Patents by Inventor Geon Kim

Geon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220114966
    Abstract: A display driving apparatus includes an internal reference voltage generation circuit configured to generate and provide an internal reference voltage; a sensing circuit configured to simultaneously sense pixel signals provided from pixels of a display panel and the internal reference voltage, and output a reference voltage sensing signal generated by sensing of the internal reference voltage and pixel sensing signals generated by sensing of the pixel signals; and an output circuit configured to sequentially select the reference voltage sensing signal and the pixel sensing signals, convert the pixel sensing signals into pixel data, convert the reference voltage sensing signal into reference data, and transmita the pixel data and the reference data.
    Type: Application
    Filed: October 8, 2021
    Publication date: April 14, 2022
    Applicant: Silicon Works Co., Ltd.
    Inventors: Seong Geon KIM, Young Bok KIM
  • Patent number: 11222599
    Abstract: A source driver and a display device including the same, capable of accurately sensing pixels characteristics and characteristics of the source driver. A source driver includes a switch circuit configured to transfer first pixel signals or reference signals; first sensing channels configured to sense and hold the first pixel signals or the reference signals transferred from the switch circuit; second sensing channels configured to sense and hold second pixel signals; and a selection circuit configured to output a sampling signal by selecting the first pixel signals of the first sensing channels and the second pixel signals of the second sensing channels, and thereafter, output the sampling signal by selecting the reference signals of the first sensing channels.
    Type: Grant
    Filed: February 26, 2021
    Date of Patent: January 11, 2022
    Inventors: Seong Geon Kim, Young Bok Kim, Won Kim
  • Patent number: 11217343
    Abstract: An electronic device includes a sensor, a processor, and a memory configured to store at least one instruction executed by the processor, wherein the processor is configured to collect activity information on a user related to the electronic device by using the sensor, the collecting of the activity information including creating an amount of activity of the user for a specific goal or an activity engagement level for the specific goal by using the activity information, adjust at least one of an output time point, an output cycle, the number of outputs, or the output contents of the activity guide information for the user to an activity guide parameter at least based on the amount of activity or the activity engagement level, and output the activity guide information created by using the adjusted activity guide parameter through an output device operatively connected to the processor.
    Type: Grant
    Filed: August 1, 2016
    Date of Patent: January 4, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: No Ah Lee, Dong Geon Kim, Kwang Yuel Ryu, Chung Ki Lee, David Rim, Min Hee Jang, Pravinsagar Prabakaran, Dong Hyun Roh, Jae Woong Chun
  • Publication number: 20210340591
    Abstract: According to an embodiment of the present disclosure, provided is an apparatus for providing microorganism information, including: a receiving unit configured to receive a plurality of images obtained by photographing in time series an outgoing wave emitted from a sample; a detecting unit configured to extract a feature of a change over time from the plurality of images obtained by photographing in time series; a learning unit configured to machine-learn classification criteria based on the extracted feature; and a determining unit configured to classify the type or concentration of a microorganism included in the sample based on the classification criteria, wherein each of the plurality of images includes speckle information generated by multiple scattering by the microorganism due to waves incident on the sample.
    Type: Application
    Filed: September 6, 2019
    Publication date: November 4, 2021
    Inventors: YongKeun PARK, KyeoReh LEE, SeungWoo SHIN, Geon KIM, Young Dug KIM
  • Patent number: 11145970
    Abstract: Various embodiments of the present disclosure provide an antenna device, which comprises: a radiator for receiving a power supply signal; multiple tuning units disposed adjacently to or on the radiator, wherein the tuning units are short-circuited to the radiator or adjacent tuning units are selectively short-circuited to each other. The antenna device as described above can be variously implemented according to embodiments.
    Type: Grant
    Filed: February 10, 2020
    Date of Patent: October 12, 2021
    Inventors: Kwang-Hyun Baek, Seung-Tae Ko, Yoon-Geon Kim, Won-Bin Hong
  • Patent number: 11145951
    Abstract: One example among various examples of the present invention provides an antenna device and an electronic device having the same, and the antenna device can comprise: a conductive film member including mesh grid areas composed of transparent conducting wires and electrodes; and a radiation pattern path unit formed between the mesh grid areas. In addition, the antenna device and the electronic device having the same, according to the present invention, can be implemented through other various examples.
    Type: Grant
    Filed: November 10, 2016
    Date of Patent: October 12, 2021
    Inventors: Seung-Tae Ko, Yoon-Geon Kim, Sang-Ho Lim, Won-Bin Hong
  • Publication number: 20210301804
    Abstract: According to an embodiment, a multi-cooling type cold trap according to the present disclosure includes a main body unit in which an inflow space having a material to be condensed flown therein is formed, a circulation unit which is disposed in the inflow space of the main body unit and circulates cooling water for condensing the material to be condensed, and a supply unit which supplies the cooling water to the circulation unit after lowering temperature of the cooling water in stages.
