Abstract: A mounting assembly for mounting a piece of equipment, such as a power distribution unit to a rack. The mounting assembly includes a mounting bracket attached to the rack, a mounting plate attached to the equipment and a hinge assembly connecting the mounting plate to the first end of the mounting bracket while an attachment mechanism connects the mounting plate to the mounting bracket. A method of accessing the interior of the rack is also disclosed.

Abstract: A mounting assembly for mounting a piece of equipment, such as a power distribution unit to a rack. The mounting assembly includes a mounting bracket attached to the rack, a mounting plate attached to the equipment and a hinge assembly connecting the mounting plate to the first end of the mounting bracket while an attachment mechanism connects the mounting plate to the mounting bracket. A method of accessing the interior of the rack is also disclosed.

Abstract: In a network sensor assembly, network environmental monitor, and associated fabrication methods, a network sensor assembly comprises a panel configured for mounting on a surface, a plurality of addressable sensors coupled to the panel that sense environmental conditions at the surface, a memory device that stores configuration information associated with the plurality of addressable sensors, and a bus. The bus is communicatively coupled to the plurality of addressable sensors and the memory device and is configured for communicatively coupling the network sensor assembly to a network node for communicating data associated with the sensed environmental conditions in a network.

Abstract: A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.

Abstract: A modular high-density computer system has an infrastructure that includes a framework component forming a plurality of bays and has one or more cooling components. The computer system also has one or more computational components that include a rack assembly and a plurality of servers installed in the rack assembly. Each of the one or more computational components is assembled and shipped to an installation site separately from the infrastructure and then installed within one of the plurality of bays after the infrastructure is installed at the site.

Abstract: In a network sensor assembly, network environmental monitor, and associated fabrication methods, a network sensor assembly comprises a panel configured for mounting on a surface, a plurality of addressable sensors coupled to the panel that sense environmental conditions at the surface, a memory device that stores configuration information associated with the plurality of addressable sensors, and a bus. The bus is communicatively coupled to the plurality of addressable sensors and the memory device and is configured for communicatively coupling the network sensor assembly to a network node for communicating data associated with the sensed environmental conditions in a network.

Abstract: The invention provides a modular network sensor assembly operable to sense environmental conditions at a computer or equipment rack. The network sensor assembly includes a flexible body operable to be folded along a central fold line. The central fold line separates the flexible body into a first panel and second panel. A number of mounting tabs are hingedly attached to either the first panel or second panel. These mounting tabs are operable to secure the network assembly to the computer rack. A number of sensor tabs are located along the central fold line. Addressable sensors capable of sensing environmental conditions are positioned proximate to the sensor tabs, and communicatively coupled to a common bus. A memory device is also communicatively coupled to the common bus and is operable to store configuration information and data associated with the sensed environmental conditions sampled by the addressable sensors.

Abstract: Systems, methods, and media associated with a rack-mountable device are described. One exemplary system embodiment includes a display having a corner to diagonally opposite corner dimension of at least seventeen inches, a pointing apparatus having at least three buttons, a communication access port positioned on the front of the device, and an identification light positioned on the front of the device. In one example, the device will fold open and shut. In one example, the device will fit into a 1 U (1.75 inch) rack space when the device is folded shut and will have a QWERTY keyboard having a horizontal dimension of at least fourteen inches.