Abstract: Techniques for fabricating a semiconductor die having a curved surface can include placing a substantially flat semiconductor die in a recess surface of a concave mold such that corners or edges of the semiconductor die are unconstrained or are the only portions of the semiconductor die in physical contact with the concave mold. The semiconductor die can include through-die cut lines that can lead to substantially less tension in the semiconductor die as compared to the case where the semiconductor die does not include through-die cut lines. Accordingly, such through-die cut lines can allow for achieving relatively large curvatures.

Abstract: A negative stiffness structure for vibration isolation, shock mitigation, and/or signal processing includes a flexible tensile member and a curved compressive member. A first end of the tensile member is attached to a first structure. A first end of the curved compressive member is coupled to a first structure and a second end of the curved compressive member is coupled to a second end of the flexible tensile member. A length of the tensile member is greater than a length of the compressive member. A tip of the negative stiffness structure is configured to exhibit a negative stiffness mechanical response to a load applied to the tip. The negative stiffness mechanical response acts in a direction orthogonal to the length of the tensile member.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

Abstract: A curved image sensor chip has a first side and a second side opposite the first side. The second side includes light sensors configured to generate electrical signals in response to receiving light. A substrate is in contact with the first side of the curved image sensor chip and is configured to increase in volume so as to apply a bending force to form the curved image sensor chip.

Abstract: In at least one embodiment, a rotational spring is provided with adjustable stiffness and includes at least one beam arranged about an axis between an input tuning port and an output port, wherein the input tuning port is configured to change an effective bending length of at least one beam so as to change a shear stiffness with respect to the input tuning port and the output port.

Abstract: In an embodiment, a tunable stiffness mechanical filter is provided including an input coupler to a negative stiffness structure with a negative stiffness characteristic, and further including a tuner for tuning the negative stiffness structure. An output sensor is located along the negative stiffness structure. The filter may include an amplifier and/or a driver coupled between the output sensor and the negative stiffness structure.

Abstract: Described is a micro-lattice damping material and a method for repeatable energy absorption. The micro-lattice damping material is a cellular material formed of a three-dimensional interconnected network of hollow tubes. This material is operable to provide high damping, specifically acoustic, vibration or shock damping, by utilizing the energy absorption mechanism of hollow tube buckling, which is rendered repeatable by the micro-lattice architecture.

Abstract: In one embodiment, a vibration control apparatus is provided having a pair of face sheets with a core material in between. The core material comprising a positive stiffness material. A stack comprising a positive stiffness structure in series with a negative stiffness structure is located between the pair of face sheets, in parallel with the core material. The stack may be embedded in the core material. Various embodiments may include multiple stacks in parallel with each other. In some embodiments, the stack may include multiple positive stiffness structures in series with multiple negative stiffness structures. The multiple positive stiffness structures and negative stiffness structures may be interleaved.

Abstract: A thermomagnetic sensor, measurement system and a method of measuring temperature employ a thermomagnetic probe to measure temperature of a device using a thermomagnetic effect. The thermomagnetic sensor includes a plurality of coils configured to provide a mutual inductance measurement between a selected pair of coils of the plurality and the thermomagnetic probe between the selected pair. The thermomagnetic probe includes a ferromagnetic material having a temperature-dependent magnetic permeability determined from the mutual inductance measurement. A predetermined relationship between the temperature-dependent magnetic permeability and temperature in a range between a maximum magnetic permeability value and a Curie temperature provides a measurement of a temperature local to the thermomagnetic probe.

Abstract: A microstructured reconfigurable or morphing composite material with controlled anisotropic deformation properties. The composite material provides highly controlled deformation and stiffness properties. Microscopic three dimensional structures are included in the composite material to control its deformation kinematics and stiffness properties. The composite material has highly segregated in-plane and out-of-plane stiffness properties.

Abstract: A curved image sensor chip has a first side and a second side opposite the first side. The second side includes light sensors configured to generate electrical signals in response to receiving light. A substrate is in contact with the first side of the curved image sensor chip and is configured to increase in volume so as to apply a bending force to form the curved image sensor chip.

