Patents by Inventor Gene Laurich

Gene Laurich has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8179137
    Abstract: Systems and devices for transmitting radio frequency signals to and from radio frequency coils in magnetic resonance imaging systems are provided. In one embodiment, a balun for blocking induced radio frequency current on ground conductors of a multi-layer signal carrier includes first and second insulative elements disposed on first and second sides of the signal carrier, respectively, a conductive layer partially surrounding ends of each insulative element with a central region of each insulative element not surrounded by the respective conductive layer, first and second capacitive circuits coupled to the conductive layers of each respective insulative element in the central region thereof, vias extending through the signal carrier, and conductive material disposed in the vias electrically coupling a conductive layer on respective ends of the first and second elements with one another and with the ground conductors.
    Type: Grant
    Filed: March 31, 2009
    Date of Patent: May 15, 2012
    Assignee: General Electric Company
    Inventors: Limin Feng, Dan Kenrick Spence, Gene Laurich, Aleksey Zemskov, Kolman Juhasz
  • Publication number: 20100244977
    Abstract: Systems and devices for transmitting radio frequency signals to and from radio frequency coils in magnetic resonance imaging systems are provided. In one embodiment, a balun for blocking induced radio frequency current on ground conductors of a multi-layer signal carrier includes first and second insulative elements disposed on first and second sides of the signal carrier, respectively, a conductive layer partially surrounding ends of each insulative element with a central region of each insulative element not surrounded by the respective conductive layer, first and second capacitive circuits coupled to the conductive layers of each respective insulative element in the central region thereof, vias extending through the signal carrier, and conductive material disposed in the vias electrically coupling a conductive layer on respective ends of the first and second elements with one another and with the ground conductors.
    Type: Application
    Filed: March 31, 2009
    Publication date: September 30, 2010
    Applicant: General Electric Company
    Inventors: Limin Feng, Dan Kennick Spence, Gene Laurich, Aleksey Zemskov, Kolman Juhasz