Patents by Inventor Gary W. Yeager
Gary W. Yeager has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20080275185Abstract: Poly(arylene ether)-poly(alkylene ether) block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a poly(alkylene ether), and an activated aromatic carbonate.Type: ApplicationFiled: June 15, 2006Publication date: November 6, 2008Applicant: GENERAL ELECTRIC COMPANYInventors: Rene deKok, Erik R. Delsman, Amy R. Freshour, Farah Jean-Jacques Toublan, Patrick J. McCloskey, Edward N. Peters, Gary W. Yeager
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Publication number: 20070208145Abstract: Poly(arylene ether)-polyester block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a hydroxy-terminated polyester, and an activated aromatic carbonate.Type: ApplicationFiled: June 15, 2006Publication date: September 6, 2007Applicant: GENERAL ELECTRIC COMPANYInventors: Rene de Kok, Erik R. Delsman, Amy R. Freshour, Farah Jean-Jacques Toublan, Edward N. Peters, Gary W. Yeager
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Publication number: 20070208159Abstract: Poly(arylene ether)-polycarbonate block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a hydroquinone, a poly(arylene ether), and an activated aromatic carbonate.Type: ApplicationFiled: June 15, 2006Publication date: September 6, 2007Applicant: GENERAL ELECTRIC COMPANYInventors: Patrick J. McCloskey, Warren W. Reilly, Elliott W. Shanklin, Gary W. Yeager
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Publication number: 20070208144Abstract: Poly(arylene ether)-polysiloxane block copolymers and methods for their preparation are provided. The block copolymers include structural units derived from a poly(arylene ether), a hydroxyaryl-terminated polysiloxane, and an activated aromatic carbonate.Type: ApplicationFiled: June 15, 2006Publication date: September 6, 2007Applicant: GENERAL ELECTRIC COMPANYInventors: Erik R. Delsman, Amy R. Freshour, Farah Jean-Jacques Toublan, Gary W. Yeager
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Patent number: 6774160Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.Type: GrantFiled: February 27, 2002Date of Patent: August 10, 2004Assignee: General Electric CompanyInventor: Gary W. Yeager
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Patent number: 6770691Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.Type: GrantFiled: February 27, 2002Date of Patent: August 3, 2004Assignee: General Electric CompanyInventor: Gary W. Yeager
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Patent number: 6767639Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.Type: GrantFiled: February 27, 2002Date of Patent: July 27, 2004Assignee: General Electric CompanyInventor: Gary W. Yeager
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Patent number: 6617398Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.Type: GrantFiled: August 30, 2001Date of Patent: September 9, 2003Assignee: General Electric CompanyInventors: Gary W. Yeager, Robert E. Colborn
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Publication number: 20020111398Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; (c) a thermoplastic resin, and (d) a bismaleimide resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.Type: ApplicationFiled: February 27, 2002Publication date: August 15, 2002Inventor: Gary W. Yeager
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Publication number: 20020107308Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.Type: ApplicationFiled: February 27, 2002Publication date: August 8, 2002Inventor: Gary W. Yeager
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Publication number: 20020107307Abstract: A cured composition is the cured residue of a curable composition including (a) an epoxy resin essentially free of bromine atoms, a curing agent for the epoxy resin, (b) a flame retardant additive that is the condensation product of (i) a brominated phenol or a mixture of brominated phenols with (ii) a cyanuric halide; and (c) a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferably is a triazine. The preferred thermoplastic resin is a poly(phenylene ether). The cured composition further including a reinforcement may be used in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics. Laminates including the cured compositions and a metal foil are also described.Type: ApplicationFiled: February 27, 2002Publication date: August 8, 2002Inventor: Gary W. Yeager