    Type: Application
    Filed: September 28, 2020
    Publication date: September 30, 2021
    Inventors: Jong Pyo Kim, Jong Geon Kim, Kwaungsin Park, Byoung Ho Jeon
  • Publication number: 20210272525
    Abstract: A source driver and a display device including the same, capable of accurately sensing pixels characteristics and characteristics of the source driver. A source driver includes a switch circuit configured to transfer first pixel signals or reference signals; first sensing channels configured to sense and hold the first pixel signals or the reference signals transferred from the switch circuit; second sensing channels configured to sense and hold second pixel signals; and a selection circuit configured to output a sampling signal by selecting the first pixel signals of the first sensing channels and the second pixel signals of the second sensing channels, and thereafter, output the sampling signal by selecting the reference signals of the first sensing channels.
    Type: Application
    Filed: February 26, 2021
    Publication date: September 2, 2021
    Applicant: Silicon Works Co., Ltd.
    Inventors: Seong Geon Kim, Young Bok Kim, Won Kim
  • Publication number: 20210225829
    Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.
    Type: Application
    Filed: April 7, 2021
    Publication date: July 22, 2021
    Inventors: JUNHO CHO, OHCHUL KWON, SEUNGJIN CHEON, TEA-GEON KIM, BUBRYONG LEE, JUNGLAE JUNG
  • Patent number: 11058736
    Abstract: Provided are a pharmaceutical composition for preventing or treating dry eye syndrome, including an extract of Terminalia chebula or a fraction thereof as an active ingredient, and a method of preventing or treating dry eye syndrome in an individual.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: July 13, 2021
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Jungyeob Ham, Jin-Chul Kim, Chang Geon Kim, Bong Geun Song, Taejung Kim, Pilju Choi, Seon-Jun Choi
  • Patent number: 10998303
    Abstract: A method of manufacturing a package-on-package device includes a bonding step carried out by a bonding apparatus including a pressing member and a light source that produces a laser beam. A bottom package including a lower substrate, lower solder balls alongside an edge of the lower substrate, and a lower chip on a center of the lower substrate is provided, the bottom package is bonded to an interposer substrate having upper solder balls aligned with the lower solder balls, and a top package having an upper substrate and an upper chip on the upper substrate is bonded to the interposer substrate. While the interposer substrate is disposed on the bottom package, the pressing member presses the interposer substrate against the bottom package, and the laser beam adheres the lower solder balls to the upper solder balls.
    Type: Grant
    Filed: October 22, 2018
    Date of Patent: May 4, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Junho Cho, Ohchul Kwon, Seungjin Cheon, Tea-Geon Kim, Bubryong Lee, Junglae Jung
  • Publication number: 20210091273
    Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev
    Type: Application
    Filed: November 17, 2020
    Publication date: March 25, 2021
    Applicant: LUMENS CO., LTD.
    Inventors: Seung Hyun OH, Jung Hyun PARK, Byeong Geon KIM, Pyoung Gug KIM, Sung Sik JO, Jae Yoon LIM, Ho Joong LIM
  • Patent number: 10910242
    Abstract: A temperature controller for semiconductor fabrication comprises a lower chiller connected with a lower chamber of a processing chamber and configured to adjust a temperature of the lower chamber, an electrostatic chuck disposed in the lower chamber and an upper chiller connected with an upper chamber of the processing chamber and configured to adjust a temperature of the upper chamber, a heater disposed in the upper chamber. In the temperature controller for semiconductor fabrication, the three-way valve may be installed on the cooling fluid supplying pipe, and the bypass pipe may be installed between the three-way valve and the cooling fluid collecting pipe to reduce the degree of bypass opening of the three-way valve.
    Type: Grant
    Filed: February 1, 2019
    Date of Patent: February 2, 2021
    Inventors: Yong Kyun Lim, Cheol Won Jang, Min Jin Han, Jae Geon Kim
  • Patent number: 10905015
    Abstract: The present disclosure relates to a laminated-type chip component, and more particularly, to a laminated-type chip component which can be more stably bonded by forming a groove filled with solder in a region in which an external electrode terminal of the laminated-type chip is soldered and thereby increasing the area of soldering.
    Type: Grant
    Filed: April 3, 2018
    Date of Patent: January 26, 2021
    Assignee: LG Chem, Ltd.
