Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.

Abstract: A method for accurately positioning a component on a receiver substrate is provided, wherein the component is transferred from a donor substrate to a receiver substrate facing the donor substrate. The method comprises creating at least one nozzle at a predefined location in the area of contact between a blister forming layer on the donor substrate, and a component attached to the donor substrate by adhesion to the blister forming layer. The blister forming layer comprises at least a dynamic release layer, consisting of a dynamic release material, i.e. material that is vaporised when a laser beam of a given wavelength and flux density is directed to the donor substrate at the location of the component, from the back side of the donor substrate. The application of the laser beam thus creates a blister that contains vaporized dynamic release material.

Abstract: A silicon-based photonic chip is provided that includes an interface for optically coupling the photonic chip to an optical fiber or an optical fiber assembly. The interface includes: a single-mode waveguide configured to guide light and to provide a first light beam; a first optical element configured to expand the light beam in a first direction in-plane of the photonic chip, thereby providing an expanded light beam; and a second optical element configured to deflect and to further expand the expanded light beam in a second direction, thereby providing an output light beam from the photonic chip. Also provided are methods for fabricating such a photonic chip.

Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.

Abstract: An optical coupler and method of assembly are described that provide efficient coupling from the photonic integrated circuit (PIC) waveguide layer to external components, such as optical fibers, VCSELs, photodetectors, and gain blocks, among others. The optical coupler includes a PIC that can be supported by a printed circuit board, an optoelectronic transducer supported by the PIC that can convert between optical signals and corresponding electrical signals, and a coupled waveguide assembly. The coupled waveguide assembly includes a low-index waveguide, a high-index waveguide, and a reflective surface that changes a pathway of the optical signals to direct the optical signals from the optoelectronic transducer into the low-index waveguide or from the low-index waveguide into the optoelectronic transducer.

Abstract: An optical system and method for connecting two optical fibers is described in the present disclosure. An example optical system includes a first optical fiber embedded in an embedding material, the first optical fiber comprising side walls extending in a longitudinal direction in contact with the embedding material, a second, external, optical fiber, and a self-written waveguide in optical contact with the first and second optical fibers. Only a cross section perpendicular to the side walls of the first optical fiber is outside the embedding material, in contact with the self-written waveguide.

Abstract: An optical system and method for connecting two optical fibers is described in the present disclosure. An example optical system includes a first optical fiber embedded in an embedding material, the first optical fiber comprising side walls extending in a longitudinal direction in contact with the embedding material, a second, external, optical fiber, and a self-written waveguide in optical contact with the first and second optical fibers. Only a cross section perpendicular to the side walls of the first optical fiber is outside the embedding material, in contact with the self-written waveguide.

Abstract: The present disclosure generally relates to a method of optically coupling a photonic integrated circuit and an external optical component.

Abstract: An optical fluorescence-based sensor comprising at least one sensing element is disclosed. In one aspect, the at least one sensing element comprises a waveguide comprising a waveguide core, a light source optically coupled to an input part of the waveguide core, and a photodetector optically coupled to an output part of the waveguide core, the waveguide core being made of a material comprising a mixture of an optical material and a fluorescent dye.

Abstract: The present disclosure generally relates to a method of optically coupling a photonic integrated circuit and an external optical component.

Abstract: An optical fluorescence-based sensor comprising at least one sensing element is disclosed. In one aspect, the at least one sensing element comprises a waveguide comprising a waveguide core, a light source optically coupled to an input part of the waveguide core, and a photodetector optically coupled to an output part of the waveguide core, the waveguide core being made of a material comprising a mixture of an optical material and a fluorescent dye.

Abstract: An optical shear sensor that includes a first and second outer surface at opposing sides and a sensing element is disclosed. In one aspect, the sensing element has an optoelectronic source for emitting light of a predetermined wavelength and having a source front surface where light exits the optoelectronic source, and a photodetector for detecting light of the predetermined wavelength and having a detector front surface where light of the optoelectronic source is received. The optoelectronic source is positioned along the first outer surface and emits light towards the second outer surface. A flexible sensing layer transparent to the predetermined wavelength covers the front surface of the optoelectronic source and the front surface of the photodetector. Upon application of a shear stress, the sensing layer deforms elastically and the outer surfaces are displaced along directions parallel to each other and the source front surface so the intensity of light detected by the photodetector changes.

Abstract: A sensor for sensing pressure is disclosed. The sensor may be a pressure sensor for sensing pressure, or a tactile sensor for sensing tactile events through pressure measurement. In one aspect, the sensor includes at least one pressure sensor having at least one VCSEL on a substrate. It further includes a compressible sensor layer covering a top surface of the at least one VCSEL, and a reflecting element covering a top surface of the sensor layer. A method of manufacturing such a sensor is also disclosed.

Abstract: A sensor for sensing pressure is disclosed. The sensor may be a pressure sensor for sensing pressure, or a tactile sensor for sensing tactile events through pressure measurement. In one aspect, the sensor includes at least one pressure sensor having at least one VCSEL on a substrate. It further includes a compressible sensor layer covering a top surface of the at least one VCSEL, and a reflecting element covering a top surface of the sensor layer. A method of manufacturing such a sensor is also disclosed.