Abstract: A memory module for an electronic system, such as a personal computer or server, includes a double-sided, 184-pin, dual in-line memory module printed circuit board. A plurality of individual electronic components are mounted on both sides of the printed circuit board. Each electronic component includes an electronic component printed circuit board, a first pair of stacked memory dies electrically connected to the electronic component printed circuit board, a second pair of stacked memory dies electrically connected to the electronic component printed circuit board, and a thin small outline ball grid array package at least partially encapsulating the first and second pairs of stacked memory dies. Preferably, an insulator is disposed between each pair of stacked memory dies.

Abstract: An electrical socket is disclosed for interfacing between a printed circuit board having contact pads and an electronic module having external leads, such as an integrated circuit. The electrical socket includes a base frame, containing an opening generally conforming to the body shape and size of the electronic module, and a plurality of spaced, parallel conductive members, such as electrical wires, arrayed on a resilient strip coextensive with at least part of the surface of the opening. Each conductive member includes both a lead portion in adjacent parallel relationship with one of the electronic module external leads and a contact portion in electrical engagement with a contact pad, and may also include a retaining portion for securing the conductive member to the resilient strip. The electrical socket may include a cover, with thermal vent holes, to secure the electronic module within the base frame opening.