Patents by Inventor Gary W. Williams

Gary W. Williams has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11960840
    Abstract: A method executed by a computing device includes determining a set of identigens for each query word of a query to produce sets of identigens, where a set of identigens represents different meanings of a word of the query. The method further includes obtaining a first identigen selection for a first query word from the first set of identigens. The method further includes interpreting, using identigen pairing rules and based on the first identigen selection, the sets of identigens to produce a query entigen group. The method further includes accessing a knowledge database utilizing the query entigen group to produce a response entigen group. The method further includes generating a response to the query using the response entigen group, where the response includes at least one response word.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: April 16, 2024
    Assignee: entigenlogic LLC
    Inventors: Frank John Williams, Stephen Emerson Sundberg, Ameeta Vasant Reed, Dennis Arlen Roberson, Thomas James MacTavish, Karl Olaf Knutson, Jessy Thomas, Niklas Josiah MacTavish, David Michael Corns, II, Andrew Chu, Kyle Edward Alberth, Ali Fattahian, Zachary John McCord, Ahmad Abdelqader Abunaser, Gary W. Grube
  • Patent number: 11954608
    Abstract: A method performed by a computing device includes generating a comparative query entigen group set based on a comparative query in accordance with identigen rules, where the comparative query entigen group set represents a most likely interpretation of the comparative query. The method further includes obtaining a first response entigen group from a knowledge database based on a first comparative query entigen group of the comparative query entigen group set, where the first response entigen group substantially includes the first comparative query entigen group. The method further includes obtaining a second response entigen group from the knowledge database based on a second comparative query entigen group of the comparative query entigen group set, where the second response entigen group substantially includes the second comparative query entigen group. The method further includes generating a comparative response based on the first response entigen group and the second response entigen group.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: April 9, 2024
    Assignee: entigenlogic LLC
    Inventors: Frank John Williams, David Ralph Lazzara, Stephen Emerson Sundberg, Ameeta Vasant Reed, Dennis Arlen Roberson, Thomas James MacTavish, Karl Olaf Knutson, Jessy Thomas, Niklas Josiah MacTavish, David Michael Corns, II, Andrew Chu, Theodore Mazurkiewicz, Gary W. Grube
  • Publication number: 20240070395
    Abstract: A method executed by a computing device includes determining a set of identigens for each phrase word of a phrase to produce sets of identigens. A set of identigens of the sets of identigens represents one or more different meanings of a phrase word of the phrase. The method further includes obtaining sensor information for one or more phrase words of the phrase. The method further includes selecting an identigen of a first set of identigens based on the sensor information to produce a first identigen selection for the first set of identigens having a selected meaning of one or more different meanings of the first phrase word. The method further includes interpreting remaining sets of identigens of the sets of identigens to produce an entigen group so that the entigen group represents a most likely meaning interpretation of the phrase.
    Type: Application
    Filed: October 27, 2023
    Publication date: February 29, 2024
    Applicant: entigenlogic LLC
    Inventors: Frank John Williams, Stephen Emerson Sundberg, Ameeta Vasant Reed, Dennis Arlen Roberson, Thomas James MacTavish, Karl Olaf Knutson, Jessy Thomas, Niklas Josiah MacTavish, David Michael Corns, II, Andrew Chu, Kyle Edward Alberth, Ali Fattahian, Zachary John McCord, Ahmad Abdelqader Abunaser, Gary W. Grube
  • Patent number: 9241622
    Abstract: The invention provides methods for detecting ocular surface defects. The methods of the invention can be used to detect ocular surface diseases, such as dry eye, uveitis, conjunctivitis, keratitis, keratoconjunctivitis, vernal keratoconjunctivitis (VKC), atopic keratoconjunctivitis (AKC), autoimmune disorders of the ocular surface, meibomianitis, conjunctival hyperemia, eyelid hyperemia, ocular rosacea, ocular inflammation, or eye lid swelling.
    Type: Grant
    Filed: February 14, 2011
    Date of Patent: January 26, 2016
    Assignee: Alcon Research, Ltd.
    Inventors: Richard L. Ornberg, Gary W. Williams
  • Patent number: 9232889
    Abstract: The invention provides apparatuses and methods for detecting corneal surface defects. The methods and/or an apparatus of the invention can be used to detect corneal surface diseases, such as dry eye.
    Type: Grant
    Filed: February 11, 2010
    Date of Patent: January 12, 2016
    Assignee: Alcon Research, Ltd.
    Inventors: Richard L. Ornberg, Gary W. Williams
  • Publication number: 20110164218
    Abstract: The invention provides apparatuses and methods for detecting ocular surface defects. The methods and/or an apparatus of the invention can be used to detect ocular surface diseases, such as dry eye, uveitis, conjunctivitis, keratitis, keratoconjunctivitis, vernal keratoconjunctivitis (VKC), atopic keratoconjunctivitis (AKC), autoimmune disorders of the ocular surface, meibomianitis, conjunctival hyperemia, eyelid hyperemia, ocular rosacea, ocular inflammation, or eye lid swelling.
    Type: Application
    Filed: February 14, 2011
    Publication date: July 7, 2011
    Applicant: ALCON RESEARCH, LTD.
    Inventors: Richard L. Ornberg, Gary W. Williams
  • Patent number: 7791889
    Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB. The second PCB has at least two processors and is coupled to and disposed on a first side of the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules are coupled to and disposed on a second side of the first PCB, the first and second power modules providing redundant power to the two processors on the second PCB.
    Type: Grant
    Filed: February 16, 2005
    Date of Patent: September 7, 2010
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian L. Belady, Eric C. Peterson, Shaun L. Harris, Steven A. Belson, Gary W. Williams
  • Publication number: 20100204584
    Abstract: The invention provides apparatuses and methods for detecting corneal surface defects. The methods and/or an apparatus of the invention can be used to detect corneal surface diseases, such as dry eye.
