Abstract: A stacked semiconductor device is provided, which includes a first die, a second die and a heat dissipating layer. The first die has a pre-determined size. The second die is bonded to the first die using a dielectric material, wherein the second die is smaller than the first die. The heat dissipating layer is surrounding the second die, wherein the heat dissipating layer has an outer dimension that is equal to the size of the first die.

Abstract: A stacked semiconductor device is provided, which includes a first die, a second die and a heat dissipating layer. The first die has a pre-determined size. The second die is bonded to the first die using a dielectric material, wherein the second die is smaller than the first die. The heat dissipating layer is surrounding the second die, wherein the heat dissipating layer has an outer dimension that is equal to the size of the first die.

Abstract: A reworkable conductive adhesive composition, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix.

Abstract: A method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: A reworkable conductive adhesive composition, and method of making such, comprising an epoxy based conductive adhesive containing conductive metal filler particles dispersed in a solvent-free hybrid epoxy polymer matrix. In an additional embodiment an improved method of removing cured conductive polymer adhesives, disclosed here as thermal interface materials, from electronic components for reclamation or recovery of usable parts of module assemblies, particularly high cost semiconductor devices, heat sinks and other module components.

Abstract: A composite electronic and/or optical substrate including polymeric and ceramic material wherein the composite substrate has a dielectric constant less than 4 and a coefficient of thermal expansion of 8 to 14 ppm/°C. at 100° C. The composite substrate may be either ceramic-filled polymeric material or polymer-filled ceramic material.

Abstract: A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip.

Abstract: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electro

Abstract: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electro

Abstract: A method of forming interconnects on an electronic device that can be bonded to another electronic device at a low processing temperature can be carried out by depositing a first interconnect material on the electronic device forming protrusions and then depositing a second interconnect material to at least partially cover the protrusions, wherein the second interconnect material has a lower flow temperature than the first interconnect material. The method is carried out by flowing a molten solder into a mold having microcavities to fill the cavities and then allowed to solidify. The mold is then aligned with a silicon wafer containing chips deposited with high melting temperatures solder bumps such that each microcavity of the mold is aligned with each high melting temperature solder bump on the chip.

Abstract: A plurality of multilayer glass-ceramic substrates are arranged in coplanar relationship in a tile pattern within a support platform. The glass-ceramic substrates and the support platform are both formed of materials having thermal expansion characteristics substantially equal to that of a wafer which is supported by the coplanarly aligned substrates during test and burn-in of the wafer. The present invention effectively solves the problem of providing a single large support member for wafer test and burn-in, which heretofore have been limited in mechanical properties and power capability.

Abstract: A method for forming solder bumps on an electronic structure including the steps of first providing a mold made by a sheet of a mold material having a thickness greater than that of the solder bumps to be formed, the mold material has sufficient optical transparency so as to allow the inspection of a solder material subsequently filled into the mold cavities that are formed in the mold material, and a coefficient of thermal expansion that is substantially similar to the substrate which the mold will be mated to, forming a multiplicity of mold cavities in the sheet of mold material, filling the multiplicity of mold cavities with a solder material, cooling the mold to a temperature that is sufficient to solidify the solder material in the multiplicity of mold cavities, positioning the mold intimately with the electronic structure such that the cavities facing the structure, and heating the mold and the structure together to a temperature sufficiently high such that the solder material transfers onto the electro

Abstract: A multi-strand nylon rope having improved abrasion resistance is comprised of a plurality of strands. Each strand is comprised of a plurality of yarns wherein each yarn is formed of a predetermined number of filaments. The filaments of each yarn are twisted together to form a yarn of a predetermined size, the twist direction being opposite that of the final ply yarn direction. For a right lay rope a sufficient number of filaments are twisted together in the left or "S" direction to produce a yarn of a predetermined size. Three or more yarns prepared in this manner are then plied or twisted together in the opposite or right direction. The cover for each strand is formed of alternate yarns of standard (i.e. round) and oblong filaments, respectively, the oblong filaments having a modification ratio of three, forming a rope having increased abrasion resistance, a hand and feel that is not stiff or unmanageable and which resists strand-to-strand wet abrasion.

Abstract: A unique rope for use in commercial fishing comprising floating and sinking portions. The sinking portion has blended yarns made up of a blend of first and second non-metallic synthetic filaments in proportions to yield a sinking rope portion having a specific gravity greater than one. The sinking rope portion comprises strands having yarns of substantially the same diameter. The floating portion of the rope is formed by replacing selected ones of the blended yarns in each strand with yarns formed of a material having a specific gravity of less than one. The replacement yarns and the blended yarns are of the same diameter to enhance the integrity and strength of the rope.

Abstract: A multi-strand nylon rope having improved abrasion resistance comprised of a plurality of strands. Each strand is comprised of a plurality of yarns wherein each yarn is formed of a predetermined number of filaments. The filaments of each yarn are twisted together to form a yarn of a predetermined size, the twist direction being opposite that of the final ply yarn direction. For a right lay rope a sufficient number of filaments are twisted together in the left or "S" direction to produce a yarn of a predetermined size. Three or more yarns prepared in this manner are then plied or twisted together in the opposite or right direction. The cover for each strand is formed of alternate yarns of standard and oblong filaments, respectively, the oblong filaments having a modification ratio of three, forming a rope having increased abrasion resistance, a hand and feel that is not stiff or unmanageable and which resists strand-to-strand wet abrasion.

Abstract: A unique fishing rope comprising floating and sinking portions. The sinking portion blended yarns made up of a blend of first and second non-metallic synthetic filaments in proportions to yield a sinking rope portion having a specific gravity greater than one. The sinking rope portion comprises strands having yarns of substantially the same diameter. The floating portion of the rope is formed by replacing selected ones of the blended yarns in each strand with yarns formed of a material having a specific gravity of less than one. The replacement yarns and the blended yarns are of the same diameter to enhance the integrity and strength of the rope.