Abstract: The present invention provides a negative photosensitive resin composition comprising (A) a photocurable resin having a photosensitive group or groups crosslinkable by light irradiation, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more,

Abstract: The present invention provides a positive photosensitive resin composition comprising (A) a positive photosensitive resin, (B) a photoacid generator and (C) a photosensitizer which is a benzopyran condensed ring compound capable of increasing photosensitivity to visible light with a wavelength of 480 nm or more;

Abstract: A photosensitive resin composition characterized by comprising (A) a resin having at least one aprotic onium salt represented by the general formula: —COO−·W+  (1) and/or the general formula: (in each of the above general formulas, W+ represents wherein, Z represents a nitrogen atom or phosphorus atom; Y represents a sulfur atom; R1, R2, R3 and R4 each represents an organic group having 1 to 30 carbon atoms), (B) a compound having two or more vinylether groups in a molecule and (C) a compound which generates an acid upon irradiation with actinic energy rays.

Abstract: A pattern can be precisely formed by irradiating, with an active energy beam, a positive sensitive resin composition according to this invention comprising a base polymer, an ether-bond-containing olefinic unsaturated compound and an acid-generating agent, where the base polymer is a copolymer comprising the structural units represented by formulas (1) to (3): 1

Abstract: An organic solvent based photocurable resist composition containing a photopolymerizable polyurethane compound having a repeating unit represented by the following formula: B—[X]n[Y]m—B, where X is represented by the formula: and Y is represented by the formula: —OOCHN—A—NHCOO(R2)—, A is a structural unit derived from a polyisocyanate compound, B is same or different and a structural unit derived from a hydroxy compound having at least one photopolymerizable unsaturated group at molecular terminals respectively and optionally containing an ether linkage, R1 is a structural unit derived from a carboxyl group-containing polyol compound, R2 is a structural unit derived from a polyol compound, n is an integer of 1 to 10, m is an integer of 1 to 10, provided that one X and one Y are bonded to each other, or three or more of X and/or Y are bonded to each other.

Abstract: A liquid or a solid positive type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm, wherein an absorbancy of an unexposed film formed from this composition is 0.

Abstract: A positive type electrodeposition photoresist composition characterized by neutralizing by a basic compound and dissolving or dispersing in an aqueous medium a composition comprising (A) a polymer having 0.5-10 equivalents of carboxyl group(s) and optionally having more than 1 equivalent of hydroxyphenyl group(s) per kg polymer, or (A′) a polymer having 0.5-10 equivalents of carboxyl group(s) per kg polymer and (A″) a polymer having more than 1 equivalent of hydroxyphenyl group(s) per kg polymer; (B) a compound having at least two vinyl ether groups per molecule; (C) a compound which generates an acid when irradiated with a visible light; and (D) a sensitizing dye, and a process for pattern formation using such a composition are disclosed. Said composition has excellent thermal stability, high resolution and formability of fine image pattern and is useful to positive type photoresist, printing material etc.

Abstract: A negative type photosensitive resin composition is herein disclosed which is used under the irradiation circumstance of a safelight having a maximum wavelength within the range of 500 to 620 nm and a large spectral luminous efficiency; the composition being a liquid or a solid resin composition containing a photocurable resin, a photoreaction initiator and if necessary, a photosensitizing dye; an absorbancy of an unexposed film formed from this composition being 0.5 or less within the range of the maximum wavelength .+-.30 nm selected from the range of the maximum wavelength of the safelight. By the use of this negative type photosensitive resin composition, it is possible to form a resist pattern which is excellent in safe operativity, operational efficiency, the quality stability of products, and the like.

Abstract: An excellently thermostable visible light-sensitive composition comprising (A) a polymer having carboxyl group(s) or a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxyl group(s) and (A") a polymer having hydroxyphenyl group(s); (B) a compound having at least two vinyl ether groups per molecule, (C) a compound, which generates an acid when irradiated with a visible light; and (D) a sensitizing dye, and a process for pattern formation using such a composition are disclosed.

Abstract: A visible light curable resin composition containing a photocurable resin, a photoreaction initiator and a photosensitizer having the formula (1). The composition has a very high sensitivity to a general-purpose visible light laser, so that a high-speed scanning exposure is possible by the laser, and an extremely fine high resolution can be obtained. In addition, the composition can be used for coating or printing under safelight irradiating conditions and under bright circumstantial conditions without any thickening of the composition, and hence the composition can exert excellent noticeable effects in points of safe operativity, operational efficiency and the stability of products. Formula (1) is as follows: ##STR1## wherein rings X.sub.1 and X.sub.2 are each an optionally substituted pyrrole ring; Y is H, CN, optionally substituted alkyl, aralkyl, aryl, heteroaryl or alkenyl group; and Z.sub.1 and Z.sub.

Abstract: The present invention provides a visible laser-curable photosensitive composition wherein a photocuring resin having photosensitive group which is crosslinkable or polymerizable upon light exposure, is mixed with a photopolymerization inititor system consisting of a coumarin type pigment of particular structure and a titanocene compound. This composition has an unexpectedly high sensitivity to visible laser.

Abstract: The present invention provides a visible laser-curable resist composition which contains at least one radical-protecting compound selected from a phosphorous acid ester compound and an aromatic compound having N,N-dimethylamino group bonded to the carbon atom forming the aromatic ring and which is free from the hindrance of curing caused by deactivation of radical by oxygen and has excellent curability, and a process for formation of a resist pattern using the above composition.

Abstract: The present invention provides a visible laser-curable photosensitive composition wherein a photocuring resin having photosensitive group which is crosslinkable or polymerizable upon light exposure, is mixed with a photopolymerization inititor system consisting of a coumarin type pigment of particular structure and a titanocene compound. This composition has an unexpectedly high sensitivity to visible laser.

Abstract: A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxy-phenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound.

Abstract: A photosensitive composition which comprises, as essential components:(A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxy group(s) and (A") a polymer having hydroxyphenyl group(s),(B) a compound having at least two vinyl ether groups in the molecule, and(C) a compound which generates an acid when irradiated with am actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.

Abstract: The present invention provides a process for producing a high-density printed wiring board with plated throughholes, at high productivity and reliability by a direct drawing method.

Abstract: A positive type electrodeposition photoresist composition includes, as essential components: (A) 100 parts by weight of a polymer having carboxyl group(s) in an amount of 0.5 to 10 equivalents per kg of said polymer and optionally having hydroxyphenyl group(s) in an amount of at least 1 equivalent per kg of the polymer, or (A') a carboxyl group-containing polymer and (A") a hydroxyphenyl group-containing polymer; (B) 5 to 150 parts by weight of a compound having at least 2 vinyl ether groups in the molecule; and (C) 0.1 to 40 parts by weight per 100 parts by weight of the total of polymer (A), or the polymer (A') and the polymer (A"), and the vinyl ether group-containing compound (B), which generates an acid when irradiated with an actinic ray. The composition is dissolved or dispersed in an aqueous medium by neutralizing the carboxyl group(s) in the polymer (A) or (A') with a basic compound.

Abstract: A photosensitive composition which comprises, as essential components:(A) a polymer having carboxyl group(s) and hydroxyphenyl group(s), or (A') a polymer having carboxyl group(s) and (A") a polymer having hydroxyphenyl group(s),(B) a compound having at least two vinyl ether groups in the molecule, and(C) a compound which generates an acid when irradiated with an actinic ray, and which is useful as a positive type photoresist having high resolution and excellent formability of fine image pattern, a material for printing, etc.; and a process for pattern formation using said composition.