Patents by Inventor Gary Paul Morrison

Gary Paul Morrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 10262957
    Abstract: An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.
    Type: Grant
    Filed: April 10, 2018
    Date of Patent: April 16, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20180301428
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: April 10, 2018
    Publication date: October 18, 2018
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 9941228
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: April 10, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20170229408
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: April 25, 2017
    Publication date: August 10, 2017
    Inventors: Rajen Manicon MURUGAN, Minhong MI, Gary Paul MORRISON, Jie CHEN, Kenneth Robert RHYNER, Stanley Craig BEDDINGFIELD, Chittranjan Mohan GUPTA, Django Earl TROMBLEY
  • Millimeter wave integrated circuit with ball grid array package including transmit and receive channels
    Patent number: 9666553
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Grant
    Filed: June 15, 2015
    Date of Patent: May 30, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Rajen Manicon Murugan, Minhong Mi, Gary Paul Morrison, Jie Chen, Kenneth Robert Rhyner, Stanley Craig Beddingfield, Chittranjan Mohan Gupta, Django Earl Trombley
  • MILLIMETER WAVE INTEGRATED CIRCUIT WITH BALL GRID ARRAY PACKAGE INCLUDING TRANSMIT AND RECEIVE CHANNELS
    Publication number: 20150364816
    Abstract: A millimeter wave integrated circuit (IC) chip. The IC chip comprises an IC die and a wire bond ball grid array package encapsulating the IC die. The wire bond ball grid array package comprises a solder ball array, a millimeter wave transmit channel, and a millimeter wave receive channel, wherein each millimeter wave transmit and receive channel electrically couples the IC die to a signal ball of the solder ball array and is configured to resonate at an operating frequency band of the millimeter wave IC chip.
    Type: Application
    Filed: June 15, 2015
    Publication date: December 17, 2015
    Inventors: Rajen Manicon MURUGAN, Minhong MI, Gary Paul MORRISON, Jie CHEN, Kenneth Robert RHYNER, Stanley Craig BEDDINGFIELD, Chittranjan Mohan GUPTA, Django Earl TROMBLEY
  • WSP DIE HAVING REDISTRIBUTION LAYER CAPTURE PAD WITH AT LEAST ONE VOID
    Publication number: 20130299967
    Abstract: A MP die with a redistribution layer (“RDL”) capture pad having at least one void therein and having an RDL capture pad outer peripheral edge and an under bump metal (“UBM”) pad positioned above the RDL capture pad and having a UBM pad outer peripheral edge positioned laterally inwardly of the RDL capture pad outer peripheral edge and positioned laterally outwardly of all the voids in the RDL capture pad.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 14, 2013
    Applicant: Texas Instruments Incorporated
    Inventors: Jeffrey David Daniels, Gary Paul Morrison
  • WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD
    Publication number: 20130299966
    Abstract: A WSP die having a redistribution layer (“RDL”) with an RDL capture pad that has an RDL pad central axis RR and a RDL pad outer peripheral edge arranged about the RDL capture pad central axis RR and an under bump metal (UBM) pad positioned above the RDL capture pad. The UBM pad has a UBM pad central axis UU and a UBM pad outer peripheral edge arranged around the UBM pad central axis UU. The UBM pad central axis UU is laterally offset from the RDL pad central axis RR.
    Type: Application
    Filed: May 10, 2012
    Publication date: November 14, 2013
    Applicant: Texas Instruments Incorporated
    Inventors: Anil KV Kumar, Gary Paul Morrison