Abstract: A semiconductor light emitting device includes a substrate, a common conductive portion formed on the substrate, a semiconductor light emitting element mounted on the common conductive portion, and an electronic component mounted on the common conductive portion and electrically connected to the semiconductor light emitting element by the common conductive portion. This structure shortens the conductive path between the semiconductor light emitting element and the electronic component, thereby reducing capacitance caused by the conductive path between the semiconductor light emitting element and the electronic component. Thus, while reducing parasitic capacitance, the semiconductor light emitting element and the electronic component are electrically connected.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: The LED flash module includes: a module substrate (111); an energy device (18) arranged on the module substrate; an LED module (320) arranged on the module substrate, the LED module in which a plurality of LED block units (320a-320f) are arranged horizontally, the LED block units in which a plurality of LED elements emitting light using a power source supplied from the energy device are arranged vertically; an EDLC charger circuit (311) arranged on the module substrate, and configured to charge the energy device; and an LED driver control circuit (313) arranged on the module substrate, and configured to control light emission from the LED element, wherein a wire length from a plus terminal (321) of the power supply unit to the LED element and a wire length from the LED element to a minus terminal (322) of the power are substantially equivalent with respect to each LED element.

Abstract: A semiconductor device includes a semiconductor chip, a plurality of passive electronic components, a substrate, a main lead, and a sealing resin. The semiconductor chip includes a functional circuit. The plurality of passive electronic components assist a function of the semiconductor chip. The substrate has a principal surface and a reverse surface that face in opposite directions to each other, and the semiconductor chip and the plurality of passive electronic components are mounted on the principal surface. The main lead includes an island portion that is joined to the reverse surface of the substrate, and a terminal portion that is offset in a predetermined direction with respect to the island portion. The sealing resin covers the semiconductor chip, the substrate, and the island portion of the main lead.

Abstract: The LED flash module includes: a module substrate (111); an energy device (18) arranged on the module substrate; an LED module (320) arranged on the module substrate, the LED module in which a plurality of LED block units (320a-320f) are arranged horizontally, the LED block units in which a plurality of LED elements emitting light using a power source supplied from the energy device are arranged vertically; an EDLC charger circuit (311) arranged on the module substrate, and configured to charge the energy device; and an LED driver control circuit (313) arranged on the module substrate, and configured to control light emission from the LED element, wherein a wire length from a plus terminal (321) of the power supply unit to the LED element and a wire length from the LED element to a minus terminal (322) of the power are substantially equivalent with respect to each LED element.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.

Abstract: A DC voltage conversion module includes a substrate, an input terminal, an output terminal, a ground terminal, a DC voltage conversion control element mounted on the substrate, a coil mounted on the substrate and connected to the DC voltage conversion control element and the output terminal, an input-side capacitor mounted on the substrate and connected to the input terminal and the ground terminal, and an output-side capacitor mounted on the substrate and connected to the output terminal and the ground terminal. The input terminal, the output terminal and the ground terminal project in a predetermined projecting direction parallel to each other. The ground terminal is arranged between the input terminal and the output terminal in a direction perpendicular to the projecting direction.