    Type: Application
    Filed: February 11, 2010
    Publication date: August 12, 2010
    Applicant: ALCON RESEARCH, LTD.
    Inventors: Richard L. Ornberg, Gary W. Williams
  • Publication number: 20100173852
    Abstract: The present invention provides compositions and methods for treating glaucoma, ocular hypertension, and age-related macular degeneration. More specifically, the present invention describes the use of agents that down-regulate expression of tanis and/or p21Waf1/Cip1/Sd1 genes to treat such disorders of the eye.
    Type: Application
    Filed: March 8, 2010
    Publication date: July 8, 2010
    Applicant: ALCON, INC.
    Inventors: Colene D. Drace, Gary W. Williams, Curtis R. Kelly, Najam A. Sharif
  • Patent number: 7718697
    Abstract: The present invention provides compositions and methods for treating glaucoma, ocular hypertension, and age-related macular degeneration. More specifically, the present invention describes the use of agents that down-regulate expression of tanis and/or p21Waf1/Cip1/Sd1 genes to treat such disorders of the eye.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: May 18, 2010
    Assignee: Alcon, Inc.
    Inventors: Colene D. Drace, Gary W. Williams, Curtis R. Kelly, Najam A. Sharif
  • Patent number: 7499281
    Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
    Type: Grant
    Filed: January 2, 2008
    Date of Patent: March 3, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shaun L. Harris, Steven A. Belson, Eric C. Peterson, Gary W. Williams, Christian L. Belady
  • Patent number: 7475175
    Abstract: An apparatus comprises a plurality of logically independent processors, a system bus, and a cache control and bus bridge device in communication with the plurality of processors such that the cache control and bus bridge device is logically interposed between the processors and the system bus, and wherein the processors and cache control and bus bridge device are disposed in a module form factor such that the apparatus is a drop-in replacement for a standard single processor module.
    Type: Grant
    Filed: March 15, 2004
    Date of Patent: January 6, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David A. Klein, Christian L. Belady, Shaun L. Harris, Michael C. Day, Jeffrey P. Christenson, Brent A. Boudreaux, Stuart C. Haden, Eric Peterson, Jeffrey N. Metcalf, James S. Wells, Gary W. Williams, Paul A. Wirtzberger, Roy M. Zeighami, Greg Huff
  • Patent number: 7345885
    Abstract: A heat spreader with multiple stacked printed circuit boards (PCBS) includes top and side sections within which a first PCB is contained and bottom edges that extend to a second PCB. The heat spreader and second PCB substantially enclose the first PCB therein.
    Type: Grant
    Filed: December 22, 2004
    Date of Patent: March 18, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Brent A. Boudreaux, Shaun L Harris, Eric C. Peterson, Christian L Belady, Gary W. Williams, Stuart C. Haden
  • Patent number: 7336490
    Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system. An exemplary electronic module includes a printed circuit board (PCB) having a memory and plural processors. A power system couples to and is disposed vertically above the PCB. A thermal dissipation device is disposed between the power system and the PCB for dissipating heat, via a direct heat exchange, from both the power system and the plural processors.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: February 26, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shaun L. Harris, Steven A. Belson, Eric C. Peterson, Gary W. Williams, Christian L. Belady
  • Patent number: 7327569
    Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. An electronic module is removably connectable to a system board. The electronic module has first and second portions. The first portion is connected to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device extends between the processor and the system board. The second portion connects on top of the first portion and has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
    Type: Grant
    Filed: December 13, 2004
    Date of Patent: February 5, 2008
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian L. Belady, Gary W. Williams, Shaun L. Harris, Steven A. Belson, Eric C. Peterson
  • Patent number: 7289328
    Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: October 30, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian L. Belady, Gary W. Williams, Shaun L. Harris, Steven A. Belson, Eric C. Peterson, Stuart C. Haden
  • Patent number: 7280364
    Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) coupled to a second PCB. The second PCB has at least two processors and is disposed above the first PCB. A thermal dissipation device is disposed above the second PCB, dissipates heat away from the two processors, and provides an airflow path. A power system is adjacent the thermal dissipation device and in a pathway of the airflow path.
    Type: Grant
    Filed: November 24, 2004
    Date of Patent: October 9, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Shaun L. Harris, Steven A. Belson, Eric C. Peterson, Gary W. Williams, Christian L. Belady, Jeffrey P. Christenson
  • Patent number: 7280365
    Abstract: One embodiment includes an electronic assembly having a first printed circuit board (PCB) and a second PCB having at least two processors. The second PCB is coupled to and disposed above the first PCB. A thermal dissipation device dissipates heat away from the processors. First and second power modules supply power to the second PCB and are separated and redundant power supplies such that upon failure of the first power module, the second power module can provide power for both power modules to the second PCB.
    Type: Grant
    Filed: February 18, 2005
    Date of Patent: October 9, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Steven A. Belson, Shaun L. Harris, Eric C. Peterson, Gary W. Williams, Christian L. Belady, Jeffrey P. Christenson
  • Patent number: 7254027
    Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: August 7, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Christian L. Belady, Gary W. Williams, Shaun L. Harris, Steven A. Belson, Eric C. Peterson
  • Patent number: 7154754
    Abstract: An assembly comprises a voltage regulator module and a field-pluggable voltage converter module configured in an arrangement that interlocks with and optionally attaches to the voltage regulator module.
    Type: Grant
    Filed: December 29, 2004
    Date of Patent: December 26, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Stephan Karl Barsun, Gary W. Williams