Patents by Inventor Georg Busch

Georg Busch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7995351
    Abstract: The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled.
    Type: Grant
    Filed: July 5, 2006
    Date of Patent: August 9, 2011
    Assignee: Gigaset Communications GmbH
    Inventors: Georg Busch, Volker Detering, Ludger Hinken, Ralf Lorenz
  • Publication number: 20100190387
    Abstract: The invention relates to a contact system comprising a spring and an accordingly associated printed circuit board surface, with which the spring is in contact. The printed circuit board surface to be contacted is a carbon printed circuit board surface. Increased contact resistance between the spring and the carbon printed circuit board surface, which is associated with the contact system according to the invention, is furthermore compensated for by electric and/or electronic means. The spring that is used is provided with a spring force adapted to the carbon printed circuit surface.
    Type: Application
    Filed: November 22, 2007
    Publication date: July 29, 2010
    Applicant: Gigaset Communications GmbH
    Inventors: Georg Busch, Ralf Hünting, Christoph Fels
  • Publication number: 20090052146
    Abstract: The invention relates to a printed board which comprises an inlay and on whose one face electrical components are provided and on whose other face at least one single cooling element for cooling the components is mounted. A component to be cooled, the inlay and the cooling element are aligned with each other. The components are SMD components of, e.g., a high-power output stage circuit with heat emissions of up to 10 to 15 watt. In order to cool the structure, the heat produced in a heating zone between the pins of a component to be cooled is guided to the inlay which is dimensioned in such a manner that it extends farther than below the pins of the component to be cooled.
    Type: Application
    Filed: July 5, 2006
    Publication date: February 26, 2009
    Inventors: Georg Busch, Volker Detering, Ludger Hinken, Ralf Lorenz
  • Publication number: 20070243422
    Abstract: A method is proposed for producing printed circuit board structures with possible realization options including adhesiveless, flexible and with the smallest via holes with diameters for example of the order of magnitude between 1 and 5 ?m. The method is based on a supporting means for the circuit board structure which is still without any copper cladding. The passage holes are shot through or lasered especially for the smallest via holes with the aid of heavy ions or a precision laser in the supporting material provided on its own in this way. The surface of the supporting means is not clad with copper until after this process. When this is done the electrical via holes are contacted simultaneously. If the supporting means is for example flexible polyimide and not yet preprocessed for copper cladding, the surface of the supporting means can be roughened at the same time as the holes are made by controlling the intensity of heavy ion acceleration or the precision laser appropriately.
    Type: Application
    Filed: June 21, 2005
    Publication date: October 18, 2007
    Applicant: SIEMENS AKTIENGESELLSCHAFT
    Inventor: Georg Busch
  • Publication number: 20070220745
    Abstract: A method for producing printed circuit board sets capable of being made, among other things, without adhesive, in flexible manner and with very small transverse connections with diameters of the order of 1 to 3 ?m. The method uses, as starting material for the printed circuit board set, a support element free of any copper layer. The through holes, in particular for the smallest transverse connection, are made by spraying heavy ions into the obtained material. Only subsequently the surface of the support element are coated with a copper film. The electrical transverse connections are thus simultaneously produced. If the support element is, for example, flexible polyimide and it has not been pretreated for the copper plating, it is possible to use the heavy ion process not only to produce the holes, but also to make the surface rough. The desired printed circuit board set is then completed according to the usual methods.
    Type: Application
    Filed: March 2, 2005
    Publication date: September 27, 2007
    Applicant: Siemens Aktiengesellschaft
    Inventor: Georg Busch
  • Publication number: 20070209202
    Abstract: A method for producing printed circuit boards and/or corresponding constructs that includes points where through-connections are created. The method vitiates the need for a very complex brushing process by using low cost lacquer variants. Moreover, the disclosed methods allow additional strip conductors or appropriate layers to be guided directly across the through connections rather than just to the through connections.
