Patents by Inventor Gemma Hui CHEN

Gemma Hui CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11729954
    Abstract: A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.
    Type: Grant
    Filed: April 20, 2021
    Date of Patent: August 15, 2023
    Assignee: Dell Products L.P.
    Inventors: Weidong Zuo, Yuan Chen, Gemma Hui Chen
  • Patent number: 11640190
    Abstract: An information handling system includes two or more heat-generating devices and a liquid-assisted air cooling (LAAC) assembly to cool at least some of the devices. The LAAC assembly includes a radiator, first and second pumps connected in series with the radiator. The LAAC assembly further includes first and second cold plates enclosing first and second CPUs or another suitable heat generating device. The first and second cold plates are connected in parallel between an inlet of the first pump and an outlet of the second pump. In this configuration, the serial connected pumps in combination with the parallel connected cold plates provide 1+1 pump redundancy while delivering cold coolant from the radiator outlet to both heat generating devices such that neither heat cold plate receives pre-heated coolant from the other cold plate.
    Type: Grant
    Filed: April 14, 2021
    Date of Patent: May 2, 2023
    Assignee: Dell Products L.P.
    Inventors: Weidong Zuo, Gemma Hui Chen, Xiaoliang Zhou, Mingming Zhang, Jie Yang
  • Patent number: 11576283
    Abstract: A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: February 7, 2023
    Assignee: Dell Products L.P.
    Inventors: Yuan Chen, Gemma Hui Chen, Weidong Zuo, Quanqing Zhu
  • Publication number: 20220338389
    Abstract: A system for providing continuous cooling to a storage rack, including a storage rack, including a first storage node and a second storage node; a first cooling loop including a first cooling distribution unit (CDU); a second cooling loop including a second cooling distribution unit (CDU); a first inlet switching valve coupled between the first storage node and each of the first and the second CDUs; a second inlet switching valve coupled between the second storage node and each of the first and the second CDUs; wherein, when the first cooling loop experiences a failure, a state of the first inlet switch and a state of the second inlet switch is adjusted to i) prevent the first CDU from providing cooling of the first storage node and the second storage node, ii) allow only the second CDU to provide cooling of the first storage node and the second storage node.
    Type: Application
    Filed: April 20, 2021
    Publication date: October 20, 2022
    Inventors: Weidong Zuo, Yuan Chen, Gemma Hui Chen
  • Publication number: 20220334623
    Abstract: An information handling system includes two or more heat-generating devices and a liquid-assisted air cooling (LAAC) assembly to cool at least some of the devices. The LAAC assembly includes a radiator, first and second pumps connected in series with the radiator. The LAAC assembly further includes first and second cold plates enclosing first and second CPUs or another suitable heat generating device. The first and second cold plates are connected in parallel between an inlet of the first pump and an outlet of the second pump. In this configuration, the serial connected pumps in combination with the parallel connected cold plates provide 1+1 pump redundancy while delivering cold coolant from the radiator outlet to both heat generating devices such that neither heat cold plate receives pre-heated coolant from the other cold plate.
    Type: Application
    Filed: April 14, 2021
    Publication date: October 20, 2022
    Applicant: Dell Products L.P.
    Inventors: Weidong ZUO, Gemma Hui CHEN, Xiaoliang ZHOU, Mingming ZHANG, Jie YANG
  • Publication number: 20220330459
    Abstract: A highly available and modular cooling distribution unit (CDU) includes a heat exchange module and a pair of redundant pump modules, all configured to occupy a designated rack space that is comparable to rack space required for a conventional 1×CDU without redundancy. The heat exchange module may be fluidically coupled to one or more rack information handling resources via liquid coolant conduits, manifolds and accompanying valves, sensors, etc. In at least one embodiment, the heat exchange module includes a heat exchanger to dissipate heat from a liquid coolant and a fan assembly to move heated air in proximity to the heat exchanger. Each pump module is coupled to the heat exchange module and configured to circulate liquid coolant through a closed loop circuit that includes the heat exchanger, the liquid coolant conduits and manifolds, and information handling resources.
    Type: Application
    Filed: April 13, 2021
    Publication date: October 13, 2022
    Applicant: Dell Products L.P.
    Inventors: Yuan CHEN, Gemma Hui CHEN, Weidong ZUO, Quanqing ZHU