Patents by Inventor Gary W. Schulze

Gary W. Schulze has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS OF INSTALLING WIRE BONDING TOOLS ON WIRE BONDING SYSTEMS, AND RELATED INSTALLATION TOOLS AND SYSTEMS
    Publication number: 20230112270
    Abstract: A method of installing a wire bonding tool on a wire bonding system is provided. The method includes the steps of: (a) holding a wire bonding tool with an installation tool; (b) engaging the wire bonding tool in an aperture of a transducer of a wire bonding system while the wire bonding tool is held by the installation tool; (c) securing the wire bonding tool in the aperture; and (d) releasing the wire bonding tool from the installation tool.
    Type: Application
    Filed: June 21, 2022
    Publication date: April 13, 2023
    Inventors: Jon W. Brunner, Gary W. Schulze, Aashish Shah
  • Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
    Patent number: 8365977
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Grant
    Filed: July 25, 2012
    Date of Patent: February 5, 2013
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze
  • ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS
    Publication number: 20120286023
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Application
    Filed: July 25, 2012
    Publication date: November 15, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze
  • Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
    Patent number: 8251275
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Grant
    Filed: August 10, 2010
    Date of Patent: August 28, 2012
    Assignee: Kulicke and Soffa Industries, Inc.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze
  • ULTRASONIC TRANSDUCERS FOR WIRE BONDING AND METHODS OF FORMING WIRE BONDS USING ULTRASONIC TRANSDUCERS
    Publication number: 20120125977
    Abstract: A method of forming a wire bond using a bonding tool coupled to a transducer is provided. The method includes the steps of: (1) applying electrical energy to a driver of the transducer at a first frequency; and (2) applying electrical energy to the driver at a second frequency concurrently with the application of the electrical energy at the first frequency, the first frequency and the second frequency being different from one another.
    Type: Application
    Filed: August 10, 2010
    Publication date: May 24, 2012
    Applicant: KULICKE AND SOFFA INDUSTRIES, INC.
    Inventors: Dominick A. DeAngelis, Gary W. Schulze