Abstract: Thermally assisted processes for removing internal defects in glass ceramic products, specifically electrical shorts formed in a substrate during product fabrication, are set forth. According to one aspect of the invention, a method for repairing shorts between metallic conductors located within in a glass ceramic product, such as an electronic substrate, comprises the steps of (a) pre-conditioning the glass to resist cracking from the generation of heat by any shorts melt down current subsequently applied to said conductors; and (b) subsequently applying a melt down current to said conductors to repair any short located therebetween. The aforestated method minimizes the potential for glass damage resulting from defect repair activity and optimizes defect repair yield.

Abstract: A method for locating electrical short circuits in an electronic substrate containing a plurality of conductive paths. A pair of shorted paths is identified and a current signal is applied thereto. Simultaneously, the voltage across the shorted paths is measured. The current signal is then increased in incremental steps until the voltage starts to vary nonlinearly with respect to the current signal. A temperature differential is then created between the substrate as a whole and small sectors of the substrate until the measured nonlinear relationship between current and voltage reverses in the direction of resuming a linear relationship. The small sector which caused the voltage to respond to the temperature differential is then identified, thereby identifying the approximate location of the short circuit.