Patents by Inventor Genfa Wu

Genfa Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7471052
    Abstract: A cryogenic vacuum rf feedthrough device comprising: 1) a probe for insertion into a particle beam; 2) a coaxial cable comprising an inner conductor and an outer conductor, a dielectric/insulating layer surrounding the inner conductor, the latter being connected to the probe for the transmission of higher mode rf energy from the probe; and 3) a high thermal conductivity stub attached to the coaxial dielectric about and in thermal contact with the inner conductor which high thermal conductivity stub transmits heat generated in the vicinity of the probe efficiently and radially from the area of the probe and inner conductor all while maintaining useful rf transmission line characteristics between the inner and outer coaxial conductors.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: December 30, 2008
    Assignee: Jefferson Science Associates
    Inventors: Genfa Wu, Harry Lawrence Phillips
  • Publication number: 20070249399
    Abstract: A cryogenic vacuum rf feedthrough device comprising: 1) a probe for insertion into a particle beam; 2) a coaxial cable comprising an inner conductor and an outer conductor, a dielectric/insulating layer surrounding the inner conductor, the latter being connected to the probe for the transmission of higher mode rf energy from the probe; and 3) a high thermal conductivity stub attached to the coaxial dielectric about and in thermal contact with the inner conductor which high thermal conductivity stub transmits heat generated in the vicinity of the probe efficiently and radially from the area of the probe and inner conductor all while maintaining useful rf transmission line characteristics between the inner and outer coaxial conductors.
    Type: Application
    Filed: August 23, 2005
    Publication date: October 25, 2007
    Inventors: Genfa Wu, Harry Phillips