Abstract: Described is an optical waveguide having a main direction of extension, at least one radiation entrance face, and a radiation exit face that extends longitudinally to the main direction of extension, wherein at least one radiation entrance face extends transversely to the main direction of extension, and the at least one radiation entrance face has two convexly curved subregions that are connected to each other by a kink-like or concavely shaped indentation. An optical device formed with such a waveguide is also described, as is a display device.

Abstract: At least two semiconductor components emit electromagnetic radiation in different wavelength ranges. The superimposition of these electromagnetic radiations of all semiconductor components has at least one fraction in the visible wavelength range. At least one of the semiconductor components has a luminescence conversion element in the beam path.

Abstract: An illumination unit comprising a luminescence diode chip mounted on a chip carrier and comprising an optical waveguide is specified. The optical waveguide is joined together from at least two separate parts, wherein the luminescence diode chip is encapsulated by one of the parts of the optical waveguide. A method for producing a luminescence diode chip of this type and also an LCD display comprising an illumination unit of this type are furthermore specified.

Abstract: The invention describes two methods of fabricating semiconductor components in which a luminescence conversion element is applied directly to the semiconductor body (1). In the first method, a suspension (4) containing a bonding agent and at least one luminescent material (5) is applied to the semiconductor body (1) in layers. In the next step the solvent escapes, leaving only the luminescent material (5) with the bonding agent on the semiconductor body. In the second method, the semiconductor body (1) is provided with a layer (6) of bonding agent to which the luminescent material (5) is applied directly.

Abstract: A package body (1) with an upper side (2), with an underside (22), opposite from the upper side (2), and with a side surface, which connects the upper side (2) and the underside (22) and is provided as a mounting surface (19), the package body (1) having a plurality of layers (8) which contain a ceramic material, and a main direction of extent of the layers (23, 24, 25) running obliquely in relation to the mounting surface (19). Furthermore, a method for producing a package body (1) is provided.

Abstract: An optoelectronic component (1) having a semiconductor arrangement (4) which emits and/or receives electromagnetic radiation and which is arranged on a carrier (22) which is thermally conductively connected to a heat sink (12). External electrical connections (9) are connected to the semiconductor arrangement (4), where the external electrical connections (9) are arranged in electrically insulated fashion on the heat sink (12) at a distance from the carrier (22). This results in an optimized component in terms of the dissipation of heat loss and the radiation of light and also in terms of making electrical contact and the packing density in modules.

Abstract: A housing for an optoelectronic component is disclosed, having a plastic base body that has a front side with an assembly region for at least one radiation emitting or radiation detecting body, wherein the plastic base body is formed from at least one first plastic component and at least one second plastic component. The second plastic component is disposed on the front side of the plastic base body, and is formed from a material that differs from the first plastic component in at least one optical property, and forms an optically functional region of the plastic base body. Further, a method for producing a housing for an optoelectronic component and a light emitting diode component is disclosed.

Abstract: A headlight having a multitude of headlight elements, which each have at least one semiconductor chip which emits electromagnetic radiation; a primary optics element, which reduces the divergence of the light which is incident through the light input; and at least one headlight element output, which emits a part of the headlight light from the headlight element. At least some of the headlight element outputs are arranged in at least two groups in such a way that the arrangement of at least one of the groups and/or at least overall arrangement of headlight element outputs of multiple groups corresponds essentially to a desired emission characteristic of the headlight, in that, in particular, it has a shape which corresponds essentially to the cross-sectional shape of a desired headlight beam, wherein the semiconductor chips which belong to the headlight element outputs of one group can each be operated independently of other semiconductor chips.

Abstract: An apparatus having at least one fixing element is specified, the fixing dement being provided for fixing the apparatus to a housing body of an optoelectronic device and the apparatus being designed as a mount for a separate optical element.

Abstract: An illumination device is specified which has a light source (1) suitable for coupling divergent electromagnetic radiation (6) into an optical waveguide (2), the electromagnetic radiation (6) being guided in the optical waveguide (2) on the basis of total reflection the optical waveguide (2) being suitable for changing a main radiating direction (17) of the electromagnetic radiation (6), and the optical waveguide (2) being formed in one piece. Light-emitting diodes are preferably used as the light source (1). The illumination device is particularly well suited to the backlighting of displays.