    Type: Application
    Filed: March 2, 2005
    Publication date: September 13, 2007
    Applicant: Siemens Aktiengesellschaft
    Inventor: Georg Busch
  • Patent number: 7251498
    Abstract: A reproduction-receiver part is provided for use in a headset system, wherein parts are provided for wireless reception of audio signals from a mobile radio telephone network and a loudspeaker for acoustic reproduction of the signals.
    Type: Grant
    Filed: February 6, 2002
    Date of Patent: July 31, 2007
    Assignee: Siemens Aktiengesellschaft
    Inventor: Georg Busch
  • Patent number: 7045003
    Abstract: The invention relates to a process for producing a pregelatinized starch having good gel-formation properties, in which a) a suspension of starch and water is prepared, b) the suspension prepared in a) is applied to a hot roller of a roller dryer, and c) the pregelatinized starch obtained by process step b) s isolated. According to the invention a potato starch having an amylose content of at least 30% by weight is used.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: May 16, 2006
    Assignee: Bayer Cropscience GmbH
    Inventors: Rudolf Klingler, Karl-Georg Busch
  • Publication number: 20050218239
    Abstract: A mobile communication terminal with a processor control is disclosed, wherein the terminal includes at least one independent humidity sensor controlled by the processor to detect humidity for the purpose of reducing or preventing corrosion in the mobile communication terminal. Upon detection of humidity, either a complete or partial shut down of the mobile communication terminal is effected. In particular, during a partial shut down, those components necessary for detection of humidity and for reactivating the mobile communication terminal remain active. Additionally, functional components are protected from corrosion by reducing voltage differentials when humidity is detected.
    Type: Application
    Filed: January 2, 2003
    Publication date: October 6, 2005
    Inventor: Georg Busch
  • Patent number: 6844022
    Abstract: The present invention is in the technical field of physicochemical starch modification and relates to a process for producing thermochemically modified starch, the thin-boiling starches which are obtainable by the inventive process and thermally reversible gel-forming dextrins, and to their use, in particular as gelatin substitute or fat substitute.
    Type: Grant
    Filed: February 14, 2001
    Date of Patent: January 18, 2005
    Assignee: Bayer CropScience GmbH
    Inventors: Rudolf Klingler, Karl-Georg Busch
  • Publication number: 20050005928
    Abstract: The invention relates to a process for producing a pregelatinized starch having good gel-formation properties, in which a) a suspension of starch and water is prepared, b) the suspension prepared in a) is applied to a hot roller of a roller dryer, and c) the pregelatinized starch obtained by process step b) s isolated. According to the invention a potato starch having an amylose content of at least 30% by weight is used. The invention also comprises the novel pregelatinized starch thus produced and its use for producing sliceable gels, foods, in particular instant puddings, feeds, adhesives and colorings The invention also relates to compositions which comprise such a pregelatinized starch, in particular a dry mix for producing instant puddings.
    Type: Application
    Filed: December 19, 2002
    Publication date: January 13, 2005
    Inventors: Rudolf Klingler, Karl-Georg Busch
  • Publication number: 20050003789
    Abstract: The invention relates to a shield for high-frequency transmitter/receiver systems of electronic devices, especially of devices for wireless telecommunication. In order to reduce the space requirements of such a high-frequency transmitter/receiver system (2?) on a circuit support element (1?) of an electronic device, a first partial circuit (20?) of the high-frequency transmitter/receiver system (2?) and a second partial circuit (21?) of the high-frequency transmitter/receiver system (2?) are disposed in a single shield chamber (32) in a substantially separate especially locally/partially separate manner.
    Type: Application
    Filed: March 21, 2002
    Publication date: January 6, 2005
    Inventors: Georg Busch, Volker Detering
  • Publication number: 20040147279
    Abstract: The invention relates to a reproduction-receiver part (WE) for use in a headset system, in which means are provided for wireless reception of audio signals from a mobile radio telephone network and a loudspeaker for acoustic reproduction of said signals. The invention also relates to a receiver-transmitter part (AS) for use in a radiotelephone system in which means are exclusively provided for wireless transmission of audio signals in a mobile radiotelephone network and a microphone for the acoustic reception thereof.
