Abstract: A mobile signal unit is responsive to a mobile operating unit yet sufficiently compact and lightweight for unobtrusive connection to an item of clothing, a purse, and/or a backpack. It has a siren powered by gas or electricity. It has a wireless first interface, through which the siren can be remotely activated and/or deactivated by the mobile operating unit. The siren can be activated manually by an activation command that matches an activation code stored in a memory unit of the signal unit and/or the operating unit. The siren is automatically activated after the wireless connection to the operating unit if a connection signal strength of the operating unit falls below a threshold and/or the wireless connection to the operating unit is interrupted.

Abstract: A mobile signal unit is responsive to a mobile operating unit yet sufficiently compact and lightweight for unobtrusive connection to an item of clothing, a purse, and/or a backpack. It has a siren powered by gas or electricity. It has a wireless first interface, through which the siren can be remotely activated and/or deactivated by the mobile operating unit. The siren can be activated manually by an activation command that matches an activation code stored in a memory unit of the signal unit and/or the operating unit. The siren is automatically activated after the wireless connection to the operating unit if a connection signal strength of the operating unit falls below a threshold and/or the wireless connection to the operating unit is interrupted.

Abstract: The invention relates to an I/O device (2) with an energy unit (8) for mobile operations of the I/O device (2), an input device (11), an output device (12), and an interface (16) which is designed as a transceiver unit and by means of which the I/O device (2) can be wirelessly coupled to at least one external data processing unit (3, 4) in order to exchange data.

Abstract: A method of producing a temperature measuring sensor including an insulating substrate having a top surface and a bottom surface, the top surface including a first area and a second area, and a first contact and a second contact being formed in the first area, the above contacts having a structured measuring film located therebetween: creating a conductive connection between the first contact on the top surface of the insulating substrate and the bottom surface of the insulating substrate, and a first conductive layer as a first terminal area of the temperature measuring sensor on the bottom surface such that the first conductive layer is electrically connected to the conductive connection, as well as a second conductive layer on the second area of the top surface as a second terminal area of the temperature measuring sensor such that the second conductive layer is in contact with the second contact.

Abstract: A method of producing a temperature measuring sensor including an insulating substrate having a top surface and a bottom surface, the top surface including a first area and a second area, and a first contact and a second contact being formed in the first area, the above contacts having a structured measuring film located therebetween: creating a conductive connection between the first contact on the top surface of the insulating substrate and the bottom surface of the insulating substrate, and a first conductive layer as a first terminal area of the temperature measuring sensor on the bottom surface such that the first conductive layer is electrically connected to the conductive connection, as well as a second conductive layer on the second area of the top surface as a second terminal area of the temperature measuring sensor such that the second conductive layer is in contact with the second contact.

Abstract: A method of producing a device initially includes providing a component. The component includes a first surface, a second surface opposite the first surface, a first contact formed on the first surface, a second contact formed on the second surface, and an electrical circuit disposed between the first contact and the second contact. The component further includes a conductive connection between the first contact on the first surface of the component and the second surface of the component. A first conductive layer serving as the pad of the device is formed on the second surface of the component such that same is in contact with the conductive connection.

Abstract: In a method for producing a temperature sensor, there is first provided a substrate, on the first surface of which there is arranged a sensor structure having a first end and a second end, wherein the sensor structure substantially completely covers the first surface of the substrate. Then an insulation layer is at least partially formed on this sensor structure on which a first and a second contact area are then formed. The first and second contact areas are formed such that they are conductively connected to the first end and the second end of the sensor structure, respectively.

Abstract: In a method for manufacturing a device, at first a plurality of components each having at least a first terminal region are provided. Furthermore, a support with a first surface, in which a plurality of recesses are formed, is provided. The components provided are inserted into the recesses such that the first terminal region of each component faces the first surface of the support. Conductive material is applied on the first surface of the support such that the conductive material is in contact with the first terminal region of each component. Finally, the support is diced to obtain the individual devices.

Abstract: In a method for producing a temperature sensor, there is first provided a substrate, on the first surface of which there is arranged a sensor structure having a first end and a second end, wherein the sensor structure substantially completely covers the first surface of the substrate. Then an insulation layer is at least partially formed on this sensor structure on which a first and a second contact area are then formed. The first and second contact areas are formed such that they are conductively connected to the first end and the second end of the sensor structure, respectively.

Abstract: A method of producing a device initially includes providing a component. The component includes a first surface, a second surface opposite the first surface, a first contact formed on the first surface, a second contact formed on the second surface, and an electrical circuit disposed between the first contact and the second contact. The component further includes a conductive connection between the first contact on the first surface of the component and the second surface of the component. A first conductive layer serving as the pad of the device is formed on the second surface of the component such that same is in contact with the conductive connection.

Abstract: In a method for manufacturing a device, at first a plurality of components each having at least a first terminal region are provided. Furthermore, a support with a first surface, in which a plurality of recesses are formed, is provided. The components provided are inserted into the recesses such that the first terminal region of each component faces the first surface of the support. Conductive material is applied on the first surface of the support such that the conductive material is in contact with the first terminal region of each component. Finally, the support is diced to obtain the individual devices.

Abstract: In a method and an apparatus for releasing a vehicle for a user, first, a unique body-related feature of the user is detected at the vehicle. The detected feature and an identification associated to the vehicle are transmitted by the vehicle to a management unit disposed remote from the vehicle, where the detected signal is compared to a feature stored for the vehicle. If the detected feature and the stored feature match, the vehicle is released for usage.

Abstract: A temperature measurement sensing device formed of a substrate, a resistor layer, an oxide layer and a protective layer is produced by forming the structured resistor layer on a surface of the substrate, oxidizing the resistor layer formed and then applying the protective layer to at least a part of the resistor layer.

Abstract: A high-temperature detector comprises a temperature sensor comprising a high-temperature measuring element, a first connection and a second connection which are made of a high-temperature-stable material and which are connected to the measuring element. The high-temperature sensor is arranged in an elongate housing adjacent a first end thereof, and the housing comprises a first and a second conductor track produced from a high-temperature-stable material, the conductor tracks being connected to the first and second connections and extending in the direction of a second end of the housing. Furthermore, a connection point is provided, which is used for tapping a signal produced by the high-temperature sensor and which is arranged adjacent the second end of the housing. In order to produce such a device, the sensor is first provided and subsequently arranged in an opening of a first substrate adjacent a first end of the substrate.

Abstract: In a method of contacting a temperature measurement sensing device having connecting wires, after applying the connecting wires, they are oxidized before they are fixed by means of a fixing glaze.

Abstract: A high-temperature detector comprises a temperature sensor comprising a high-temperature measuring element, a first connection and a second connection which are made of a high-temperature-stable material and which are connected to the measuring element. The high-temperature sensor is arranged in an elongate housing adjacent a first end thereof, and the housing comprises a first and a second conductor track produced from a high-temperature-stable material, the conductor tracks being connected to the first and second connections and extending in the direction of a second end of the housing. Furthermore, a connection point is provided, which is used for tapping a signal produced by the high-temperature sensor and which is arranged adjacent the second end of the housing. In order to produce such a device, the sensor is first provided and subsequently arranged in an opening of a first substrate adjacent a first end of the substrate.