Abstract: A method for manufacturing an LED strip includes arranging conductive lines at intervals to extend along a first linear trace; arranging supporting bases at intervals along the first linear trace on the conductive lines, each supporting base including multiple conductive portions and an avoidance through-hole; each two multiple conductive portions arranged at intervals along the first linear trace, the avoidance through-hole disposed between two of the multiple conductive portions arranged along the first linear trace; soldering the supporting bases and the conductive lines so as to have each conductive line soldered to two of the conductive portions arranged along the first linear trace and one of the conductive lines spanning over the avoidance through-hole to form a spanning portion; stamp-cutting the spanning portion; disposing an LED bead on a surface of each of the supporting bases; and subjecting the LED bead and the conductive portions to a processing of soldering.

Abstract: A light-emitting diode (LED) lighting strip includes conductive lines and LED modules. The LED module includes LED lighting beads electrically connected with the conductive lines and arranged orderly on the conductive lines to form a strip. One of the conductive lines is a communication conductive line, and the remaining three are power-supplying conductive lines. On the communication conductive line, the LED lighting beads are connected in series. On the power-supplying conductive lines, the LED modules are connected in parallel, and the LED lighting beads of each LED module are connected in series. The LED lighting strip adopts an arrangement of serial-parallel connection for power and serial connection for signal to achieve various application solutions for different power supply voltages, and as a consequence, a serial communication protocol is adopted to control each of the LED lighting beads of the LED lighting strip, in order to realize diversification of lighting effect.

Abstract: A method for manufacturing an LED strip includes arranging conductive lines at intervals to extend along a first linear trace; arranging supporting bases at intervals along the first linear trace on the conductive lines, each supporting base including multiple conductive portions and an avoidance through-hole; each two multiple conductive portions arranged at intervals along the first linear trace, the avoidance through-hole disposed between two of the multiple conductive portions arranged along the first linear trace; soldering the supporting bases and the conductive lines so as to have each conductive line soldered to two of the conductive portions arranged along the first linear trace and one of the conductive lines spanning over the avoidance through-hole to form a spanning portion; stamp-cutting the spanning portion; disposing an LED bead on a surface of each of the supporting bases; and subjecting the LED bead and the conductive portions to a.

Abstract: An LED base module includes an LED lighting base and a supporting base. The LED lighting base includes an insulation housing and multiple conductive terminals fixed in the insulation housing. Each of the conductive terminals includes a chip fixing portion electrically connected to the chip assembly and a pin portion exposed outside the insulation housing. The supporting base includes multiple conductive portions and one or more avoidance through-holes. Each of the conductive portions includes a first terminal portion and a second terminal portion which are respectively exposed at two opposite surfaces of the supporting base. The first terminal portion is electrically connected to the pin portion, and the second terminal portion is electrically connected to a conductive line. The avoidance through-hole is provided for avoidance of stamp-cutting of one of the conductive lines.

Abstract: An LED lighting base includes an insulation housing and multiple conductive terminals fixed in the insulation housing by means of injection molding. The insulation housing is formed with a recessed compartment for receiving an LED chip assembly and an LED encapsulation resin disposed therein. Each of the conductive terminals includes a solder pad portion extending into the recessed compartment to electrically connect to the LED chip assembly and a pin portion exposed outside the insulation housing. Parts of the pin portions are grouped pairwise to form first pin pairs. One of the first pin pairs is arranged along a first trace and extends in a direction away from the insulation housing, remaining parts of the pin portions are arranged along a second trace. The first trace and the second trace intersect each other.