Abstract: Methods and systems for detecting defects on a specimen are provided. One method includes generating first and second mode test, reference, and difference images of a specimen for first and second modes of an inspection subsystem, respectively. The method also includes combining the first and second mode test images, the first and second mode reference images, and the first and second mode difference images as an input for defect detection. In addition, the method includes detecting defects on the specimen based on at least the first and second mode difference images.

Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer systems and one or more components executed by the one or more computer systems. The component(s) include a deep learning model configured for, for a location on a specimen, generating a gray scale simulated design data image from a high resolution image generated at the location by a high resolution imaging system. The computer system(s) are configured for generating a simulated binary design data image for the location from the gray scale simulated design data image. The computer system(s) are also configured for detecting defects at the location on the specimen by subtracting design data for the location from the simulated binary design data image.

Abstract: Methods and systems for setting up inspection of a specimen are provided. One system includes one or more computer subsystems configured for acquiring a reference image for a specimen and modifying the reference image to fit the reference image to a design grid thereby generating a golden grid image. The one or more computer subsystems are also configured for storing the golden grid image for use in inspection of the specimen. The inspection includes aligning a test image of the specimen generated from output of an inspection subsystem to the golden grid image.

Abstract: A system includes a processing unit communicatively coupled to a detector array of an optical wafer characterization system. The processing unit is configured to perform one or more steps of a method or process including the steps of acquiring one or more target images of a target location on a wafer from the detector array, applying a de-noising filter to at least the one or more target images, determining one or more difference images from one or more reference images and the one or more target images, and up-sampling the one or more difference images to generate one or more up-sampled images. One or more wafer defects are detectable in the one or more difference images or the up-sampled images.

Abstract: Methods and systems for aligning images of a specimen are provided. One method includes reducing noise in a test image generated for a specimen by an imaging subsystem thereby generating a denoised test image. The method also includes detecting one or more patterned features in the denoised test image extending in at least a horizontal or vertical direction. In addition, the method includes designating an area of the denoised test image in which the detected one or more patterned features are located as a region of interest in the denoised test image. The method further includes aligning the denoised test image to a reference image for the specimen using only the region of interest in the denoised test image and a corresponding area in the reference image.

Abstract: A system for characterizing a specimen is disclosed. In one embodiment, the system includes a controller configured to: receive training images of one or more defects of the specimen; generate a machine learning classifier based on the training images; receive product images of one or more defects of a specimen; determine one or more defect type classifications of one or more defects with the machine learning classifier; filter the product images with one or more smoothing filters; perform binarization processes to generate binarized product images; perform morphological image processing operations on the binarized product images; determine one or more algorithm-estimated defect sizes of the one or more defects based on the binarized product images; and determine one or more refined estimates of one or more defect sizes of the one or more defects based on the one or more algorithm-estimated defect sizes and the one or more defect type classifications.

Abstract: A rendered image is aligned with a scanning electron microscope (SEM) image to produce an aligned rendered image. A reference image is aligned with the SEM image to produce an aligned reference image. A threshold probability map also is generated. Dynamic compensation of the SEM image and aligned reference image can produce a corrected SEM image and corrected reference image. A thresholded defect map can be generated and the defects of the thresholded probability map and the signal-to-noise-ratio defects of the thresholded defect map are filtered using a broadband-plasma-based property to produce defect-of-interest clusters.

Abstract: Methods and systems for setting up inspection of a specimen are provided. One system includes one or more computer subsystems configured for acquiring a reference image for a specimen and modifying the reference image to fit the reference image to a design grid thereby generating a golden grid image. The one or more computer subsystems are also configured for storing the golden grid image for use in inspection of the specimen. The inspection includes aligning a test image of the specimen generated from output of an inspection subsystem to the golden grid image.

Abstract: Methods and systems for detecting defects on a specimen are provided. One system includes one or more computer systems and one or more components executed by the one or more computer systems. The component(s) include a deep learning model configured for, for a location on a specimen, generating a gray scale simulated design data image from a high resolution image generated at the location by a high resolution imaging system. The computer system(s) are configured for generating a simulated binary design data image for the location from the gray scale simulated design data image. The computer system(s) are also configured for detecting defects at the location on the specimen by subtracting design data for the location from the simulated binary design data image.

Abstract: Methods and systems for aligning images of a specimen are provided. One method includes reducing noise in a test image generated for a specimen by an imaging subsystem thereby generating a denoised test image. The method also includes detecting one or more patterned features in the denoised test image extending in at least a horizontal or vertical direction. In addition, the method includes designating an area of the denoised test image in which the detected one or more patterned features are located as a region of interest in the denoised test image. The method further includes aligning the denoised test image to a reference image for the specimen using only the region of interest in the denoised test image and a corresponding area in the reference image.

