Abstract: A method and apparatus for the flame hydrolysis deposition (FHD) of a core material on a substrate provides a holder for a substrate which is heated to a predetermined temperature selected to maintain the substrate temperature relatively constant during the FHD process. As a result, the thickness of a thin film applied to the substrate is relatively uniform as is the index of refraction of the core material deposited on the substrate. In one embodiment, a chuck for receiving a disk-shaped substrate wafer is supplied with an embedded electrical heater for maintaining the chuck temperature at from about 700° C. to about 900° C. In another embodiment, a gas heater positioned on a side of the chuck opposite the wafer mounting is provided to heat the chuck at substantially the same temperature.

Abstract: A method for making moisture resistant semiconductor devices having organic substrates targets each of the potentially critical interfaces within a semiconductor device having the potential for delamination and cracking. An organic substrate (110) is designed to include a solid pad (116) having a chemically created oxide layer (118) formed thereon. A silicone-based die attach material (108) is dispensed and gelled very soon after dispensing to prevent excessive bleed. A semiconductor die (102) is mounted to the substrate after undergoing a cleaning operation to remove contaminants from the backside of the die. Prior to molding compound encapsulation and subsequent to die attach material cure, the substrate is cleaned to improve adhesion to the die attach material fillet (122).

Abstract: A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.

Abstract: A process is described for attaching optical fiber to a semiconductor die in which a first droplet of adhesive is applied to the die and partially gelled to form a cushion for receiving the end of the optical fiber to be attached thereto.