    Type: Application
    Filed: March 22, 2004
    Publication date: July 29, 2004
    Inventor: Georg Busch
  • Publication number: 20030141104
    Abstract: The aim of the invention is to improve the modular assembly technique used for assembling electronic printed-circuit boards (FBG1, FBG2) for electronic devices in order to incorporate the printed-circuit boards in electronic devices with electronic printed-circuit boards of the type mentioned above more flexibly in terms of the printed-circuit board material, in accordance with the respective field of application, size and weight requirements and manufacturing costs of the devices. To this end, the electronic devices are modularly assembled in terms of the printed-circuit board construction, with at least two printed-circuit boards (FBG1, FBG2) consisting of different materials with different temperature and length-related expansion coefficients.
    Type: Application
    Filed: December 3, 2002
    Publication date: July 31, 2003
    Inventors: Heinrich Bruckmann, Georg Busch, Ludger Hinken
  • Patent number: 6589585
    Abstract: A process for producing glass noodles using genetically modified starch, preferably from potatoes, glass noodles produced from genetically modified starch, preferably potato starch, and the use of genetically modified starch for producing glass noodles and demoldable gels.
    Type: Grant
    Filed: March 15, 2000
    Date of Patent: July 8, 2003
    Assignee: Bayer CropScience GmbH
    Inventors: Rudolf Klingler, Karl-Georg Busch
  • Patent number: 6370034
    Abstract: A printed circuit board for electrical devices having RF components, particularly for mobile radio telecommunication devices, wherein to increase the packing density of electronic circuits and conductor-track structures on such circuit board, a “micro via” coating is initially applied to one or both sides of a printed circuit board assembly. This “micro via” coating then has, in particular, RF circuits and RF conductor-track structures applied to at least part of its surface. Finally, the RF circuits and RF conductor-track structures are protected in relation to an RF ground coating of the printed circuit board assembly by barrier areas arranged in an assembly coating, situated directly below the “micro via” coating, of the printed circuit board assembly against interfering influences which impair the RF parameters, to be set in each case, of the RF circuits and RF conductor-track structures.
    Type: Grant
    Filed: September 13, 1999
    Date of Patent: April 9, 2002
    Assignee: Siemens Aktiengesellschaft
    Inventor: Georg Busch
  • Publication number: 20010026827
    Abstract: The present invention is in the technical field of physicochemical starch modification and relates to a process for producing thermochemically modified starch, the thin-boiling starches which are obtainable by the inventive process and thermally reversible gel-forming dextrins, and to their use, in particular as gelatin substitute or fat substitute.
    Type: Application
    Filed: February 14, 2001
    Publication date: October 4, 2001
    Inventors: Rudolf Klingler, Karl-Georg Busch
  • Patent number: 5788156
    Abstract: A device for spraying a liquid has a rotating surface, preferably one with an edge apron which is angled obliquely toward the outside, from whose possibly serrated outer spraying edge the liquid is flung out. The rotating surface is partially covered by a housing which is provided with an opening which leaves a partial circumference free. The device has a reservoir and a flow path for collecting retained drops, in whose circulation a pump is provided which is embodied to reunite collected liquid with the inflowing liquid. A conveying surface of a pump, preferably a friction pump, is disposed coaxially with the axis of rotation of the rotating surface.
    Type: Grant
    Filed: February 16, 1996
    Date of Patent: August 4, 1998
    Assignee: Mantis VLV-Spruhgerate GmbH
    Inventors: Siegfried Dopp, Georg Busch
  • Patent number: 4424327
    Abstract: A rapid setting .alpha.-cyanoacrylate based adhesive composition having an improved polymerization catalyst therein.
    Type: Grant
    Filed: March 10, 1981
    Date of Patent: January 3, 1984
    Assignee: Terason GmbH
    Inventors: Karl Reich, Heinz Tomaschek, Georg Busch