Patents by Inventor Gene C. Weedon

Gene C. Weedon has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8734700
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two vertically stacked and heated calender rolls through application of the polyolefin powder to the apex of the topmost of the two heated calender rolls; b) rolling the powder through the nip until a coherent sheet of polyolefin sheet is produced: and c) once a coherent polyolefin sheet exits the nip adjusting the temperature in the nip to obtain specific tensile and elongation properties. Apparatus for the performance of such a process is also described.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: May 27, 2014
    Assignee: E I Du Pont de Nemours and Company
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Publication number: 20120266744
    Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.
    Type: Application
    Filed: June 15, 2011
    Publication date: October 25, 2012
    Inventors: Fielder Stanton Lyons, Kenneth C. Harding, Lisa Owen, Joseph Mitchell, Gene C. Weedon, Jeffrey A. Mears, Peter Anthony Russell
  • Patent number: 8287987
    Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.
    Type: Grant
    Filed: June 15, 2011
    Date of Patent: October 16, 2012
    Assignee: BAE Systems Tensylon H.P.M., Inc.
    Inventors: Fielder Stanton Lyons, Kenneth C. Harding, Lisa Owen, Joseph Mitchell, Gene C. Weedon, Jeffrey A. Mears, Peter Anthony Russell
  • Patent number: 8211342
    Abstract: A process for the production of a non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: July 3, 2012
    Assignee: Bae Systems Tensylon H.P.M., Inc.
    Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
  • Patent number: 8177540
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced. According to a highly preferred embodiment, initially, the nip is set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder and once a coherent sheet of polyolefin exits the nip the temperature in the nip is lowered to a temperature below the melting point of the polyolefin powder and the gap increased to a desired level above the thickness of the largest powder particle.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: May 15, 2012
    Assignee: Bae Systems Tensylon H.P.M., Inc.
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Patent number: 8142699
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls initially set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced: and c) once a coherent sheet of polyolefin exits the nip lowering the temperature in the nip to a temperature below the melting point of the polyolefin powder and increasing the gap to a desired level above the thickness of the largest powder particle. Apparatus for the performance of such a process is also described.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: March 27, 2012
    Assignee: BAE Systems Tensylon H.P.M., Inc.
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Patent number: 8137601
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced. According to a highly preferred embodiment, initially, the nip is set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder and once a coherent sheet of polyolefin exits the nip the temperature in the nip is lowered to a temperature below the melting point of the polyolefin powder and the gap increased to a desired level above the thickness of the largest powder particle.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: March 20, 2012
    Assignee: BAE Systems Tensylon High Performance Materials, Inc.
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Patent number: 8109750
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls initially set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced: and c) once a coherent sheet of polyolefin exits the nip lowering the temperature in the nip to a temperature below the melting point of the polyolefin powder and increasing the gap to a desired level above the thickness of the largest powder particle. Apparatus for the performance of such a process is also described.
    Type: Grant
    Filed: December 15, 2010
    Date of Patent: February 7, 2012
    Assignee: BAE Systems Tengylon H.P.M., Inc.
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Patent number: 8075979
    Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
    Type: Grant
    Filed: July 8, 2011
    Date of Patent: December 13, 2011
    Assignee: BAE System Tensylon H.P.M., Inc.
    Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
  • Publication number: 20110272848
    Abstract: A process for the production of a non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
    Type: Application
    Filed: July 8, 2011
    Publication date: November 10, 2011
    Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
  • Publication number: 20110274904
    Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
    Type: Application
    Filed: July 8, 2011
    Publication date: November 10, 2011
    Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
  • Publication number: 20110167998
    Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.
    Type: Application
    Filed: July 30, 2007
    Publication date: July 14, 2011
    Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell
  • Patent number: 7976932
    Abstract: A ballistic resistant panel including a strike face portion and a backing portion. The strike face portion includes a plurality of interleaved layers of non-fibrous ultra high molecular weight polyethylene tape. The backing portion includes a plurality of interleaved layers of cross-plied fibers of ultra high molecular weight polyethylene. The entire stack of interleaved layers is compressed at high temperature and pressure to form a ballistic resistant panel having a strike face on one side. It has been found that ballistic resistance increases as the weight ratio of the strike face portion with respect to the backing portion decreases. A composite panel having a strike face Tensylon tape with at most 40% of the total weight of the panel exhibits improved ballistic resistance properties as compared to a monolithic structure of strictly interleaved layers of cross-plied high modulus fibers.
    Type: Grant
    Filed: May 29, 2009
    Date of Patent: July 12, 2011
    Assignee: BAE Systems Tensylon H.P.M, Inc.
    Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell, Erik Johnson
  • Patent number: 7976930
    Abstract: A non-fibrous ultra high molecular weight polyethylene tape having a width of 1-inch or greater and a modulus of 1,400 grams per denier or greater. The non-fibrous UHMWPE tape is obtained by compression molding ultrahigh molecular weight polyethylene powder at a temperature below its melting point and then drawing and stretching the entire resultant compression molded UHMWPE sheet, with no slitting or splitting of the sheet, at a draw ratio of at least 100:1. The UHMWPE tape can be produced in weights of 6,000 to 90,000 denier or greater. The UHMWPE tape of the present invention minimizes the effect of stress concentrators that are prevalent with fibers and thereby enables the tape to be drawn at much higher draw ratios than is possible with fibrous UHMWPE. When used in ballistics panels, the high modulus high molecular weight polyethylene tape of the present invention improves ballistic performance by providing enhanced dissipation of the impact energy of a projectile.
    Type: Grant
    Filed: June 25, 2007
    Date of Patent: July 12, 2011
    Assignee: BAE Systems Tensylon H.P.M., Inc.
    Inventors: Gene C. Weedon, Kenneth C. Harding, Lisa Owen
  • Patent number: 7972679
    Abstract: A ballistic-resistant molded article having a sandwich-type structure including two outer portions of a first high modulus material surrounding an inner portion of a second high modulus material. The outer portions are comprised of a plurality of interleaved layers of adhesive coated cross-plied non-fibrous ultra high molecular weight polyethylene tape. The inner portion is comprised of a plurality of interleaved layers of high modulus cross-plied fibers embedded in resin. The stack of interleaved layers is compressed at high temperature and pressure to form a hybrid sandwich ballistic-resistant molded article that includes a mix of high modulus materials. It has been found that ballistic resistance is higher for the hybrid structure than for a monolithic structure of comparable areal density.
    Type: Grant
    Filed: November 20, 2009
    Date of Patent: July 5, 2011
    Assignee: BAE Systems Tensylon H.P.M., Inc.
    Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell, Erik Johnson
  • Patent number: 7964266
    Abstract: A wide sheet of highly oriented ultra high molecular weight polyethylene comprising a plurality of strips of highly oriented ultra high molecular weight polyethylene partially overlapped or abutted longitudinally to define joints between adjoining strips wherein the thickness of the joint is less than about 80% of the thickness of the sum of the thicknesses of the adjoining strips that make up the joint. A continuous method for the production of such materials comprising subjecting longitudinally overlapping or abutted strips of these materials to temperatures below the melting point of the UHMWPE and pressures over 300 pli is also disclosed.
    Type: Grant
    Filed: April 13, 2007
    Date of Patent: June 21, 2011
    Assignee: BAE Systems Tensylon H.P.M., Inc.
    Inventors: Kenneth C. Harding, Gene C. Weedon, Lisa Owen
  • Patent number: 7964267
    Abstract: A ballistic-resistant panel in which the entire panel or a strike-face portion thereof is formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape can be in the form of cross-plied laminated layers of tape strips or a woven fabric of tape strips. The strips of UHMWPE tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the cross-plied layers of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.
    Type: Grant
    Filed: July 30, 2007
    Date of Patent: June 21, 2011
    Assignee: BAE Systems Tensylon H.P.M., Inc.
    Inventors: Fielder Stanton Lyons, Jeffrey A. Mears, Gene C. Weedon, Kenneth C. Harding, Lisa Owen, Peter Anthony Russell, Joseph Mitchell
  • Publication number: 20110089596
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced. According to a highly preferred embodiment, initially, the nip is set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder and once a coherent sheet of polyolefin exits the nip the temperature in the nip is lowered to a temperature below the melting point of the polyolefin powder and the gap increased to a desired level above the thickness of the largest powder particle.
    Type: Application
    Filed: December 15, 2010
    Publication date: April 21, 2011
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Publication number: 20110089597
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls initially set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced: and c) once a coherent sheet of polyolefin exits the nip lowering the temperature in the nip to a temperature below the melting point of the polyolefin powder and increasing the gap to a desired level above the thickness of the largest powder particle. Apparatus for the performance of such a process is also described.
    Type: Application
    Filed: December 15, 2010
    Publication date: April 21, 2011
    Inventors: Kenneth C. Harding, Gene C. Weedon
  • Publication number: 20110091592
    Abstract: A process for the production of virtually full density polyolefin suitable for further processing by drawing to form a high tenacity, highly oriented polyolefin sheet comprising: a) feeding a metered amount of polyolefin powder into the nip between two heated calender rolls initially set at a gap smaller than the size of the smallest polyolefin powder particle and at a temperature above the melting point of the powder; b) rolling the powder through the nip under these conditions until a coherent sheet of polyolefin is produced: and c) once a coherent sheet of polyolefin exits the nip lowering the temperature in the nip to a temperature below the melting point of the polyolefin powder and increasing the gap to a desired level above the thickness of the largest powder particle. Apparatus for the performance of such a process is also described.
    Type: Application
    Filed: December 15, 2010
    Publication date: April 21, 2011
    Inventors: Kenneth C. Harding, Gene C. Weedon