Abstract: Disclosed is a leadframe lot at least one electronic component, composing at least two electrical lead elements, each of which comprises at least one electrical lead tab and at least one retention tab. Provided between the at least one retention tab and the lead element is a score defining parallel offset between the retention tab and the adjacent region of the lead element. An additional parallel offset is defined between the lead element and the electrical lead tab, such that the retention tab and the electrical lead tab are located in a common plane. The score enables the retention tab to be removed easily without the need for a disadvantageous punched gap between the lead element and the retention tab.

Abstract: A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.

Abstract: In an LED array comprising a plurality of radiation-emitting semiconductor chips each of which has a radiation outcoupling surface, the radiation emitted by the semiconductor chips being outcoupled substantially through said radiation outcoupling surface , and a cover body that is transparent to the emitted radiation, the transparent cover body comprises, on a surface facing toward the radiation outcoupling surfaces of the semiconductor chips, one or more conductive traces made of a conductive material that is transparent to the emitted radiation, and the semiconductor chips each comprise, on the radiation outcoupling surface, at least one electrical contact that is connected to the conductive trace or to at least one of the plurality of conductive traces. At least one luminescence conversion material is contained in the transparent cover body and/or applied in a layer to the cover body and/or the semiconductor chips.

Abstract: An optoelectronic component having a basic housing or frame (12) and at least one semiconductor chip (20), specifically a radiation-emitting or -receiving semiconductor chip, in a cavity (18) of the basic housing. In order to increase the efficiency of the optoelectronic component (10), reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound (28) filled at least partly into the cavity (18) is provided, the material and the quantity of the filling compound (28) being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas (30) of the filling compound serve as reflector.

Abstract: A housing is specified for an electronic component having at least two connecting parts (4a, 4b), which are partially in contact with the housing. The conductivity of at least subareas of the housing are set in a defined manner and current paths through the housing are formed between the connecting parts. The housing thus has a defined resistance (2), which is connected in parallel with an electronic component (1), and provides ESD protection for the component (1).

Abstract: Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical connections, which are electrically conductively connected to at least two electrical contacts of the semiconductor chip, and an encapsulation material.

Abstract: An optoelectronic component having a basic housing or frame and at least one semiconductor chip, specifically a radiation-emitting or-receiving semiconductor chip, in a cavity of the basic housing. In order to increase the efficiency of the optoelectronic component, reflectors are provided in the cavity in the region around the semiconductor chip. These reflectors are formed by virtue of the fact that a filling compound filled at least partly into the cavity is provided, the material and the quantity of the filling compound being chosen in such a way that the filling compound, on account of the adhesion force between the filling compound and the basic housing, assumes a form which widens essentially conically from bottom to top in the cavity, and the conical inner areas of the filling compound serve as reflector.

Abstract: An optoelectronic component emitting electromagnetic radiation, comprising a housing body which has a cavity, the cavity being fashioned trenchlike and in the cavity a plurality of semiconductor chips being arranged in a linear arrangement. Two neighboring semiconductor chips have a distance from one another which is less than or equal to one-and-a-half lateral edge lengths of the semiconductor chips and greater than or equal to 0 ?m. In addition, an illumination module comprising such a component is disclosed.

Abstract: A light-emitting diode arrangement is disclosed, comprising at least one light-emitting diode (LED) chip with a radiation decoupling surface through which a large portion of the electromagnetic radiation generated in the LED chip exits in a main direction of emission; a housing laterally surrounding the LED chip; and a reflective optic disposed after the radiation decoupling surface in the main direction of emission. The LED arrangement is particularly well suited for use in devices such as camera-equipped cell phones, digital cameras or video cameras.

Abstract: A light source, such as for a projection system, having a plurality of semiconductor chips and at least two different, electromagnetic-radiation-emitting chip types with different emission spectra, each semiconductor chip having a chip coupling-out area through which radiation is coupled out. Furthermore, the light source has a plurality of primary optical elements, each semiconductor chip being assigned a primary optical element, which in each case has a light input and a light output and reduces the divergence of at least part of the radiation emitted by the semiconductor chip during the operation thereof. The semiconductor chips with the primary optical elements are arranged in at least two groups that are spatially separate from one another, with the result that the groups emit separate light cones during operation of the semiconductor chips. The separate light cones of the groups are superposed by means of a secondary optical arrangement to form a common light cone.