Abstract: A pulse stretching circuit having a pulse delay circuit for receiving an input pulse signal and for outputting a delay pulse signal, and a pulse adjustment circuit, connected to the pulse delay circuit, receiving the input pulse signal and the delay pulse signal and for outputting an output pulse signal having a pulse width longer than a pulse width of the input pulse signal. The pulse adjustment circuit causes a leading edge of the output pulse signal in response to a leading edge of the input pulse signal, keeps a state in which the output pulse signal is displaced with the leading edge thus caused longer than a total time of times for both pulse widths of the input pulse signal and the delay pulse signal, and causes a trailing edge of the output pulse signal in response to a trailing edge of the delay pulse signal.

Abstract: A pulse stretching circuit having a pulse delay circuit for receiving an input pulse signal and for outputting a delay pulse signal, and a pulse adjustment circuit, connected to the pulse delay circuit, receiving the input pulse signal and the delay pulse signal and for outputting an output pulse signal having a pulse width longer than a pulse width of the input pulse signal. The pulse adjustment circuit causes a leading edge of the output pulse signal in response to a leading edge of the input pulse signal, keeps a state in which the output pulse signal is displaced with the leading edge thus caused longer than a total time of times for both pulse widths of the input pulse signal and the delay pulse signal, and causes a trailing edge of the output pulse signal in response to a trailing edge of the delay pulse signal.

Abstract: A pulse stretching circuit having a pulse delay circuit for receiving an input pulse signal and for outputting a delay pulse signal, and a pulse adjustment circuit, connected to the pulse delay circuit, receiving the input pulse signal and the delay pulse signal and for outputting an output pulse signal having a pulse width longer than a pulse width of the input pulse signal. The pulse adjustment circuit causes a leading edge of the output pulse signal in response to a leading edge of the input pulse signal, keeps a state in which the output pulse signal is displaced with the leading edge thus caused longer than a total time of times for both pulse widths of the input pulse signal and the delay pulse signal, and causes a trailing edge of the output pulse signal in response to a trailing edge of the delay pulse signal.

Abstract: The pulse width adjusting circuit includes a pulse delaying circuit for inputting an inputted pulse signal a and for outputting a plurality of different delayed pulse signals b1, b2, . . . , a transmission gate for inputting an inputted pulse signal a and controlling the passage of the inputted pulse signal a in response to the application of two delayed pulse signals from among the plurality of different delayed pulse signals b1, b2, . . . , and a pulse width setting circuit connected to the transmission gate for setting the pulse width of an outputted pulse signal c generated on the basis of the inputted pulse signal a passing through the transmission gate.

Abstract: An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

Abstract: An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

Abstract: A method of milling cerium compound by means of a ball mill using a milling medium, characterized in that ratio Hb/r of radius r of a cylindrical ball mill container and depth Hb of the milling medium in the ball mill container disposed horizontally ranges from 1.2 to 1.9, and the ball mill container is rotated at a rotational speed which is 50% or less of critical rotational speed Nc=299/r1/2 of the ball mill container converted from the radius r expressed in centimeter. The milling method can be carried out in a wet or dry process, and the cerium compound is preferably cerium oxide. The method can be also applied for producing a cerium compound slurry.

Abstract: An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

Abstract: A method of milling cerium compound by means of a ball mill using a milling medium, characterized in that ratio Hb/r of radius r of a cylindrical ball mill container and depth Hb of the milling medium in the ball mill container disposed horizontally ranges from 1.2 to 1.9, and the ball mill container is rotated at a rotational speed which is 50% or less of critical rotational speed Nc=299/r1/2 of the ball mill container converted from the radius r expressed in centimeter. The milling method can be carried out in a wet or dry process, and the cerium compound is preferably cerium oxide. The method can be also applied for producing a cerium compound slurry.

Abstract: An electrically optimized and structurally protected micro via structure for high speed signals in multilayer interconnection substrates is provided. The via structure eliminates the overlap of a contact with the reference planes to thereby reduce the via capacitance and thus, the via impedance mismatch in the via structure. As a result, the via structure is electrically optimized. The via structure further comprises one or more floating support members placed in close proximity to the via within a via clearance area between the via and the reference planes. The floating support members are “floating” in the sense that they are not in electrical contact with either the via or the reference planes. Thus, they are not provided for purposes of signal propagation but only for structural support. The floating support members may be connected to one another by way of one or more microvia structures.

Abstract: A method of milling cerium compound by means of a ball mill using a milling medium, characterized in that ratio Hb/r of radius r of a cylindrical ball mill container and depth Hb of the milling medium in the ball mill container disposed horizontally ranges from 1.2 to 1.9, and the ball mill container is rotated at a rotational speed which is 50% or less of critical rotational speed Nc=299/r1/2 of the ball mill container converted from the radius r expressed in centimeter. The milling method can be carried out in a wet or dry process, and the cerium compound is preferably cerium oxide. The method can be also applied for producing a cerium compound slurry.

Abstract: For aluminum disks and glass-made hard disks, those disks having a mean waviness of less than 3 Å are being desired in order to increase the density of memory capacity. The present invention provides polishing compositions that can give smoothly polished surfaces for the disks. The polishing compositions are polishing compositions for aluminum disks or substrates having silica on the surface thereof, which contain colloidal silica particle groups having different particle size distributions and have a SiO2 concentration of 0.5 to 50% by weight.

Abstract: For aluminum disks and glass-made hard disks, those disks having a mean waviness of less than 3 Å are being desired in order to increase the density of memory capacity. The present invention provides polishing compositions that can give smoothly polished surfaces for the disks.