Patents by Inventor Gary Lam
Gary Lam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240094324Abstract: Systems, methods, and apparatus for processing a signal using a non-uniform antenna array are disclosed. In one aspect, a receiver apparatus for processing high frequency signals is provided. The receiver apparatus may comprise an antenna array including a plurality of antenna elements. The plurality of antenna elements may include a first antenna element and a remainder of the plurality of antenna elements. The remainder of the plurality of antenna elements may be uniformly spaced apart from one another by a first distance and arranged in a substantially linear orientation. The remainder of the plurality of antenna elements may include a second antenna element spaced apart from the first antenna element by a second distance. The second distance may be different than the first distance.Type: ApplicationFiled: September 9, 2022Publication date: March 21, 2024Inventors: Gary A. Ray, Tai A. Lam, Alec Adams
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Patent number: 11132602Abstract: An example system includes prediction workers, training workers, and a parameter server. The prediction workers store a local copy of a machine-learned model and run the mode exclusively in serving mode. The training workers store a local copy of a machine-learned model and a local snapshot and run the local copy exclusively in training mode and compare the local model or state to the snapshot after training to send delta updates to the parameter server after training. The parameter server aggregates received delta updates into a master copy of the model, sends the aggregated updates back to training workers and provides two types of updates; a real-time update based on a comparison of the master model with a local snapshot, and a full update. The real-time update occurs at least an order of magnitude more frequently than the full update and includes a subset of the weights in the model.Type: GrantFiled: August 11, 2017Date of Patent: September 28, 2021Assignee: Twitter, Inc.Inventors: Zhiyong Xie, Yue Lu, Pengjun Pei, Gary Lam, Shuanghong Yang, Yong Wang, Ziqi Huang, Xiaojiang Guo, Van Lam, Lanbo Zhang, Bingjun Sun, Sridhar Iyer, Sandeep Pandey, Qi Li, Dong Wang
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Patent number: 7232761Abstract: Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.Type: GrantFiled: August 24, 2004Date of Patent: June 19, 2007Assignee: Applied Materials, Inc.Inventors: Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, David Mai, Fred C. Redeker
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Publication number: 20060025049Abstract: Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a first adjustable droplet size, and at least a second nozzle disposed on the delivery portion and adapted to dispense the polishing fluid with a second adjustable droplet size.Type: ApplicationFiled: April 27, 2005Publication date: February 2, 2006Inventors: Lizhong Sun, Lei Zhu, Gary Lam, Robert Jackson, Wei-Yung Hsu
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Patent number: 6960521Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.Type: GrantFiled: September 13, 2004Date of Patent: November 1, 2005Assignee: Applied Materials, Inc.Inventors: Yongsik Moon, David Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana, Yongqi Hu, Tony S. Kaushal, Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, Fred C. Redeker
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Publication number: 20050032381Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.Type: ApplicationFiled: September 13, 2004Publication date: February 10, 2005Inventors: Yongsik Moon, David Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana, Yongqi Hu, Tony Kaushal, Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, Fred Redeker
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Publication number: 20050026442Abstract: Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.Type: ApplicationFiled: August 24, 2004Publication date: February 3, 2005Inventors: Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, David Mai, Fred Redeker
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Patent number: 6790768Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.Type: GrantFiled: December 18, 2001Date of Patent: September 14, 2004Assignee: Applied Materials Inc.Inventors: Yongsik Moon, David Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana, Yongqi Hu, Tony S. Kaushal, Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, Fred C. Redeker
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Patent number: 6780773Abstract: Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.Type: GrantFiled: July 11, 2002Date of Patent: August 24, 2004Assignee: Applied Materials Inc.Inventors: Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, David Mai, Fred C. Redeker
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Publication number: 20030029841Abstract: Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.Type: ApplicationFiled: December 18, 2001Publication date: February 13, 2003Applicant: Applied Materials, Inc.Inventors: Yongsik Moon, David Mai, Kapila Wijekoon, Rajeev Bajaj, Rahul Surana, Yongqi Hu, Tony S. Kaushal, Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, Fred C. Redeker
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Publication number: 20030022497Abstract: Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.Type: ApplicationFiled: July 11, 2002Publication date: January 30, 2003Applicant: Applied Materials, Inc.Inventors: Shijian Li, Jui-Lung Li, Shi-Ping Wang, Gary Lam, David Mai, Fred C. Redeker