Abstract: A rendered image is aligned with a scanning electron microscope (SEM) image to produce an aligned rendered image. A reference image is aligned with the SEM image to produce an aligned reference image. A threshold probability map also is generated. Dynamic compensation of the SEM image and aligned reference image can produce a corrected SEM image and corrected reference image. A thresholded defect map can be generated and the defects of the thresholded probability map and the signal-to-noise-ratio defects of the thresholded defect map are filtered using a broadband-plasma-based property to produce defect-of-interest clusters.

Abstract: A system for characterizing a specimen is disclosed. In one embodiment, the system includes a controller configured to: receive training images of one or more defects of the specimen; generate a machine learning classifier based on the training images; receive product images of one or more defects of a specimen; determine one or more defect type classifications of one or more defects with the machine learning classifier; filter the product images with one or more smoothing filters; perform binarization processes to generate binarized product images; perform morphological image processing operations on the binarized product images; determine one or more algorithm-estimated defect sizes of the one or more defects based on the binarized product images; and determine one or more refined estimates of one or more defect sizes of the one or more defects based on the one or more algorithm-estimated defect sizes and the one or more defect type classifications.

Abstract: Techniques for fast and accurate measuring test strip intensities are disclosed herein. A cassette attachment device for detecting intensity of a test strip cassette includes a strip chamber configured to accommodate at least a portion of a test strip, a light source configured to provide illumination to the test strip cassette via indirect lighting, an attaching mechanism configured to attach the device to a mobile device, and a camera window configured to transmit light signal reflected from the test strip cassette such that the mobile device can capture an image of the test strip cassette illuminated by the light source.

Abstract: Techniques for fast and accurate measuring test strip intensities are disclosed herein. A cassette attachment device for detecting intensity of a test strip cassette includes a strip chamber configured to accommodate at least a portion of a test strip, a light source configured to provide illumination to the test strip cassette via indirect lighting, an attaching mechanism configured to attach the device to a mobile device, and a camera window configured to transmit light signal reflected from the test strip cassette such that the mobile device can capture an image of the test strip cassette illuminated by the light source.

Abstract: Techniques for fast and accurate measuring test strip intensities are disclosed herein. A method for measuring a test strip intensity comprising steps of obtaining an image of a sample line in a test strip and a plurality of reference lines, wherein the reference lines have known intensities; determining grayscale values of the sample line and the reference lines from the image; constructing a standard curve based on the grayscale values versus the known intensities of the reference lines; and determining the intensity of the sample line by fitting the grayscale value of the sample line on the standard curve.

Abstract: Techniques for fast and accurate measuring test strip intensities are disclosed herein. A method for measuring a test strip intensity comprising steps of obtaining an image of a sample line in a test strip and a plurality of reference lines, wherein the reference lines have known intensities; determining grayscale values of the sample line and the reference lines from the image; constructing a standard curve based on the grayscale values versus the known intensities of the reference lines; and determining the intensity of the sample line by fitting the grayscale value of the sample line on the standard curve.

Abstract: Methods and apparatus relating to the inspection of photomasks are described. In an embodiment, detection of thin line or sub-resolution assist features may be used for selective sensitivity during photomask inspection. Other embodiments are also described.

Abstract: Methods, data processing apparatus and computer program products for characterising cells and the affect of treatments administered to cells are disclosed. In particular methods of identifying bi-nuclear cells are described which include capturing an image of a plurality of marked cells and processing image to obtain features of the plurality of cells. The features are analyzed to determine whether the feature is indicative of bi-nuclear cells. Those cells for which the first feature is indicative of bi-nuclear cells are identified as being bi-nuclear. Three algorithms in particular are described. A first algorithm can be used to determine the number of nuclei in an image of a nuclear component by determining the number of concave regions within the outline of the image. A second algorithm uses a measure of the amount of cytoplasmic material between a pair of nuclei to identify bi-nuclear cells.

Abstract: Methods and apparatus are provided for the analysis of images of cells and extraction biologically-significant shape-related features from the cell images. The extracted features may be correlated with particular conditions induced by biologically-active agents with which cells have been treated, thereby enabling the automated analysis of cells based on cell shape parameters. In particular, the invention provides methods for segmentation of cells in an image using a combination of a reference component image data and cell shape-indicative marker image data in a watershed technique. Further, the invention provides a skeletonization and skeleton analysis technique for extracting biologically-relevant features from cell shapes.

Abstract: Methods, code and apparatus analyze cell images to automatically identify and characterize the Golgi complex in individual cells. This is accomplished by first locating the cells in the image and defining boundaries of those cells that subsume some or all of the Golgi complex of those cells. The Golgi complex in the images typically have intensity values corresponding to the concentration of a Golgi component in the cell (e.g. a polysaccharide associated with the Golgi complex). The method/system then analyzes the Golgi components of the image (typically on a pixel-by-pixel basis) to mathematically characterize the Golgi complex of individual cells. This mathematical characterization represents phenotypic information about the cells' Golgi complex and can be used to classify cells. From this information, mechanism of action and other important biological information can be deduced.