    Inventors: Ga Young Woo, Young Su Son, Byeong Geon Kim
  • Patent number: 10900883
    Abstract: A mold test apparatus includes a mold support plate having a top surface on which a mold is mounted, wherein the mold support plate includes a plurality of test suction pipes communicating with paths in the mold, vacuum pipes each having one end connected to one of the plurality of test suction pipes, a pump connected to the other end of the pipe, and at least one pressure sensor configured to measure a pressure of the vacuum pipe, wherein the paths communicate with adsorption holes provided in a top surface of the mold, and wherein the at least one pressure sensor includes a determining unit configured to determine whether the adsorption holes are clogged by using the measured pressure.
    Type: Grant
    Filed: July 30, 2018
    Date of Patent: January 26, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jung Lae Jung, Tea Geon Kim
  • Patent number: 10879432
    Abstract: Provided is a light emitting device package including: a light emitting device; a light transmitting plate body formed above the light emitting device and including a lower light transmitting plate, a plurality of side light transmitting plates formed on an upper surface of the lower light transmitting plate, an upper light transmitting plate corresponding to the upper surface of the lower light transmitting plate and formed on upper surfaces of the plurality of side light transmitting plates, and an empty portion formed inside; a wavelength converting unit including a first wavelength converting layer formed on a lower surface of the lower light transmitting plate and a second wavelength converting layer formed in the empty portion and covering the upper surface of the lower light transmitting plate; and an adhesive layer formed between the first wavelength converting layer and the light emitting device, in which the adhesive layer is formed on at least one side and an upper surface of the light emitting dev
    Type: Grant
    Filed: February 11, 2019
    Date of Patent: December 29, 2020
    Assignee: LUMENS CO., LTD.
    Inventors: Seung Hyun Oh, Jung Hyun Park, Byeong Geon Kim, Pyoung Gug Kim, Sung Sik Jo, Jae Yoon Lim, Ho Joong Lim
  • Publication number: 20200395806
    Abstract: An embodiment relates to a stator and a motor including the stator, the stator comprising: a stator core; a coil wound around the stator core; and an insulator disposed between the stator core and the coil, wherein the insulator includes: a body around which the coil is wound; a first guide protruding from the inside of the body; a second guide protruding on the outside of the body a first protrusion protruding outward from the lateral surface of the first guide; and a second protrusion protruding inward from the inner surface of the second guide, and an insulating member radially disposed between the first guide and the second guide is bent in a circumferential direction by means of the first protrusion and the second protrusion. Therefore, the motor can inhibit the movement and separation of insulating paper.
    Type: Application
    Filed: December 13, 2018
    Publication date: December 17, 2020
    Inventors: Bong Geon KIM, Young Gu KANG, Tae Ho KIM, Ja Young SEO, Jin Su PYEON
  • Patent number: 10838266
    Abstract: Display devices are provided. In a display device, a plurality of pixels are arranged with an interval therebetween, an antenna radiator is configured with one or more conductors that are arranged between the plurality of pixels, and partition walls are disposed between the plurality of pixels. Each of the one or more conductors is disposed on one surface of the corresponding partition wall.
    Type: Grant
    Filed: May 28, 2019
    Date of Patent: November 17, 2020
    Assignee: Samsung Electronics Co., Ltd
    Inventors: Sang-Ho Lim, Seung-Tae Ko, Yoon-Geon Kim, Won-Bin Hong
  • Patent number: 10833046
    Abstract: A stack tool comprises a lower jig having a plurality of package seating regions configured to seat a semiconductor package, an intermediate jig configured to be seated on top of the lower jig, and having a package support hole into which the semiconductor package is configured to be inserted, the intermediate jig having a shape corresponding to the plurality of package seating regions, and an upper dumbbell. The upper dumbbell includes a dumbbell main body on top of the intermediate jig, an upper recess stepped downward from an upper surface of the dumbbell main body on only a region corresponding to an upper surface of the semiconductor package, and a protruding support configured to protrude downward from a lower surface of the upper recess and configured to be brought into contact with an upper surface of the semiconductor package.
    Type: Grant
    Filed: August 8, 2018
    Date of Patent: November 10, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Tea Geon Kim, Jung Lae Jung, Bub Ryong Lee
  • Patent number: 10748855
    Abstract: A method of fabricating a semiconductor package using a laminating device is provided. The method includes placing a substrate on a substrate stand; providing a pressurizing unit which is expandable and includes a convex surface facing an upper surface of the substrate stand, on the substrate stand; injecting air into the pressurizing unit using a plate which is connected to the pressurizing unit; and supplying a film by a film supply unit which supplies the film between the substrate stand and the pressurizing unit, wherein the pressurizing unit attaches the film onto the substrate, while expanding.
    Type: Grant
    Filed: February 20, 2018
    Date of Patent: August 18, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tea-Geon Kim, Jung Lae Jung