Abstract: A variable stiffness structure configured to support a variable load, the variable stiffness structure including a positive stiffness element coupled to the variable load, a negative stiffness element, a hydraulic system coupled to the positive and negative stiffness elements and configured to adjust a relative position of the positive and negative stiffness elements in response to a change in the variable load, while the variable stiffness structure supports the variable load.

Abstract: A new battery structure as disclosed allows convective flow of electrolyte through three-dimensional structured electrodes. Hierarchical battery structure design enables three-dimensional metal structures with fluid transport capabilities. Some variations provide a lithium-ion battery system with convective electrolyte flow, comprising: a positive electrode comprising a lithium-containing electrode material and a conductive network with hollow liquid-transport conduits; a negative electrode comprising a lithium-containing electrode material in the conductive network; a separator that electronically isolates the positive and negative electrodes; and a liquid electrolyte contained within the hollow liquid-transport conduits of the conductive network. The hollow liquid-transport conduits serve as structural members, and the walls of these conduits serve as current collectors. The conductive networks may include a micro-lattice structure with a cellular material formed of hollow tubes.

Abstract: A method of testing a shape memory alloy (SMA) actuated device includes cyclically operating the device. The method further includes determining a number of cycles in a functional life of the device based on observations of the device during the cyclical operation. The functional life is a range of consecutive cycles of operation of the device beginning with a first cycle during which the device performs within a specified limit. The functional life is immediately followed by a cycle during which the device performs outside of the specified limit. The method still further includes applying a progressive substitution sub-process to identify an opportunity to increase the number of cycles in the functional life of the device.

Abstract: In some examples, techniques and architectures for fabricating an image sensor chip having a curved surface include placing a substrate on a first surface of an image sensor chip, wherein the first surface of the image sensor chip is opposite a second surface of the image sensor chip, and wherein the second surface of the image sensor chip includes light sensors to generate electrical signals in response to receiving light. Fabricating also includes modifying a volume of the substrate so as to impart forces on the image sensor chip to produce a curved image sensor chip.

Abstract: A negative stiffness structure for vibration isolation, shock mitigation, and/or signal processing includes a flexible tensile member and a curved compressive member. A first end of the tensile member is attached to a first structure. A first end of the curved compressive member is coupled to a first structure and a second end of the curved compressive member is coupled to a second end of the flexible tensile member. A length of the tensile member is greater than a length of the compressive member. A tip of the negative stiffness structure is configured to exhibit a negative stiffness mechanical response to a load applied to the tip. The negative stiffness mechanical response acts in a direction orthogonal to the length of the tensile member.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface include placing a substantially flat photonic sensor chip on a recessed surface of a mold such that an active region of the photonic sensor chip at least partially covers a concave central region of the mold and an inactive region of the photonic sensor chip at least partially covers a convex peripheral region of the mold. The mold has a radially varying curvature and the recessed surface includes the concave central region and the convex peripheral region concentrically surrounding the concave central region. Pressure may be applied on the photonic sensor chip to press and bend the photonic sensor chip into the mold.

Abstract: Techniques for fabricating a semiconductor chip having a curved surface may include placing a substantially flat semiconductor chip in a recess surface of a concave mold such that corners or edges of the semiconductor chip are unconstrained or are the only portions of the semiconductor chip in physical contact with the concave mold; and bending the substantially flat semiconductor chip to form a concave shaped semiconductor chip by applying a force on the semiconductor chip toward the bottom of the recessed surface. The corners or edges of the semiconductor chip move or slide relative to the recess surface during the bending.

Abstract: Methods for making and curing resin-based adhesives are disclosed using encapsulated amine accelerators activated by providing ultrasonic energy.

Abstract: A thermomagnetic sensor includes a thermomagnetic probe that includes a ferromagnetic material having a temperature-dependent magnetic permeability characterized by a maximum magnetic permeability value at a temperature below a Curie temperature of the ferromagnetic material. The thermomagnetic sensor further includes an alternating magnetic field source to produce an alternating magnetic field in a vicinity of the thermomagnetic probe to facilitate a measurement of the temperature-dependent magnetic permeability as function of temperature remotely using a thermomagnetic effect. A predetermined relationship between the temperature-dependent magnetic permeability and temperature in a range between the maximum magnetic permeability value and the Curie temperature provides a measurement of a temperature local to the thermomagnetic probe.