Patents by Inventor George A. Linke

George A. Linke has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4688326
    Abstract: A nonmagnetic holder is made having a plurality of precisely located parallel grooves. Each groove has a reference lateral surface provided therein. Individual magnetic transducers are inserted in each groove with a lateral surface abutting the reference lateral surface within that groove. The transducers are preferably made by well known batch fabrication techiques. A locating element, such as a leaf spring, is provided in each groove to urge the transducer core against the reference surface and to firmly hold the transducer in a desired position during alignment and assembly. The modular structure allows inspecting the individual transducers for mechanical or electrical damages and their replacement, if necessary, prior to the final assembly. The multichannel head is then integrally joined together, for example by bonding. The rejection rate of the resulting modular multichannel head is significantly reduced.
    Type: Grant
    Filed: August 26, 1986
    Date of Patent: August 25, 1987
    Assignee: Ampex Corporation
    Inventor: George A. Linke
  • Patent number: 4649450
    Abstract: A nonmagnetic holder is made having a plurality of precisely located parallel grooves. Each groove has a reference lateral surface provided therein. Individual magnetic transducers are inserted in each groove with a lateral surface abutting the reference lateral surface within that groove. The transducers are preferably made by well known batch fabrication techniques. A locating element, such as a leaf spring, is provided in each groove to urge the transducer core against the reference surface and to firmly hold the transducer in a desired position during alignment and assembly. The modular structure allows inspecting the individual transducers for mechanical or electrical damages and their replacement, if necessary, prior to the final assembly. The multichannel head is then integrally joined together, for example by bonding. The rejection rate of the resulting modular multichannel head is significantly reduced.
    Type: Grant
    Filed: December 12, 1984
    Date of Patent: March 10, 1987
    Assignee: Ampex Corporation
    Inventor: George A. Linke