman active sample. A probe laser output and a pump laser output are directed into and intersect within the Raman active sample. When their frequency difference is equal to a Raman mode frequency, a non-linear optically induced birefringence in the sample shifts the probe polarization and produces a signal at the output of a polarization analyzer. This signal is heterodyned with a local oscillator output having substantially the same frequency.