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Patent number: 6387990Abstract: A curable composition is formulated from an epoxy resin; a flame-retardant additive essentially free of phenolic groups and of epoxy groups; and a thermoplastic resin. The preferred epoxy resin is a mixture of an epoxy resin with less than 2 glycidyl ether groups per molecule and an epoxy resin that has greater than 2 glycidyl ether groups per molecule. The preferred flame-retardant additive is a brominated heterocyclic compound that preferable is triazine. The preferred thermoplastic resin is a poly(phenylene ether). The inventive curable compositions advantageously can be combined with reinforcement in the manufacture of circuit boards having excellent electrical properties, good solvent resistance, and good thermal expansion characteristics.Type: GrantFiled: September 10, 1999Date of Patent: May 14, 2002Assignee: General Electric CompanyInventor: Gary W. Yeager
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Publication number: 20020028337Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.Type: ApplicationFiled: August 30, 2001Publication date: March 7, 2002Inventors: Gary W. Yeager, Robert E. Colborn
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Patent number: 6352782Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.Type: GrantFiled: December 1, 1999Date of Patent: March 5, 2002Assignee: General Electric CompanyInventors: Gary W. Yeager, Robert E. Colborn
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Patent number: 6339131Abstract: A method comprising (a) synthesis of a poly(arylene ether) having the structure (1) wherein m is an integer having an average value in the range from about 3 to about 300; (b) solution functionalization of polymer (1) to form functionalized poly(arylene ether) having the structure (2) wherein X is a reactive functional group selected from the group consisting of anhydride, hydroxyl, epoxy, carboxyl, —R1OH, R1CO2R2, —R1CH2═CH2, or vinyl, wherein R1 is a primary or secondary divalent alkyl or haloalky group having from 1 to 20 carbons, or an aryl group and R2 is a primary or secondary alkyl group having from 1 to 10 carbons; and Q4 is hydrogen, X, or a mixture thereof; (c) reaction of functionalized poly(arylene ether) (2) with a poly(organosiloxane) having structure (3): wherein x is zero or one and Y is a functional group reactive with X, selected from the group consisting of —OH, —CH2═CH2, epoxy, amino, carboxy, &mdashType: GrantFiled: December 6, 1999Date of Patent: January 15, 2002Assignee: General Electric CompanyInventors: James A. Cella, Juraj Liska, Victoria L. Ulery, Gary W. Yeager, Susan Adams Nye, Hua Guo, Navjot Singh
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Publication number: 20010053450Abstract: A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.Type: ApplicationFiled: December 1, 1999Publication date: December 20, 2001Inventors: GARY W. YEAGER, ROBERT E. COLBURN
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Patent number: 5189191Abstract: Bisphenols containing free-radical generating groups, such as bissilylpinacolate groups, are provided. These bisphenols can be used to make free-radical generating polycarbonate macroinitiators having thermally labile groups which can be heated with vinyl monomers, such as styrene to make polycarbonate block copolymers.Type: GrantFiled: May 15, 1992Date of Patent: February 23, 1993Assignee: General Electric CompanyInventors: Gary W. Yeager, James V. Crivello
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Patent number: 5140078Abstract: Bisphenols containing free-radical generating groups, such as bissilylpinacolate groups, are provided. These bisphenols can be used to make free-radical generating polycarbonate macroinitiators having thermally labile groups which can be heated with vinyl monomers, such as styrene to make polycarbonate block copolymers.Type: GrantFiled: September 9, 1991Date of Patent: August 18, 1992Assignee: General Electric CompanyInventors: Gary W. Yeager, James V. Crivello
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Patent number: 5079310Abstract: Bisphenols containing free-radical generating groups, such as bissilylpinacolate groups, are provided. These bisphenols can be used to make free-radical generating polycarbonate macroinitiators having thermally labile groups which can be heated with vinyl monomers, such as styrene to make polycarbonate block copolymers.Type: GrantFiled: November 27, 1989Date of Patent: January 7, 1992Assignee: General Electric CompanyInventors: Gary W. Yeager, James V. Crivello
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Patent number: 5068457Abstract: A method for making hydroxy-terminated arylene ethers is provided by condensing an aromatic diol, such as hydroquinone with 4-fluoroacetophenone followed by a Baeyer-Villiger oxidation, and hydrolysis of the resulting diester.Type: GrantFiled: August 1, 1990Date of Patent: November 26, 1991Assignee: General Electric CompanyInventors: Gary W. Yeager, David N. Schissel