Abstract: In a pixel unit of a solid-state imaging device, a semiconductor substrate is provided with a plurality of photodiodes, a first insulating film includes a recess in a portion above each of the photodiodes, a second insulating film embeds the recess, a plurality of color filters is formed on the second insulating film, the color filters each corresponding to one of the photodiodes, a partition is provided between adjacent ones of the color filters, the partition being a part of a third insulating film, and in an area outside of the pixel unit, (i) a conductive film at least partially covered by the third insulating film is formed on the second insulating film, and (ii) the third insulating film formed on the conductive film and on the second insulating film near the conductive film has a film thickness smaller than a film thickness of the partition.

Abstract: In a pixel unit of a solid-state imaging device, a semiconductor substrate is provided with a plurality of photodiodes, a first insulating film includes a recess in a portion above each of the photodiodes, a second insulating film embeds the recess, a plurality of color filters is formed on the second insulating film, the color filters each corresponding to one of the photodiodes, a partition is provided between adjacent ones of the color filters, the partition being a part of a third insulating film, and in an area outside of the pixel unit, (i) a conductive film at least partially covered by the third insulating film is formed on the second insulating film, and (ii) the third insulating film formed on the conductive film and on the second insulating film near the conductive film has a film thickness smaller than a film thickness of the partition.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A semiconductor device includes: an isolation region formed in a semiconductor substrate; a first active region and a second active region surrounded by the isolation region; an n-type gate electrode and a p-type gate electrode formed on gate insulating films; an insulating film and a silicon region formed on the isolation region and isolating the n-type gate electrode and the p-type gate electrode from each other; and a metal silicide film formed on the upper surfaces of the n-type gate electrode, the silicon region, the p-type gate electrode, and part of the insulating film formed therebetween. The n-type gate electrode is electrically connected to the p-type gate electrode through the metal silicide film.

Abstract: A MIS transistor includes a gate electrode portion, insulating sidewalls formed on side surfaces of the gate electrode portion, source/drain regions and a stress film formed so as to cover the gate electrode portion and the source/drain regions. A height of an upper surface of the gate electrode portion is smaller than a height of an upper edge of each of the insulating sidewalls. A thickness of first part of the stress film located on the gate electrode portion is larger than a thickness of second part of the stress film located on the source/drain regions.

Abstract: A semiconductor device includes: an isolation region formed in a semiconductor substrate; an active region surrounded by the isolation region in the semiconductor substrate; a gate insulating film formed on the active region; and a gate electrode formed across the boundary between the active region and the isolation region adjacent to the active region. The gate electrode includes a first portion which is located above the active region with the gate insulating film interposed therebetween and is entirely made of a silicide in a thickness direction and a second portion which is located above the isolation region and is made of a silicon region and the silicide region covering the silicon region.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A video camera, building in a hard disk drive and an optical disk drive within the same housing, for dissolving a problem of increasing the temperature of hard disk drive due to heats generated within an inside of the main body thereof, comprises: an image pickup portion, which is configured to make photographing; a display portion 6, which is configured to display an image photographed; a hard disk drive 1 which is configured to record the image photographed therein; and an optical disk drive 9, which is configured to drive an optical disk being attached/detached, wherein the display portion 6, the optical disk drive 1, the hard disk 9 are disposed in that order, and the hard disk drive 1 is disposed on a cover portion to be opened when taking out the optical disk from the optical disk drive 9.

Abstract: A semiconductor device includes: a high dielectric constant gate insulating film formed on an active region in a substrate; a gate electrode formed on the high dielectric constant gate insulating film; and an insulating sidewall formed on each side surface of the gate electrode. The high dielectric constant gate insulating film is continuously formed so as to extend from under the gate electrode to under the insulating sidewall. At least part of the high dielectric constant gate insulating film located under the insulating sidewall has a smaller thickness than a thickness of part of the high dielectric constant gate insulating film located under the gate electrode.

Abstract: A semiconductor device includes: an isolation region formed in a semiconductor substrate; a first active region and a second active region surrounded by the isolation region; an n-type gate electrode and a p-type gate electrode formed on gate insulating films; an insulating film and a silicon region formed on the isolation region and isolating the n-type gate electrode and the p-type gate electrode from each other; and a metal silicide film formed on the upper surfaces of the n-type gate electrode, the silicon region, the p-type gate electrode, and part of the insulating film formed therebetween. The n-type gate electrode is electrically connected to the p-type gate electrode through the metal silicide film.

Abstract: A semiconductor device, including a first MIS-type transistor formed in a first region of a semiconductor region, the first region being of a first conductivity type, the first MIS-type transistor including: a first gate insulating film formed on the first region; a first gate electrode formed on the first gate insulating film; a first extension diffusion layer of a second conductivity type formed in a region of the first region under and beside the first gate electrode; and a first fluorine diffusion layer formed in a first channel region of the first conductivity type sandwiched between portions of the first extension diffusion layer, wherein portions of the first fluorine diffusion layer extend from the first extension diffusion layer and overlap together in a region directly under the first gate electrode.

Abstract: A video camera, installing a hard disc and an optical disc therein, as recording media for recording video information thereon, wherein: a housing of the video camera is conducted with a main body housing, and a recording media cover, which can be freely rotated to the main body housing, to be opened/closed; the recording media cover is so structured to be fitted and engaged with, by sliding a hard disc cover to an optical disc cover, by means of an engagement member; the optical disc is loaded detachably within the main body housing of the video camera, by rotationally opening/closing the recording media cover; and the hard disc is disposed in an interior space defined by the optical disc cover and the hard disc cover, under such condition that engagement condition of the recording media cover by means of the engagement member can be removed by only a specific removal member, from an outside thereof.

Abstract: A video camera, building in a hard disk drive and an optical disk drive within the same housing, for dissolving a problem of increasing the temperature of hard disk drive due to heats generated within an inside of the main body thereof, comprises: an image pickup portion, which is configured to make photographing; a display portion 6, which is configured to display an image photographed; a hard disk drive 1 which is configured to record the image photographed therein; and an optical disk drive 9, which is configured to drive an optical disk being attached/detached, wherein the display portion 6, the optical disk drive 1, the hard disk 9 are disposed in that order, and the hard disk drive 1 is disposed on a cover portion to be opened when taking out the optical disk from the optical disk drive 9.

Abstract: A high dielectric constant gate insulating film is formed on an active region of a substrate, and a gate electrode is formed on the high dielectric constant gate insulating film. A high dielectric constant insulating sidewall is formed on a side face of the gate electrode.

Abstract: After gate insulating film formation films are formed in an element formation region of a semiconductor substrate, a gate electrode formation film is formed on the gate insulating film formation films. A fluorine-containing insulting film is formed on the gate electrode formation film. Then, thermal treatment is performed to diffuse and introduce the fluorine contained in the fluorine-containing insulating film to interfaces between the semiconductor substrate and the gate insulting film formation films.

Abstract: After a Ni film is deposited on a substrate on which a gate silicon layer is formed, a mask is formed above the gate silicon layer. Then, the Ni film is etched so as to leave a part of the Ni film which is located on the gate silicon layer. This restricts sideways supply of Ni present on the sides of the gate silicon layer. Thereafter, thermal treatment is performed to silicidate the gate silicon layer entirely.